(19)
(11) EP 1 480 079 A8

(12) CORRECTED EUROPEAN PATENT APPLICATION

(48) Corrigendum issued on:
02.03.2005 Bulletin 2005/09

(43) Date of publication:
24.11.2004 Bulletin 2004/48

(21) Application number: 04019923.4

(22) Date of filing: 06.06.2003
(51) International Patent Classification (IPC)7: G03F 7/039, G03F 7/004
(84) Designated Contracting States:
BE DE

(30) Priority: 07.06.2002 JP 2002167393
21.06.2002 JP 2002181384
21.06.2002 JP 2002181588

(62) Application number of the earlier application in accordance with Art. 76 EPC:
03012226.1 / 1376232

(71) Applicant: Fuji Photo Film Co., Ltd.
Kanagawa (JP)

(72) Inventors:
  • Kanna, Shinichi
    Haibara-gun Shizuoka (JP)
  • Mizutani, Kazuyoshi
    Haibara-gun Shizuoka (JP)
  • Sasaki, Tomoya
    Haibara-gun Shizuoka (JP)

(74) Representative: HOFFMANN - EITLE 
Patent- und Rechtsanwälte Arabellastrasse 4
81925 München
81925 München (DE)

 
Remarks:
This application was filed on 23 - 08 - 2004 as a divisional application to the application mentioned under INID code 62.
 


(54) Photosensitive resin composition


(57) The photosensitive resin composition of the present invention is an excellent photosensitive resin composition: exhibiting significant transmissibility at the use of an exposure light source of 160 nm or less, more specifically F2 excimer laser light , where line edge roughness and development time dependence are small and a problem of footing formation is improved; and comprising a resin which decomposes by an action of acid to increase the solubility in alkali developer, in which the resin contains a specific repeat unit; a compound capable of generating an acid upon irradiation with one of an actinic ray and a radiation, in which the compound includes at least two kinds of compounds selected from the group consisting of specific compounds (B1), (B2), (B3) and (B4).