METHOD AND SYSTEM FOR CONTROLLING THE CHEMICAL MECHANICAL POLISHING OF SUBSTRATES BY CALCULATING AN OVERPOLISHING TIME AND/OR A POLISHING TIME OF A FINAL POLISHING STEP - Patent 1478494

(19)

(11)

EP 1 478 494 A1

(12)

(43)	Date of publication:
	24.11.2004 Bulletin 2004/48

(21)	Application number: 02798618.1

(22)	Date of filing: 20.12.2002

(51)	International Patent Classification (IPC)⁷: B24B 49/03, B24B 37/04

(86)	International application number:
	PCT/US2002/041668

(87)	International publication number:
	WO 2003/072305 (04.09.2003 Gazette 2003/36)

(84)	Designated Contracting States:
	AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SI SK TR
	Designated Extension States:
	AL LT LV MK RO

(30)

Priority:

26.02.2002 DE 10208165
30.09.2002 US 261612

(71)	Applicant: ADVANCED MICRO DEVICES INC.
	Sunnyvale,California 94088-3453 (US)

(72)	Inventors:
	WOLLSTEIN, Dirk 01307 Dresden (DE) RAEBIGER, Jan 01277 Dresden (DE) MARXSEN, Gerd 01445 Radebeul (DE)

(74)	Representative: Grünecker, Kinkeldey, Stockmair & SchwanhäusserAnwaltssozietät
	Maximilianstrasse 58 80538 München 80538 München (DE)

(54)	METHOD AND SYSTEM FOR CONTROLLING THE CHEMICAL MECHANICAL POLISHING OF SUBSTRATES BY CALCULATING AN OVERPOLISHING TIME AND/OR A POLISHING TIME OF A FINAL POLISHING STEP