(19)
(11) EP 1 447 712 A8

(12) CORRECTED EUROPEAN PATENT APPLICATION
published in accordance with Art. 158(3) EPC

(48) Corrigendum issued on:
06.10.2004 Bulletin 2004/41

(43) Date of publication:
18.08.2004 Bulletin 2004/34

(21) Application number: 02779925.3

(22) Date of filing: 28.10.2002
(51) International Patent Classification (IPC)7G03F 7/004, C04B 35/628, C08F 220/28, C08F 290/06, H05K 3/46
(86) International application number:
PCT/JP2002/011149
(87) International publication number:
WO 2003/038524 (08.05.2003 Gazette 2003/19)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR

(30) Priority: 01.11.2001 JP 2001336151
24.04.2002 JP 2002121938

(71) Applicant: TORAY INDUSTRIES, INC.
Tokyo 103-8666 (JP)

(72) Inventors:
  • YAMASHIKI, Tomoya
    Otsu-shi, Shiga 520-2141 (JP)
  • UEOKA, Takenori
    Otsu-shi, Shiga 520-0843 (JP)
  • SHIMBA, Mitsuyo
    Otsu-shi, Shiga 520-0842 (JP)

(74) Representative: Coleiro, Raymond et al
Mewburn Ellis LLP York House 23 Kingsway
London WC2B 6HP
London WC2B 6HP (GB)

   


(54) METHODS OF PRODUCING PHOTOSENSITIVE CERAMIC COMPOSITION AND MULTI-LAYER SUBSTRATE USING IT


(57) The present invention relates to a photosensitive ceramic composite and a method for manufacturing a multilayer substrate using the composite. The photosensitive ceramic composite and manufacturing method of the present invention are applicable to circuit members and components for ceramic multilayer substrates for high-frequency wireless communication.
The photosensitive ceramic composite contains inorganic particles and a photosensitive organic component. The inorganic particles have at least surface sections containing an inorganic material having a refractive index less than that of inner sections of the inorganic particles.