(19) |
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(11) |
EP 1 447 712 A8 |
(12) |
CORRECTED EUROPEAN PATENT APPLICATION |
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published in accordance with Art. 158(3) EPC |
(48) |
Corrigendum issued on: |
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06.10.2004 Bulletin 2004/41 |
(43) |
Date of publication: |
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18.08.2004 Bulletin 2004/34 |
(22) |
Date of filing: 28.10.2002 |
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(86) |
International application number: |
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PCT/JP2002/011149 |
(87) |
International publication number: |
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WO 2003/038524 (08.05.2003 Gazette 2003/19) |
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(84) |
Designated Contracting States: |
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AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR |
(30) |
Priority: |
01.11.2001 JP 2001336151 24.04.2002 JP 2002121938
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(71) |
Applicant: TORAY INDUSTRIES, INC. |
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Tokyo 103-8666 (JP) |
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(72) |
Inventors: |
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- YAMASHIKI, Tomoya
Otsu-shi, Shiga 520-2141 (JP)
- UEOKA, Takenori
Otsu-shi, Shiga 520-0843 (JP)
- SHIMBA, Mitsuyo
Otsu-shi, Shiga 520-0842 (JP)
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(74) |
Representative: Coleiro, Raymond et al |
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Mewburn Ellis LLP York House 23 Kingsway London WC2B 6HP London WC2B 6HP (GB) |
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(54) |
METHODS OF PRODUCING PHOTOSENSITIVE CERAMIC COMPOSITION AND MULTI-LAYER SUBSTRATE
USING IT |
(57) The present invention relates to a photosensitive ceramic composite and a method
for manufacturing a multilayer substrate using the composite. The photosensitive ceramic
composite and manufacturing method of the present invention are applicable to circuit
members and components for ceramic multilayer substrates for high-frequency wireless
communication.
The photosensitive ceramic composite contains inorganic particles and a photosensitive
organic component. The inorganic particles have at least surface sections containing
an inorganic material having a refractive index less than that of inner sections of
the inorganic particles.