Fluidic MEMS device - Patent 1498385

(19)

(11)

EP 1 498 385 A3

(12)	EUROPEAN PATENT APPLICATION

(88)	Date of publication A3:
	18.01.2006 Bulletin 2006/03

(43)	Date of publication A2:
	19.01.2005 Bulletin 2005/03

(21)	Application number: 04003147.8

(22)	Date of filing: 12.02.2004

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International Patent Classification (IPC):

B81B 7/00^(2006.01)
G02B 26/08^(2006.01)

B81C 1/00^(2006.01)

(84)	Designated Contracting States:
	AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
	Designated Extension States:
	AL LT LV MK

(30)

Priority:

15.07.2003 US 620968

(71)	Applicant: Hewlett-Packard Development Company, L.P.
	Houston, TX 77070 (US)

(72)	Inventors:
	Smith, Mark A. Corvallis, OR 97330 (US) Boucher, William R. Corvallis, OR 97330 (US) Haluzak, Charles C. Corvallis, OR 97333 (US)

(74)	Representative: Schoppe, Fritz et al
	Patentanwälte Schoppe, Zimmermann, Stöckeler & Zinkler Postfach 246 82043 Pullach bei München 82043 Pullach bei München (DE)

(54)	Fluidic MEMS device

(57) A MEMS package 1 comprises a substrate 3 and a cove plate 2. A MEMS structure 32 is fabricated on a surface 31 of the substrate. The cover plate 2 may be bonded to the substrate 3 by a bond ring 4. The cover plate 2, the bond ring 4 and the substrate 3 may define an inner cavity 11. The cover plate 2, the substrate 3 and a breach 42 in the bond ring 4 may define a fill port 111.

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