| (19) |
 |
|
(11) |
EP 1 482 771 A3 |
| (12) |
EUROPEAN PATENT APPLICATION |
| (88) |
Date of publication A3: |
|
25.10.2006 Bulletin 2006/43 |
| (43) |
Date of publication A2: |
|
01.12.2004 Bulletin 2004/49 |
| (22) |
Date of filing: 28.05.2004 |
|
| (51) |
International Patent Classification (IPC):
|
|
| (84) |
Designated Contracting States: |
|
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR
|
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Designated Extension States: |
|
AL HR LT LV MK |
| (30) |
Priority: |
30.05.2003 JP 2003154343
|
| (71) |
Applicant: Dowa Mining Co., Ltd. |
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Tokyo 100-8282 (JP) |
|
| (72) |
Inventors: |
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- Tsukaguchi, Nobuyoshi
Shiojiri-shi
Nagano 399-0703 (JP)
- Kosaka, Michihiro
Shiojiri-shi
Nagano 399-0703 (JP)
|
| (74) |
Representative: Manitz, Finsterwald & Partner GbR |
|
Postfach 31 02 20
80102 München
80102 München (DE) |
|
| |
|
| (54) |
Metal/ceramic circuit board and method for producing same |
(57) A metal layer 12 of aluminum or an aluminum alloy is formed on at least one side
of a ceramic substrate 10, and a resist 14 having a predetermined shape is formed
on the metal layer 12. Then, an etchant of a mixed solution prepared by mixing ferric
chloride with water without adding any acids is used for etching and removing an undesired
portion of the metal layer 12 to form a metal circuit 12 on the at least one side
of the ceramic substrate 10.