(19)
(11) EP 1 470 269 A1

(12)

(43) Date of publication:
27.10.2004 Bulletin 2004/44

(21) Application number: 03734903.2

(22) Date of filing: 31.01.2003
(51) International Patent Classification (IPC)7C25F 3/00, C25F 7/00, B23H 3/02, H01L 21/3063
(86) International application number:
PCT/JP2003/001011
(87) International publication number:
WO 2003/064734 (07.08.2003 Gazette 2003/32)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT SE SI SK TR

(30) Priority: 31.01.2002 JP 2002022734
15.04.2002 JP 2002112487
17.05.2002 JP 2002142411
12.06.2002 JP 2002172092
02.07.2002 JP 2002193776

(71) Applicant: EBARA CORPORATION
Ohta-ku,Tokyo 144-8510 (JP)

(72) Inventors:
  • SHIRAKASHI, Mitsuhiko,c/o Ebara Corporation
    Ohta-ku, Tokyo 144-8510 (JP)
  • KUMEKAWA, Masayuki,c/o Ebara Corporation
    Ohta-ku, Tokyo 144-8510 (JP)
  • YASUDA, Hozumi,c/o Ebara Corporation
    Ohta-ku, Tokyo 144-8510 (JP)
  • KOBATA, Itsuki,c/o Ebara Corporation
    Ohta-ku, Tokyo 144-8510 (JP)
  • NABEYA, Osamu,c/o Ebara Corporation
    Ohta-ku, Tokyo 144-8510 (JP)

(74) Representative: Wagner, Karl H., Dipl.-Ing. 
WAGNER & GEYERPatentanwälteGewürzmühlstrasse 5
80538 München
80538 München (DE)

   


(54) ELECTROLYTIC PROCESSING APPARATUS AND METHOD