(19)
(11) EP 1 427 792 A1

(12)

(43) Date of publication:
16.06.2004 Bulletin 2004/25

(21) Application number: 02756746.0

(22) Date of filing: 29.07.2002
(51) International Patent Classification (IPC)7C09K 5/06
(86) International application number:
PCT/US2002/023960
(87) International publication number:
WO 2003/027207 (03.04.2003 Gazette 2003/14)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR
Designated Extension States:
AL LT LV MK RO SI

(30) Priority: 21.09.2001 JP 2001289591

(71) Applicant: 3M Innovative Properties Company
St. Paul, MN 55133-3427 (US)

(72) Inventors:
  • YAMAZAKI, Yoshinao
    Yokohama-city, Kanagawa 227-0034 (JP)
  • OKADA, Mitsuhiko
    Chofu-city, Tokyo 182-0024 (JP)
  • TANZAWA, Tomoya
    Sagamihara-shi, Kanagawa 229-1133 (JP)

(74) Representative: VOSSIUS & PARTNER 
Siebertstrasse 4
81675 München
81675 München (DE)

   


(54) THERMOCONDUCTIVE COMPOSITION