(19)
(11) EP 1 417 722 A2

(12)

(88) Date of publication A3:
11.03.2004

(43) Date of publication:
12.05.2004 Bulletin 2004/20

(21) Application number: 02752483.4

(22) Date of filing: 22.07.2002
(51) International Patent Classification (IPC)7: H01L 33/00
(86) International application number:
PCT/US2002/023120
(87) International publication number:
WO 2003/010833 (06.02.2003 Gazette 2003/06)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR
Designated Extension States:
AL LT LV MK RO SI

(30) Priority: 23.07.2001 US 307311 P
27.06.2002 US 185252

(71) Applicants:
  • Cree Inc.
    Goleta, CA 93117 (US)
  • Cree Microwave, Inc.
    Sunnyvale, CA 94089 (US)

(72) Inventors:
  • SLATER, David
    Raleigh, NC 27617 (US)
  • BHARATHAN, Jayesh
    Santa Barbara, CA 93111 (US)
  • EDMOND, John
    Cary, NC 27511 (US)
  • RAFFETTO, Mark
    Santa Barbara, CA 93101 (US)
  • MOHAMMED, Anwar
    San Jose, CA 95148 (US)
  • NEGLEY, Gerry
    Hillsborough, NC 28278 (US)
  • ANDREWS, Peter
    Greensboro, NC 27455 (US)

(74) Representative: Hornung, Jan, Dr. et al
Baron & Warren,19 South End,Kensington
London W8 5BU
London W8 5BU (GB)

   


(54) FLIP CHIP BONDING OF LIGHT EMITTING DEVICES AND LIGHT EMITTING DEVICES SUITABLE FOR FLIP-CHIP BONDING