(19)
(11) EP 1 446 514 A1

(12)

(43) Date of publication:
18.08.2004 Bulletin 2004/34

(21) Application number: 02789648.9

(22) Date of filing: 13.11.2002
(51) International Patent Classification (IPC)7: C25B 9/00, C25D 7/12, C25D 17/00, C25F 3/30, C25F 7/00
(86) International application number:
PCT/US2002/036567
(87) International publication number:
WO 2003/042433 (22.05.2003 Gazette 2003/21)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR
Designated Extension States:
AL LT LV MK RO SI

(30) Priority: 13.11.2001 US 332417 P
14.04.2002 US 372567 P

(71) Applicant: ACM Research, Inc.
Fremont, CA 94538 (US)

(72) Inventors:
  • WANG, Hui
    Fremont, CA 94539 (US)
  • YIH, Peihaur
    Boonton New Jersey 07005 (US)
  • AFNAN, Muhammed
    Fremont, CA 94539 (US)
  • NUCH, Voha
    San Jose, CA 95121 (US)
  • GUTMAN, Felix
    San Jose, CA 95136 (US)

(74) Representative: Vleck, Jan Montagu 
Reddie & Grose,16 Theobalds Road
London WC1X 8PL
London WC1X 8PL (GB)

   


(54) ELECTROPOLISHING ASSEMBLY AND METHODS FOR ELECTROPOLISHING CONDUCTIVE LAYERS