(19)
(11) EP 1 468 777 A8

(12) CORRECTED EUROPEAN PATENT APPLICATION

(48) Corrigendum issued on:
25.05.2005 Bulletin 2005/21

(43) Date of publication:
20.10.2004 Bulletin 2004/43

(21) Application number: 04291027.3

(22) Date of filing: 16.04.2004
(51) International Patent Classification (IPC)7: B23K 35/26
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR
Designated Extension States:
AL HR LT LV MK

(30) Priority: 17.04.2003 JP 2003112287

(71) Applicant: Senju Metal Industry Co., Ltd.
Tokyo, 120-8555 (JP)

(72) Inventors:
  • Amagai, Masazumi
    Tsukuba-shi, Ibaraki (JP)
  • Watanabe, Masako
    Oita-shi, Oita (JP)
  • Murata, Kensho
    Beppu-shi, Oita (JP)
  • Toyoda, Yoshitaka
    Shatte-shi, Saitama (JP)
  • Ueshima, Minoru
    Misato-shi, Saitama (JP)
  • Ohnishi, Tsukasa
    Souka-shi, Saitama (JP)
  • Tashima, Takeshi
    Ohnojoshi, Fukuoka (JP)
  • Souma, Daisuke
    Haga-gun, Tochigi (JP)
  • Roppongi, Takahiro
    Kawachi-gun, Tochigi (JP)
  • Okada, Hiroshi
    Souka-Shi, Saitama (JP)

(74) Representative: Callon de Lamarck, Jean-Robert et al
Cabinet Régimbeau 20, rue de Chazelles
75847 Paris cedex 17
75847 Paris cedex 17 (FR)

   


(54) Lead free solder


(57) A lead-free solder includes 0.05 - 5 mass % of Ag, 0.01 - 0.5 mass % of Cu, at least one of P, Ge, Ga, Al, and Si in a total amount of 0.001 - 0.05 mass %, and a remainder of Sn. One or more of a transition element for improving resistance to heat cycles, a melting point lowering element such as Bi, In, or Zn, and an element for improving impact resistance such as Sb may be added.