(19)
(11) EP 1 439 244 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
09.02.2005 Bulletin 2005/06

(43) Date of publication A2:
21.07.2004 Bulletin 2004/30

(21) Application number: 04447010.2

(22) Date of filing: 14.01.2004
(51) International Patent Classification (IPC)7: C23C 18/31, C23C 18/48, C23C 18/40
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
Designated Extension States:
AL LT LV MK

(30) Priority: 14.01.2003 EP 03447008

(71) Applicant: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM VZW
3001 Leuven (BE)

(72) Inventors:
  • Siau, Sam
    9300 Aalst (BE)
  • Vanfleteren, Jan
    9050 Gent-Brugge (BE)

(74) Representative: Bird, William Edward et al
Bird Goen & Co., Klein Dalenstraat 42A
3020 Winksele
3020 Winksele (BE)

   


(54) Method for plating and plating solution thereof


(57) A solution is described, in particular for electroless deposition of a metal on a polyimide substrate. The solution from which the metal is deposited, comprises a source of metal ions; a reducing agent; an additive to adjust the pH of said bath to a predetermined value; and an aromatic sulfonic acid. The solution is used in a method for electroless deposition of a metal onto a substrate wherein the substrate preferably comprises polyimide exposed at a surface thereof. The method of the present invention provides a metal layer which shows good adhesion towards the polyimide substrate and which is very smooth and does not need any additional smoothening treatment.






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