(19)
(11) EP 1 433 202 A2

(12)

(88) Date of publication A3:
12.09.2003

(43) Date of publication:
30.06.2004 Bulletin 2004/27

(21) Application number: 02757668.5

(22) Date of filing: 09.09.2002
(51) International Patent Classification (IPC)7H01L 21/768
(86) International application number:
PCT/US2002/028715
(87) International publication number:
WO 2003/028090 (03.04.2003 Gazette 2003/14)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR

(30) Priority: 26.09.2001 US 965370
26.09.2001 US 965373
26.09.2001 US 965369

(71) Applicant: Applied Materials Inc.
Santa Clara, CA 95054 (US)

(72) Inventors:
  • CHUNG, Hua
    San Jose, CA 95129 (US)
  • CHEN, Ling
    Sunnyvale, CA 94087 (US)
  • YU, Jick
    San Jose, CA 95129 (US)
  • CHANG, Mei
    Saratoga, CA 95070 (US)

(74) Representative: Setna, Rohan P. et al
Boult Wade TennantVerulam Gardens70 Gray's Inn Road
London WC1X 8BT
London WC1X 8BT (GB)

   


(54) INTEGRATION OF BARRIER LAYER AND SEED LAYER