(19)
(11) EP 1 474 251 A2

(12)

(88) Date of publication A3:
22.04.2004

(43) Date of publication:
10.11.2004 Bulletin 2004/46

(21) Application number: 03739583.7

(22) Date of filing: 17.02.2003
(51) International Patent Classification (IPC)7B08B 1/00
(86) International application number:
PCT/GB2003/000695
(87) International publication number:
WO 2003/068421 (21.08.2003 Gazette 2003/34)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT SE SI SK TR
Designated Extension States:
AL LT LV MK RO

(30) Priority: 15.02.2002 US 357148 P
20.07.2002 US 397740 P

(71) Applicant: Nutool, Inc.
Milpitas, CA 95035 (US)

(72) Inventors:
  • ASHJAEE, Jalal
    Cupertino, CA 95014 (US)
  • GOVZMAN, Boris
    Sunnyvale, CA 94068 (US)
  • FREY, Bernard, M.
    Livermore, CA 94551 (US)
  • NAGORSKI, Boguslav, A.
    San Jose, CA 95124 (US)
  • YOUNG, Douglas, W.
    Sunnyvale, CA 94086 (US)
  • TALIEH, Homayoun
    San Jose, CA 95138 (US)
  • BASOL, Bulent, M.
    Manhattan Beach, CA 90266 (US)

(74) Representative: Browne, Robin Forsythe, Dr. 
Urquhart-Dykes & Lord LLPTower North CentralMerrion Way
Leeds LS2 8PA
Leeds LS2 8PA (GB)

   


(54) INTEGRATED SYSTEM FOR PROCESSING SEMICONDUCTOR WAFERS