ATBECHDEDKESFRGBGRITLILUNLSEMCPTIE......FI....CY..TR............................JDIM350 (Ver 2.1 Jan 2001) 1620000/01500961EUROPEAN PATENT APPLICATIONA320050504EP04024107.720011029EnEnEn244389 P20001031US20050504200518200501262005047 7G 02B 6/43 A 7G 02B 6/38 BdeFaseroptische Leiterplatte und Verfahren zu deren optischen Verbindung durch Einbetten einer optischen SchnittstelleenFiberoptic circuit board and method of forming an optical connection thereof by embedding an optical interfacefrCarte de circuit à fibres optiques et méthode de sa connexion optique par l'incorporation d'un interface optique501997157.1133439420011029Viasystems Group, Inc.02976960M 9883Suite 400, 101 South Hanley RoadSt. Louis, MO 63105USTourne, A.A.M., JosephCoendersberlaan 595709 MA, HelmondNLEbner von Eschenbach, Jenniferet al00092001LADAS & PARRY LLP Dachauerstrasse 3780335 MünchenDEATBECHCYDEDKESFIFRGBGRIEITLILUMCNLPTSETR20050504200518

An optical connector for use in multilayer electro-optic circuit boards. An electro-optical back plane circuit board uses both electrical and optical connectors to carry signals in both electrical and light form. The optical connector employs redundant alignment features to provide for reliable connectivity between plug in boards and the electro-optic back plane. A process of forming the back plane and other multilevel circuit boards so as to embed optical connectors is disclosed. Optical interface body (530) is embedded into the printed circuit board and connected to optical fibre (540) aslo embedded in the printed circuit board. By forming a hole in the printed circuit board, the top of the interface body can be exposed and light can be coupled out of and into the interface body.