Plating tool, plating method, electroplating apparatus, plated product, and method for producing plated product

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EP 1 493 847 A3

(12)	EUROPEAN PATENT APPLICATION

(88)	Date of publication A3:
	01.10.2008 Bulletin 2008/40

(43)	Date of publication A2:
	05.01.2005 Bulletin 2005/01

(21)	Application number: 04015654.9

(22)	Date of filing: 02.07.2004

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International Patent Classification (IPC):

C25D 17/16^(2006.01)

C25D 7/00^(2006.01)

(84)	Designated Contracting States:
	AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR
	Designated Extension States:
	AL HR LT LV MK

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Priority:

04.07.2003 JP 2003191570
26.12.2003 JP 2003431754
03.06.2004 JP 2004165416
03.06.2004 JP 2004165418

(71)	Applicant: Seiko Epson Corporation
	Shinjuku-ku Tokyo 163-0811 (JP)

(72)	Inventors:
	Mitsui, Yoji Suwa-shi Nagano 392-8502 (JP) Godo, Tadashi Suwa-shi Nagano 392-8502 (JP) Okonogi, Itaru Suwa-shi Nagano 392-8502 (JP)

(74)	Representative: HOFFMANN EITLE
	Patent- und Rechtsanwälte Arabellastrasse 4 81925 München 81925 München (DE)

(54)	Plating tool, plating method, electroplating apparatus, plated product, and method for producing plated product

(57) A plating tool for plating an object, includes a rotatable supporting member which includes an opening formed so as to pass through the rotatable supporting member, a line member which is provided so as to cross the opening, and a guide portion which is provided on the rotatable supporting member so as to promote a flow of a plating liquid toward the opening. A space defined by an inner wall face of the opening and the line member is a cell in which the object to be plated is placed.

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