ATBECHDEDKESFRGBGRITLILUNLSEMCPTIESI....FI....CY..TRBGCZEE....SK................*XDIM350 (Ver 2.1 Jan 2001) 1100000/0 1710000/01453991A120040908EP02788797.52002121120040527EnEnEn200138064120011213JP200206739320020312JP20040908200437200409082004377 7C 25F 3/00 A 7C 25F 7/00 B 7B 23H 3/02 B 7H 01L 21/3063 BdeVORRICHTUNG UND VERFAHREN ZUR ELEKTROLYTISCHEN VERARBEITUNGenELECTROLYTIC PROCESSING APPARATUS AND METHODfrAPPAREIL ET PROCEDE DE TRAITEMENT ELECTROLYTIQUE16 EBARA CORPORATION00300694WH-E21554/224311-1, Haneda Asahi-choOhta-ku,Tokyo 144-8510JPSHIRAKASHI, Mitsuhikoc/o Ebara Corporation11-1, Haneda Asahi-choOhta-ku, Tokyo 144-8510JPKUMEKAWA, Masayukic/o Ebara Corporation11-1, Haneda Asahi-choOhta-ku, Tokyo 144-8510JPYASUDA, Hozumic/o Ebara Corporation11-1, Haneda Asahi-choOhta-ku, Tokyo 144-8510JPKOBATA, Itsukic/o Ebara Corporation11-1, Haneda Asahi-choOhta-ku, Tokyo 144-8510JPWagner, Karl H., Dipl.-Ing.00012567Wagner & Geyer,Patentanwälte,Gewürzmühlstrasse 580538 MünchenDEATBEBGCHCYCZDEDKEEESFIFRGBGRIEITLILUMCNLPTSESISKTRJP200201297320021211EnWO200305425520030703200327