METHOD AND APPARATUS FOR SPUTTER DEPOSITION OF EPILAYERS WITH HIGH DEPOSITION RATE - Patent 1438443

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EP 1 438 443 A1

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(43)	Date of publication:
	21.07.2004 Bulletin 2004/30

(21)	Application number: 02799663.6

(22)	Date of filing: 27.09.2002

(51)	International Patent Classification (IPC)⁷: C23C 14/34

(86)	International application number:
	PCT/US2002/030866

(87)	International publication number:
	WO 2003/027351 (03.04.2003 Gazette 2003/14)

(84)	Designated Contracting States:
	AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR
	Designated Extension States:
	AL LT LV MK RO SI

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Priority:

27.09.2001 US 325331 P

(71)	Applicants:
	E.I. DU PONT DE NEMOURS AND COMPANY Wilmington,Delaware 19898 (US) Chistyakov, Roman Andover, MA 17080 (US)

(72)	Inventor:
	CHISTYAKOV, Roman Andover, MA 17080 (US)

(74)	Representative: Hughes, Andrea Michelle et al
	Frank B. Dehn & Co.,European Patent Attorneys,179 Queen Victoria Street London EC4V 4EL London EC4V 4EL (GB)

(54)	METHOD AND APPARATUS FOR SPUTTER DEPOSITION OF EPILAYERS WITH HIGH DEPOSITION RATE