(19)
(11) EP 1 490 904 A1

(12)

(43) Date of publication:
29.12.2004 Bulletin 2004/53

(21) Application number: 03745717.3

(22) Date of filing: 01.04.2003
(51) International Patent Classification (IPC)7H01L 23/373
(86) International application number:
PCT/US2003/009907
(87) International publication number:
WO 2003/085733 (16.10.2003 Gazette 2003/42)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
Designated Extension States:
AL LT LV MK

(30) Priority: 02.04.2002 JP 2002100200

(71) Applicant: 3M Innovative Properties Company
St. Paul, MN 55133-3427 (US)

(72) Inventors:
  • TAKEDA, Masaaki
    Kanagawa 229-0032 (JP)
  • MITSUI, Akihiko
    Tokyo 190-0012 (JP)
  • KAWATE, Kohichiro
    Tokyo 194-0041 (JP)
  • ISHII, Shigeyoshi
    Tokyo 193-0934 (JP)

(74) Representative: von Kreisler Selting Werner 
PatentanwälteP.O. Box 10 22 41
50462 Köln
50462 Köln (DE)

   


(54) THERMOSETTING ADHESIVE SHEET WITH ELECTROCONDUCTIVE AND THERMOCONDUCTIVE PROPERTIES