| (19) |
 |
|
(11) |
EP 1 496 142 A3 |
| (12) |
EUROPEAN PATENT APPLICATION |
| (88) |
Date of publication A3: |
|
05.04.2006 Bulletin 2006/14 |
| (43) |
Date of publication A2: |
|
12.01.2005 Bulletin 2005/02 |
| (22) |
Date of filing: 28.11.2003 |
|
| (51) |
International Patent Classification (IPC):
|
|
| (84) |
Designated Contracting States: |
|
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR |
|
Designated Extension States: |
|
AL LT LV MK |
| (30) |
Priority: |
04.07.2003 JP 2003192500
|
| (71) |
Applicant: Kaneko Denki Kabushiki Kaisha |
|
Nagoya-shi,
Aichi 457-0827 (JP) |
|
| (72) |
Inventor: |
|
- Kaneko, Satochi
Toyoakae-shi
Aichi-ken (JP)
|
| (74) |
Representative: Senior, Alan Murray |
|
J.A. KEMP & CO.,
14 South Square,
Gray's Inn
London WC1R 5JJ
London WC1R 5JJ (GB) |
|
| |
|
| (54) |
Electroplating method and electroplating apparatus |
(57) The present invention provides a plating method and a plating apparatus capable of
plating small parts effectively without any deformation. A object product to be plated
is put in each accommodating concave portion in a carrier tape including a number
of the accommodating concave portions spaced at a specific interval and this carrier
tape is passed through a plating apparatus so as to form metallic plating layer on
the surface of the object product to be plated.