(19)
(11) EP 1 475 453 A8

(12) CORRECTED EUROPEAN PATENT APPLICATION

(48) Corrigendum issued on:
23.02.2005 Bulletin 2005/08

(43) Date of publication:
10.11.2004 Bulletin 2004/46

(21) Application number: 04017492.2

(22) Date of filing: 28.10.2002
(51) International Patent Classification (IPC)7: C23C 14/00, C23C 14/02, C23C 14/06, C23C 14/16, C23C 28/02, H01L 21/768
(84) Designated Contracting States:
DE FR GB

(30) Priority: 14.11.2001 JP 2001348325
05.02.2002 JP 2002027738
21.02.2002 JP 2002044289
21.02.2002 JP 2002044296

(62) Application number of the earlier application in accordance with Art. 76 EPC:
02024416.6 / 1312696

(71) Applicant: Mitsubishi Heavy Industries, Ltd.
Tokyo (JP)

(72) Inventors:
  • Sakamoto, Hitoshi, c/o Mitsubishi Heavy Ind., Ltd.
    Kanagawa (JP)
  • Yahata, Naoki c/o Mitsubishi Heavy Ind., Ltd.
    Hyogo (JP)
  • Matsuda, Ryuichi, c/o Mitsubishi Heavy Ind., Ltd.
    Hyogo (JP)
  • Ooba, Yoshiyuki, c/o Mitsubishi Heavy Ind., Ltd.
    Kanagawa (JP)
  • Nishimori, Toshihiko, Mitsubishi Heavy Ind., Ltd.
    Hyogo (JP)

(74) Representative: HOFFMANN - EITLE 
Patent- und Rechtsanwälte Arabellastrasse 4
81925 München
81925 München (DE)

 
Remarks:
This application was filed on 23 - 07 - 2004 as a divisional application to the application mentioned under INID code 62.
 


(54) Metal barrier film production apparatus, metal barrier film production method, metal film production method, and metal film production apparatus


(57) A metal film production apparatus, comprising: a chamber accommodating a substrate having a barrier metal film of a metal nitride formed thereon; diluent gas supply means for supplying a diluent gas to an interior of the chamber above a surface of the substrate; surface treatment plasma generation means which converts an atmosphere within the chamber into a plasma to generate a diluent gas plasma so that the barrier metal film on the surface of the substrate is etched with the diluent gas plasma to flatten the barrier metal film; a metallic etched member provided in the chamber; source gas supply means for supplying a source gas containing a halogen to an interior of the chamber between the substrate and the etched member; plasma generation means which converts the source gas containing the halogen into a plasma to generate a source gas plasma so that the etched member is etched with the source gas plasma to form a precursor from a metal component contained in the etched member and the source gas; and control means which makes a temperature of the substrate lower than a temperature of the etched member to form the metal component of the precursor as a film on the flattened barrier metal film.