(19)
(11) EP 1 490 431 A1

(12)

(43) Date of publication:
29.12.2004 Bulletin 2004/53

(21) Application number: 02793573.3

(22) Date of filing: 30.12.2002
(51) International Patent Classification (IPC)7C08L 3/12, C08L 29/04, C08L 33/02, C08L 23/00
(86) International application number:
PCT/KR2002/002496
(87) International publication number:
WO 2003/082970 (09.10.2003 Gazette 2003/41)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SI SK TR
Designated Extension States:
AL LT LV MK RO

(30) Priority: 29.03.2002 KR 2002017516

(71) Applicant: Nasun Hitec Ltd., Co.
143-210 Seoul (KR)

(72) Inventor:
  • Seo, Jeung-Eui
    Gwangjin-ku,143-210 Seoul (KR)

(74) Representative: KUHNEN & WACKER 
Patent- und RechtsanwaltsbüroPrinz-Ludwig-Strasse 40A
85354 Freising
85354 Freising (DE)

   


(54) DISASEMBLE RESIN AND THE MANUFACTURING METHOD FOR THEREOF