[0001] The present invention relates to flooring components, and in particular to flooring
components having vibration damping and acoustic insulating properties.
[0002] It is known to refurbish an existing floor laid on a plurality of timber joists with
a view to improving the sound insulation properties of the floor. Typically, this
has been achieved by overlaying a new floor deck on top of existing joists, there
being a plurality of foam strips positioned between the new floor deck and the joists.
[0003] Such foam strips comprise layers of open and closed cell foam. The open-cell foam
layer acts to attenuate impact sounds such as those caused by shock loads on the floor
and the closed-cell foam layer acts to attenuate airborne sounds. Other known strips
are formed in a single layer where the open and closed cell foam particles are mixed
together in a random fashion.
[0004] Although the aforementioned foam strips successfully attenuate both impact and airborne
sounds, they only do so at the contact point of the joists and floor deck. Therefore,
the absence of any insulating material in the spaces between adjacent joists continues
to allow the transmission and/or reverberation of unwanted sound.
[0005] According to a first aspect of the present invention there is provided a flooring
component comprising an upper deck layer, a lower resilient layer and a layer of foam
material interposed between the upper and lower layers.
[0006] Preferably, the layer of foam material is adhered to the lower surface of the upper
deck layer and the upper surface of the lower resilient layer respectively.
[0007] Preferably, the upper deck layer is made of particle chipboard material.
[0008] Preferably, the lower layer of resilient material is made from rubber.
[0009] Preferably, the layer of foam material is reconstituted foam comprising a mixture
of open and closed cell foam particles.
[0010] Preferably, the upper deck layer has a thickness in the range 22mm to 38mm.
[0011] Preferably, the lower resilient layer has a thickness in the range 3mm to 7mm.
[0012] Preferably, the foam layer has a thickness in the range 8mm to 15mm.
[0013] Preferably, the edges of the upper deck layers are provided with tongue and groove
joints.
[0014] According to a second aspect of the present invention there is provided a flooring
assembly comprising a plurality of the flooring components as described in the previous
paragraph, wherein the flooring components are laid in side-by-side abutting relationship
such that the edges of the upper deck layers are joined at their co-operating tongue
and groove joints.
[0015] Preferably, the upper deck layers are bonded together at their tongue and groove
joints without any mechanical fixings.
[0016] Preferably, the floor components are laid directly onto a floor supporting structure.
[0017] Embodiments of the present invention will now be described, by way of example only,
with reference to the accompanying drawings, in which:
Fig. 1 is a cross-sectional view of a floor component;
Fig. 2 is a perspective view of a floor component; and
Fig. 3 is a cross-sectional view of a flooring construction in use.
[0018] Figs. 1 and 2 show a floor component 10 having an upper floor deck layer 12 of chipboard
material of thickness 22mm to 38mm, a lower layer 14 of rubber material of thickness
3mm to 7mm and, interposed between the upper and lower layers 12, 14, a layer 16 of
reconstituted foam material of thickness 8mm to 15mm. The layer of reconstituted foam
material 16 is bonded by adhesive to both the upper deck layer 12 and the lower resilient
layer 14 of rubber respectively. The upper floor deck layer 12 is provided with tongue
and groove joints 18 respectively on its opposite edges.
[0019] The layer 16 of reconstituted foam material comprises a mixture of open and closed
cell foam particles and is bonded to the lower surface of the upper floor deck layer
and the upper surface of the lower layer of rubber respectively.
[0020] In one example, the lower layer 16 of rubber material has a density of 600 kg m
-3 and has a thickness of 4.75 mm. It will be appreciated however, that the properties
(i.e. material, thickness and density) of the resilient lower layer will be chosen
depending upon the nature of the anticipated loads and acoustic noise levels to be
attenuated.
[0021] Fig. 3 shows a floor assembly 20 employing the flooring components shown in Figs.
1 and 2. The floor assembly 20 is laid directly onto floor joists 22 which may also
support a suspended ceiling 24.
[0022] In use, floor components 10 are supported on a plurality of floor joists 22 in side-by-side
abutting relationship such that they are joined at their corresponding tongue and
groove joints 18. The floor components 10 are bonded with adhesive at their tongue
and groove joints 18 and are free from any mechanical fixings.
[0023] Vibrations and impact loads to the floor deck 12 and the consequent acoustic noise
produced by those vibrations and shocks are attenuated by both the rubber and foam
layers 14, 16. The function of the foam layer 16 is to attenuate both impact and airborne
noise whilst the lower layer of rubber 14 also provides a degree of resilience for
impact loads and acts to spread such loads over the more fragile foam layer 16.
[0024] Advantageously, the lower rubber layer 14 and the foam layer 16 both extend over
substantially the entire surface area of the lower surface of the upper deck layer
12. Accordingly, a continuous barrier to unwanted sound transmission and/or reverberation
is provided.
[0025] It will be appreciated by those skilled in the art that the flooring components 10
and flooring assembly 20 of the present invention constitute an improvement over the
prior art. For example, the fact that the layers of sound insulating material 14,
16 extend over substantially the entire surface area of the upper deck layer 12 and
not only between the upper deck layer 12 and the supporting floor joists 22 means
that overall sound insulation is improved.
[0026] Various modifications and improvements may be made without departing from the scope
of the present invention. For example, the thickness, density and choice of materials
for the various layers 12, 14 , 16 of the floor components 10 may be selected depending
upon the nature and extent of the anticipated loads and the nature and extent of acoustic
noise levels to be attenuated.
1. A flooring component (10) comprising an upper deck layer (12), a lower resilient layer
(14) and a layer of foam material (16) interposed between the upper and lower layers
(12, 14).
2. A flooring component (10) according to claim 1, wherein the layer of foam material
(16) is adhered to the lower surface of the upper deck layer (12) and the upper surface
of the lower resilient layer (14) respectively.
3. A flooring component (10) according to claim 1 or 2 wherein, the upper deck layer
(12) is made of particle chipboard material.
4. A flooring component (10) according to any preceding claim, wherein the lower layer
of resilient material (14) is made of rubber.
5. A flooring component (10) according to any preceding claim, wherein the layer of foam
material (16) is reconstituted foam comprising a mixture of open and closed cell foam
particles.
6. A flooring component (10) according to any preceding claim, wherein the upper deck
layer (12) has a thickness in the range 22mm to 38mm.
7. A flooring component (10) according to any preceding claim, wherein the lower resilient
layer (14) has a thickness in the range 3mm to 7mm.
8. A flooring component (10) according to any preceding claim, wherein the foam layer
(16) has a thickness in the range 8mm to 15mm.
9. A flooring component (10) according to any preceding claim, wherein the edges of the
upper deck layers (12) are provided with tongue and groove joints (18).
10. A flooring assembly (20) comprising a plurality of the flooring components (10) according
to claim 9, wherein the flooring components (10) are laid in side-by-side abutting
relationship such that the edges of the upper deck layers (12) are joined at their
co-operating tongue and groove joints (18).
11. A flooring assembly (20) according to claim 10, wherein the upper deck layers (12)
are bonded together at their tongue and groove joints (18) without any mechanical
fixings.
12. A flooring assembly (20) according to claim 10 or 11, wherein the floor components
(10) are laid directly onto a floor supporting structure (22).