(19)
(11) EP 1 436 443 A1

(12)

(43) Date of publication:
14.07.2004 Bulletin 2004/29

(21) Application number: 02731204.0

(22) Date of filing: 27.03.2002
(51) International Patent Classification (IPC)7C23C 16/00
(86) International application number:
PCT/US2002/009999
(87) International publication number:
WO 2002/081771 (17.10.2002 Gazette 2002/42)
(84) Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
Designated Extension States:
AL LT LV MK RO SI

(30) Priority: 05.04.2001 US 281628 P
09.07.2001 US 902080
03.10.2001 US 970867
24.10.2001 US 999499
24.10.2001 US 999532
24.10.2001 US 999636
24.10.2001 US 382
24.10.2001 US 825
24.10.2001 US 4488
19.12.2001 US 27592

(71) Applicant: Angstron Systems, Inc.
Santa Clara, CA 95054 (US)

(72) Inventors:
  • CHIANG, Tony, P.
    Santa Clara, CA 95050 (US)
  • LEESER, Karl, F.
    San Jose, CA 95132 (US)
  • BROWN, Jeffrey, A.
    San Francisco, CA 94114 (US)
  • BABCOKE, Jason, E.
    Menlo Park, CA 94025 (US)

(74) Representative: Tollett, Ian et al
Williams Powell,Morley House,26-30 Holborn Viaduct
London EC1A 2BP
London EC1A 2BP (GB)

   


(54) ATOMIC LAYER DEPOSITION SYSTEM AND METHOD