(19)
(11) EP 1 495 161 A2

(12)

(88) Date of publication A3:
31.12.2003

(43) Date of publication:
12.01.2005 Bulletin 2005/02

(21) Application number: 03746750.3

(22) Date of filing: 11.04.2003
(51) International Patent Classification (IPC)7C25D 5/00, C25D 5/48, C25D 5/52, C25D 5/50, C25D 5/08, B23H 11/00, B23H 3/00, B23H 5/00, B23H 7/00, B23H 9/00
(86) International application number:
PCT/US2003/011417
(87) International publication number:
WO 2003/088316 (23.10.2003 Gazette 2003/43)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
Designated Extension States:
AL LT LV MK

(30) Priority: 12.04.2002 US 372263 P
21.05.2002 US 382133 P
08.06.2002 US 387826 P
24.07.2002 US 398316 P

(71) Applicant: ACM Research, Inc.
Fremont, CA 94538 (US)

(72) Inventors:
  • WANG, Hui
    Fremont, CA 94539 (US)
  • WANG, Jian
    Fremont, CA 94539 (US)
  • YIH, Peihaur
    Boonton, NJ 07005 (US)
  • WU, Huiquan
    Rockville, MD 20852 (US)

(74) Representative: Vleck, Jan Montagu 
Reddie & Grose,16 Theobalds Road
London WC1X 8PL
London WC1X 8PL (GB)

   


(54) ELECTROPOLISHING AND ELECTROPLATING METHODS