(19)
(11) EP 1 397 828 A1

(12)

(43) Date of publication:
17.03.2004 Bulletin 2004/12

(21) Application number: 02700668.3

(22) Date of filing: 21.02.2002
(51) International Patent Classification (IPC)7H01L 21/306
(86) International application number:
PCT/JP2002/001545
(87) International publication number:
WO 2002/103771 (27.12.2002 Gazette 2002/52)
(84) Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

(30) Priority: 18.06.2001 JP 2001183822
31.08.2001 JP 2001264368
28.12.2001 JP 2001401436

(71) Applicant: Ebara Corporation
Tokyo 144-8510 (JP)

(72) Inventors:
  • KOBATA, Itsukic/o Ebara Corporation
    Tokyo 144-8510 (JP)
  • SHIRAKASHI, Mitsuhikoc/o Ebara Corporation
    Tokyo 144-8510 (JP)
  • KUMEKAWA, Masayukic/o Ebara Corporation
    Tokyo 144-8510 (JP)
  • SAITO, Takayukic/o Ebara Research Co., Ltd.
    Fujisawa-shi, Kanagawa 251-8502 (JP)
  • TOMA, Yasushic/o Ebara Research Co., Ltd.
    Fujisawa-shi, Kanagawa 251-8502 (JP)
  • SUZUKI, Tsukuruc/o Ebara Research Co., Ltd.
    Fujisawa-shi, Kanagawa 251-8502 (JP)
  • YAMADA, Kaoruc/o Ebara Research Co., Ltd.
    Fujisawa-shi, Kanagawa 251-8502 (JP)
  • MAKITA, Yujic/o Ebara Research Co., Ltd.
    Fujisawa-shi, Kanagawa 251-8502 (JP)

(74) Representative: Wagner & Geyer 
Gewürzmühlstrasse 5
D-80538 München
D-80538 München (DE)

   


(54) ELECTROLYTIC PROCESSING DEVICE AND SUBSTRATE PROCESSING APPARATUS