(19)
(11) EP 1 399 957 A2

(12)

(88) Date of publication A3:
30.10.2003

(43) Date of publication:
24.03.2004 Bulletin 2004/13

(21) Application number: 02746596.2

(22) Date of filing: 20.06.2002
(51) International Patent Classification (IPC)7: H01L 21/3213, H01L 21/3063, H01L 21/762
(86) International application number:
PCT/US2002/019496
(87) International publication number:
WO 2003/001582 (03.01.2003 Gazette 2003/01)
(84) Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
Designated Extension States:
AL LT LV MK RO SI

(30) Priority: 21.06.2001 US 887767
21.06.2001 US 888084
21.06.2001 US 888002

(71) Applicant: Micron Technology, Inc.
Boise, ID 83706-9632 (US)

(72) Inventors:
  • LEE, Whonchee
    Boise, ID 83709 (US)
  • MEIKLE, Scott, G.
    Boise, ID 83712 (US)
  • MOORE, Scott, E.
    Meridian, ID 83642 (US)

(74) Representative: Klunker . Schmitt-Nilson . Hirsch 
Winzererstrasse 106
80797 München
80797 München (DE)

   


(54) MICROELECTRONIC SUBSTRATE HAVING CONDUCTIVE MATERIAL WITH BLUNT CORNERED APERTURES, AND ASSOCIATED METHODS FOR REMOVING CONDUCTIVE MATERIAL