METHOD OF COOLING HIGH DENSITY ELECTRONICS - Patent 1466191

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EP 1 466 191 A1

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(43)	Date of publication:
	13.10.2004 Bulletin 2004/42

(21)	Application number: 01273249.1

(22)	Date of filing: 21.11.2001

(51)	International Patent Classification (IPC)⁷: G01T 1/24

(86)	International application number:
	PCT/US2001/043392

(87)	International publication number:
	WO 2003/046610 (05.06.2003 Gazette 2003/23)

(84)	Designated Contracting States:
	AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

(71)	Applicant: Koninklijke Philips Electronics N.V.
	5621 BA Eindhoven (NL)

(72)	Inventors:
	GRIESMER, Jerome, J. Kirtland, OH 44094 (US) KLINE, Barry, D. Cleveland Hts., OH 44121 (US)

(74)	Representative: van der Veer, Johannis Leendert
	Internationaal Octrooibureau B.V.,Prof. Holstlaan 6 5656 AA Eindhoven 5656 AA Eindhoven (NL)

(54)	METHOD OF COOLING HIGH DENSITY ELECTRONICS