| (19) |
 |
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(11) |
EP 1 426 979 A8 |
| (12) |
CORRECTED EUROPEAN PATENT APPLICATION |
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published in accordance with Art. 158(3) EPC |
| (48) |
Corrigendum issued on: |
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15.09.2004 Bulletin 2004/38 |
| (43) |
Date of publication: |
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09.06.2004 Bulletin 2004/24 |
| (22) |
Date of filing: 17.09.2002 |
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| (86) |
International application number: |
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PCT/JP2002/009490 |
| (87) |
International publication number: |
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WO 2003/025955 (27.03.2003 Gazette 2003/13) |
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| (84) |
Designated Contracting States: |
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AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR |
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Designated Extension States: |
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AL LT LV MK RO SI |
| (30) |
Priority: |
14.09.2001 JP 2001280005
23.10.2001 JP 2001325311
18.06.2002 JP 2002177358
|
| (71) |
Applicant: SEKISUI CHEMICAL CO., LTD. |
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Osaka-shi, Osaka 530-8565 (JP) |
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| (72) |
Inventors: |
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- WAKIYA, Takeshi, Sekisui Chemical Co., Ltd.
Mishima-gun, Osaka 618-8589 (JP)
- YONEDA, Yoshikazu, Sekisui Chemical Co., Ltd.
Koka-gun, Shiga 528-8585 (JP)
- UEBA, Masako, Sekisui Chemical Co., Ltd.
Mishima-gun, Osaka 618-8589 (JP)
|
| (74) |
Representative: Hubert, Philippe |
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Cabinet Beau de Loménie 158, avenue de l'Université
75340 Paris Cédex 07
75340 Paris Cédex 07 (FR) |
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| |
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| (54) |
COATED CONDUCTIVE PARTICLE, COATED CONDUCTIVE PARTICLE MANUFACTURING METHOD, ANISOTROPIC
CONDUCTIVE MATERIAL, AND CONDUCTIVE CONNECTION STRUCTURE |
(57) An objective of the invention is to provide a coated conductive particle having superior
connection reliability, a method for manufacturing such coated conductive particle,
an anisotropic conductive material and a conductive-connection structure.
A coated conductive particle comprising a particle having a surface made of conductive
metal and an insulating particles to coat the surface of the particle having the surface
made of conductive metal there with, wherein the insulating particles are chemically
bonded to the particle having the surface made of conductive metal via a functional
group (A) having a bonding property to the conductive metal so that a single coating
layer is formed.