(19)
(11) EP 1 444 726 A1

(12)

(43) Date of publication:
11.08.2004 Bulletin 2004/33

(21) Application number: 02782196.6

(22) Date of filing: 22.10.2002
(51) International Patent Classification (IPC)7H01L 21/302
(86) International application number:
PCT/US2002/033721
(87) International publication number:
WO 2003/036704 (01.05.2003 Gazette 2003/18)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR
Designated Extension States:
AL LT LV MK RO SI

(30) Priority: 22.10.2001 US 342695 P
08.10.2002 CN 02123170
22.10.2002 US 278035

(71) Applicant: Unaxis USA Inc.
St. Petersburg, FL 33716 (US)

(72) Inventors:
  • JOHNSON, David, J.
    Palm Harbor, FL 34683 (US)
  • ONISHI, Shinzo
    Palm Harbor, FL 34685 (US)
  • CONSTANTINE, Christopher
    Safety Harbor, FL 34695 (US)

(74) Representative: Hedley, Nicholas James Matthew et al
Kilburn & Strode20 Red Lion Street
London WC1R 4PJ
London WC1R 4PJ (GB)

   


(54) METHOD AND APPARATUS FOR THE ETCHING OF PHOTOMASK SUBSTRATES USING PULSED PLASMA