<?xml version="1.0" encoding="UTF-8"?>
<!DOCTYPE ep-patent-document PUBLIC "-//EPO//EP PATENT DOCUMENT 1.1//EN" "ep-patent-document-v1-1.dtd">
<ep-patent-document id="EP04024064B1" file="EP04024064NWB1.xml" lang="en" country="EP" doc-number="1508445" kind="B1" date-publ="20070131" status="n" dtd-version="ep-patent-document-v1-1">
<SDOBI lang="en"><B000><eptags><B001EP>ATBECHDEDKESFRGBGRITLI..NLSE..PTIE......FI......................................</B001EP><B005EP>J</B005EP><B007EP>DIM360 (Ver 1.5  21 Nov 2005) -  2100000/0</B007EP></eptags></B000><B100><B110>1508445</B110><B120><B121>EUROPEAN PATENT SPECIFICATION</B121></B120><B130>B1</B130><B140><date>20070131</date></B140><B190>EP</B190></B100><B200><B210>04024064.0</B210><B220><date>19980715</date></B220><B240><B241><date>20041008</date></B241><B242><date>20051026</date></B242></B240><B250>en</B250><B251EP>en</B251EP><B260>en</B260></B200><B300><B310>PO806697</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO807297</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO807197</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO804797</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO803597</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO804497</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO806397</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO805697</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO806997</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO804997</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO803697</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO804897</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO807097</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO806797</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO800197</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO804197</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO800497</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO793597</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO793697</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO806197</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO805497</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO806597</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO805597</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO805397</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO793397</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO795097</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO794997</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO806097</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO805997</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO807397</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO807697</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO807597</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO807797</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO805897</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PP398398</B310><B320><date>19980609</date></B320><B330><ctry>AU</ctry></B330><B310>PP398298</B310><B320><date>19980609</date></B320><B330><ctry>AU</ctry></B330></B300><B400><B405><date>20070131</date><bnum>200705</bnum></B405><B430><date>20050223</date><bnum>200508</bnum></B430><B450><date>20070131</date><bnum>200705</bnum></B450><B452EP><date>20060717</date></B452EP></B400><B500><B510EP><classification-ipcr sequence="1"><text>B41J   2/045       20060101AFI20041230BHEP        </text></classification-ipcr><classification-ipcr sequence="2"><text>B41J   2/14        20060101ALI20041230BHEP        </text></classification-ipcr><classification-ipcr sequence="3"><text>B41J   2/16        20060101ALI20041230BHEP        </text></classification-ipcr></B510EP><B540><B541>de</B541><B542>Tintenstrahldüse mit Lorentz-Kraft-Element</B542><B541>en</B541><B542>Inkjet nozzle with Lorentz force actuator</B542><B541>fr</B541><B542>Buse de jet d'encre avec actuateur à force Lorentz</B542></B540><B560><B561><text>US-A- 4 633 267</text></B561><B562><text>PATENT ABSTRACTS OF JAPAN vol. 0172, no. 26 (M-1405), 10 May 1993 (1993-05-10) &amp; JP 4 357039 A (ROHM CO LTD), 10 December 1992 (1992-12-10)</text></B562><B562><text>PATENT ABSTRACTS OF JAPAN vol. 0145, no. 23 (M-1049), 16 November 1990 (1990-11-16) &amp; JP 2 219655 A (SHARP CORP), 3 September 1990 (1990-09-03)</text></B562><B562><text>PATENT ABSTRACTS OF JAPAN vol. 0163, no. 91 (M-1298), 19 August 1992 (1992-08-19) &amp; JP 4 129745 A (SEIKO EPSON CORP), 30 April 1992 (1992-04-30)</text></B562><B562><text>PATENT ABSTRACTS OF JAPAN vol. 0150, no. 32 (M-1073), 25 January 1991 (1991-01-25) &amp; JP 2 273241 A (RICOH CO LTD), 7 November 1990 (1990-11-07)</text></B562><B562><text>PATENT ABSTRACTS OF JAPAN vol. 0092, no. 94 (M-431), 20 November 1985 (1985-11-20) &amp; JP 60 131254 A (RICOH KK), 12 July 1985 (1985-07-12)</text></B562><B562><text>PATENT ABSTRACTS OF JAPAN vol. 0141, no. 86 (M-0962), 16 April 1990 (1990-04-16) &amp; JP 2 034342 A (SEIKO EPSON CORP), 5 February 1990 (1990-02-05)</text></B562></B560><B590><B598>277</B598></B590></B500><B600><B620><parent><pdoc><dnum><anum>98933350.5</anum><pnum>0999933</pnum></dnum><date>19980715</date></pdoc></parent></B620></B600><B700><B720><B721><snm>Silverbrook, Kia</snm><adr><str>214 Catherine Street</str><city>Leichhardt
NSW 2040</city><ctry>AU</ctry></adr></B721></B720><B730><B731><snm>Silverbrook Research Pty. Limited</snm><iid>02699020</iid><irf>IJF-EP Div8</irf><adr><str>393 Darling Street</str><city>Balmain, NSW 2041</city><ctry>AU</ctry></adr></B731></B730><B740><B741><snm>Moore, Barry</snm><sfx>et al</sfx><iid>00126142</iid><adr><str>Hanna, Moore &amp; Curley 
13 Lower Lad Lane</str><city>Dublin 2</city><ctry>IE</ctry></adr></B741></B740></B700><B800><B840><ctry>AT</ctry><ctry>BE</ctry><ctry>CH</ctry><ctry>DE</ctry><ctry>DK</ctry><ctry>ES</ctry><ctry>FI</ctry><ctry>FR</ctry><ctry>GB</ctry><ctry>GR</ctry><ctry>IE</ctry><ctry>IT</ctry><ctry>LI</ctry><ctry>NL</ctry><ctry>PT</ctry><ctry>SE</ctry></B840></B800></SDOBI><!-- EPO <DP n="1"> -->
<description id="desc" lang="en">
<heading id="h0001"><b>Field of Invention</b></heading>
<p id="p0001" num="0001">The present invention relates to the field of ink jet printing systems.</p>
<heading id="h0002"><b>Background of the Art</b></heading>
<p id="p0002" num="0002">Many different types of printing have been invented, a large number of which are presently in use. The known forms of print have a variety of methods for marking the print media with a relevant marking media. Commonly used forms of printing include offset printing, laser printing and copying devices, dot matrix type impact printers, thermal paper printers, turn recorders, thermal wax printers, dye sublimation printers and ink jet printers both of the drop on demand and continuous flow type. Each type of printer has its own advantages and problems when considering cost, speed, quality, reliability, simplicity of construction and operation etc.</p>
<p id="p0003" num="0003">In recent years, the field of ink jet printing, wherein each individual pixel of ink is derived from one or more ink nozzles has become increasingly popular primarily due to its inexpensive and versatile nature.</p>
<p id="p0004" num="0004">Many different techniques of ink jet printing have been invented. For a survey of the field, reference is made to an article by J Moore, "Non-Impact Printing: Introduction and Historical Perspective", Output Hard Copy Devices, Editors R Dubeck and S Sherr, pages 207-220(1988).</p>
<p id="p0005" num="0005">Ink jet printers themselves come in many different types. The utilisation of a continuous stream ink in ink jet printing appears to date back to at least 1929 wherein US Patent No. 1941001 by Hansell discloses a simple form of continuous stream electro-static ink jet printing.</p>
<p id="p0006" num="0006">US Patent 3596275 by Sweet also discloses a process of a continuous ink jet printing including the step wherein the ink jet stream is modulated by a high frequency electro-static field so as to cause drop separation. This technique is still utilized by several manufacturers including Elmjet and Scitex (see also US Patent No. 3373437 by Sweet et al)</p>
<p id="p0007" num="0007">Piezo-electric ink jet printers are also one form of commonly utilized ink jet printing device. Piezo-electric systems are disclosed by Kyser et al. in US Patent No. 3946398 (1970) which utilises a diaphragm mode of operation, by Zolten in US Patent 3683212 (1970) which discloses a squeeze mode of operation of a piezo electric crystal, Stemme in US Patent No. 3747120 (1972) discloses a bend mode of piezo-electric operation, Howkins in US Patent No. 4459601 discloses a Piezo electric push mode actuation of the ink jet stream and Fischbeck in US 4584590 which discloses a sheer mode type of piezo-elechic transducer element</p>
<p id="p0008" num="0008">Recently, thermal ink jet printing has become an extremely popular form of ink jet printing. The ink jet printing techniques include those disclosed by Endo et al in GB 2007162 (1979) and Vaught et al in US Patent 4490728. Both the aforementioned references disclosed ink jet printing techniques rely upon the activation of an electrothermal actuator which results in the creation of a bubble in a constricted space, such as a nozzle, which thereby causes the ejection of ink from an aperture connected to the confined space onto a relevant print media. Printing devices utilising the electro-thermal actuator are manufactured by manufacturers such as Canon and Hewlett Packard.<!-- EPO <DP n="2"> --></p>
<p id="p0009" num="0009">JP 2219655 describes an inkjet nozzle comprising a nozzle chamber having a thin wall moveable by a Lorentz force. Ink is supplied to the nozzle chamber via an aperture defined in a fixed sidewall of the chamber.</p>
<p id="p0010" num="0010">JP 4357039 describes an inkjet printing head, which ejects ink by a Lorentz force acting on a plurality of opposed tongue protrusions. An opposed pair of tongue protrusion repel each when a current flows through them, which creates a pressure wave therebetween and causes ejection of ink.</p>
<p id="p0011" num="0011">JP 4129745 describes an inkjet nozzle comprising an internal diaphragm having associated wiring. The diaphragm is displaceable, using a Lorentz force, by passing a current through the wiring, thereby causing ejection of ink from the nozzle.</p>
<p id="p0012" num="0012">As can be seen from the foregoing, many different types of printing technologies are available. Ideally, a printing technology should have a number of desirable attributes. These include inexpensive construction and<!-- EPO <DP n="3"> --> operation, high speed operation, safe and continuous long term operation etc. Each technology may have its own advantages and disadvantages in the areas of cost, speed, quality, reliability, power usage, simplicity of construction operation, durability and consumables.</p>
<p id="p0013" num="0013">Many ink jet printing mechanisms are known. Unfortunately, in mass production techniques, the production of ink jet heads is quite difficult. For example, often, the orifice or nozzle plate is constructed separately from the ink supply and ink ejection mechanism and bonded to the mechanism at a later stage (Hewlett-Packard Journal, VoL 36 no 5, pp33-37(1985)). These separate material processing steps required in handling such precision devices often adds a substantially expense in manufacturing.</p>
<p id="p0014" num="0014">Additionally, side shooting inkjet technologies (U.S. Patent No. 4,899,181) are often used but again, this limit the amount of mass production throughput given any particular capital investment.</p>
<p id="p0015" num="0015">Additionally, mote esoteric techniques are also often utilized. These can include electroforming of nickel stage (Hewlett-Packard Journal, Vol. 36 no 5, pp33-37 (1985)), electro-discharge machining, laser ablation (U.S. Patent No. 5,208,604), micro-punching, etc.</p>
<p id="p0016" num="0016">The utilisation of the above techniques is likely to add substantial expense to the mass production of inkjet print heads and therefore add substantially to their final cost.</p>
<p id="p0017" num="0017">It would therefore be desirable if an efficient system for the mass production of ink jet print heads could be developed.</p>
<heading id="h0003"><u style="single">Summary of the invention</u></heading>
<p id="p0018" num="0018">It is an object of the present invention to provide for an ink jet printing mechanism having a series of ink ejection nozzles, with the nozzles including an internal selective actuator mechanism activated on a nozzle by nozzle basis by the placement of a field around said nozzles. Accordingly the invention provides a nozzle arrangement according to claim 1. Advantageous embodiments are provided in the dependent claims.<!-- EPO <DP n="4"> --></p>
<heading id="h0004"><b><u style="single">Brief Description of the Drawings</u></b></heading>
<p id="p0019" num="0019">Notwithstanding any other forms which may fall within the scope of the present invention, preferred forms of the invention will now be described, by way of example only, with reference to the accompanying drawings in which:<!-- EPO <DP n="5"> -->
<ul id="ul0001" list-style="none" compact="compact">
<li>Fig. 276 is a schematic top view of a single ink jet nozzle chamber apparatus constructed in accordance with an embodiment;</li>
<li>Fig. 277 is a top cross-sectional view of a single ink jet nozzle chamber apparatus with the diaphragm in its activated stage;</li>
<li>Fig. 278 is a schematic cross-sectional view illustrating the exposure of a resist layer through a halftone mask;</li>
<li>Fig. 279 is a schematic cross-sectional view illustrating the resist layer after development exhibiting a corrugated pattern;</li>
<li>Fig. 280 is a schematic cross-sectional view illustrating the transfer of the corrugated pattern onto the substrate by etching;<!-- EPO <DP n="6"> --></li>
<li>Fig. 281 is a schematic cross-sectional view illustrating the construction of an embedded, corrugated, conduction layer, and</li>
<li>Fig. 282 is an exploded perspective view illustrating the construction of a single ink jet nozzle in accordance with an embodiment.</li>
<li>Fig. 283 is a perspective view of the heater traces used in a single ink jet nozzle constructed in accordance with an embodiment.</li>
<li>Fig. 284 provides a legend of the materials indicated in Fig. 285 to Fig. 296; and</li>
<li>Fig. 285 to Fig. 296 illustrate sectional views of the manufacturing steps in one form of construction of an ink jet printhead nozzle.</li>
</ul></p>
<heading id="h0005"><b><u style="single">Description of the Preferred and Other Embodiments</u></b></heading>
<p id="p0020" num="0020">The preferred embodiments and other embodiments will be discussed under separate headings with the heading including an IJ number for ease of reference. The headings also include a type designator with T indicating thermal, S indicating shutter type and F indicating a field type.<!-- EPO <DP n="7"> --></p>
<heading id="h0006"><b><u style="single">Description of IJ16 F</u></b></heading>
<p id="p0021" num="0021">An embodiment utilizes a Lorenz force on a current carrying wire in a magnetic field to actuate a diaphragm for the injection of ink from a nozzle chamber via a nozzle hole. The magnetic field is static and is provided by a permanent magnetic yoke around the nozzles of an ink jet head.</p>
<p id="p0022" num="0022">Referring initiate to Fig. 276, there is illustrated a single ink jet nozzle chamber apparatus 1510 as constructed in accordance with an embodiment. Each ink jet nozzle 1510 includes a diaphragm 1511 of a corrugated form which is suspended over a nozzle chamber having a ink port 1513 for the injection of ink. The diaphragm 1511 is constructed from a number of layers including a plane copper coil layer which consists of a large number of copper coils which form a circuit for the flow of electric current across the diaphragm 1511. The electric current in the wires of the diaphragm coil section 1511 all Bowing in the same direction. Fig. 283 is a perspective view of the current circuit utilised in the construction of a single ink jet nozzle, illustrating the corrugated structure of the traces in the diaphragm 1511 of Fig. 276. A permanent magnetic yoke (not shown) is arranged so that the magnetic field, 1516, is in the plant of the chip's surface, perpendicular to the direction of current flow across the diaphragm coil 1511.</p>
<p id="p0023" num="0023">In Fig. 277, there is illustrated a sectional view of the ink jet nozzle 1510 taken along the line A-A1 of Fig. 276 when the diaphragm 1511 has been activated by current flowing through coil wires 1514. The<!-- EPO <DP n="8"> --> diaphragm 1511 is forced generally in the direction of nozzle 1513 thereby resulting in ink within chamber 1518 being ejected out of port 1513. The diaphragm 1511 and chamber 1518 are connected to an ink reservoir 1519 which, after the ejection of ink via port 1513, results in a refilling of chamber 1518 from ink reservoir 1519.</p>
<p id="p0024" num="0024">The movement of the diaphragm 1511 results from a Lorenz interaction between the coil current and the magnetic field.</p>
<p id="p0025" num="0025">The diaphragm 1511 is corrugated so that the diaphragm motion occurs as an elastic bending motion. This is important as a flat diaphragm may be prevented from flexing by tensile stress.</p>
<p id="p0026" num="0026">When data signals distributed on the print head indicate that a particular nozzle is to eject a drop of ink, the drive transistor for that nozzle is turned on. This energises the coil 1514, causing elastic deformation of the diaphragm 1511 downwards, ejecting ink. After approximately 3 µs, the coil current is turned off, and the diaphragm 1511 returns to its quiescent position. The diaphragm return 'sucks' some of the ink back into the nozzle, causing the ink ligament connecting the ink drop 1520 to the ink in the nozzle to thin. The forward velocity of the drop and backward velocity of the ink in the chamber 1518 are resolved by the ink drop 1520 breaking off from the ink in the nozzle. The ink drop 1520 then continues towards the recording medium. Ink refill of the nozzle chamber 1518 is via the two slots 1522, 1523 at either side of the diaphragm. The ink refill is caused by the surface tension of the ink meniscus at the nozzle.</p>
<p id="p0027" num="0027">Turning to Fig. 278, the corrugated diaphragm can be formed by depositing a resist layer 1530 on top of a sacrificial glass layer 1531. The resist layer 1530 is exposed utilising a mask 1532 having a halftone pattern delineating the corrugations.</p>
<p id="p0028" num="0028">After development, as is illustrated in Fig. 279, the resist 1530 contains the corruption pattern. The resist layer 1530 and the sacrificial glass layer are then etched utilizing an etchant that erodes the resist 1530 at substantially the same rate as the sacrificial glass 1531. This transfers the corrugated pattern into the sacrificial glass layer 1531 as illustrated in Fig. 280. As illustrated in Fig. 281, subsequently, a nitride passivation layer 1534 is deposited followed a copper layer 1535 which is patterned utilizing a coil mask. A further nitride passivation layer 1536 follows on top of the copper layer 1535. Slots 1522, 1523 in the nitride layer at the side of the diaphragm can be etched (Fig. 276) and subsequently, the sacrificial glass layer can be etched away leaving the corrugated diaphragm.</p>
<p id="p0029" num="0029">In Fig. 282, there is illustrated an exploded perspective view of the various layers of an ink jet nozzle 1510 which is constructed on a silicon water having a buried boron doped epitaxial layer 1540 which is back etched in a final processing step, including the etching of ink port 1513. The silicon substrate 1541, as will be discussed below, is an anisotropically crystallographically etched so as to form the nozzle chamber structure. On top of the silicon substrate layer 1541 is a CMOS layer 1542 which can comprise standard CMOS processing to form two level metal drive and control circuitry. On top of the CMOS layer 1542 is a first passivation layer which can comprise silicon nitride which protects the lower layers from any subsequent etching processes. On top of this layer is formed the copper layer 1545 having through holes eg. 1546 to the CMOS layer 1542 for the supply of current. On top of the copper layer 1545 is a second nitrate passivation layer 1547 which provides for protection of the copper layer from ink and provides insulation.</p>
<p id="p0030" num="0030">The nozzle 1510 can be formed as part of an array of nozzles formed on a single wafer. After construction, the wafer creating nozzles 1510 can be bonded to a second ink supply wafer having ink channels for the supply of ink such that the nozzle 1510 is effectively supplied with an ink reservoir on one side and ejects ink through the hole 1513 onto print media or the like on demand as required.<!-- EPO <DP n="9"> --></p>
<p id="p0031" num="0031">The nozzle chamber 1518 is formed using an anisotropic crystallographic etch of the silicon substrate. Etchant access to the substrate is via the slots 1522, 1523 at the sides of the diaphragm. The device is manufactured on &lt;100&gt; silicon (with a buried boron etch stop layer), but rotated 45° in relation to the &lt;010&gt; and &lt;001&gt; planes. Therefore, the &lt;111&gt; planes which stop the crystallographic etch of the nozzle chamber form a 45° rectangle which superscribes the slot in the nitride layer. This etch will proceed quite slowly, due to limited access of etchant to the silicon. However, the etch can be performed at the same time as the bulk silicon etch which thins the wafer. The drop firing rate is around 7 kHz. The ink jet head is suitable for fabrication as a monolithic page wide print head. The illustration shows a single nozzle of a 1600 dpi print head in 'down shooter' configuration.</p>
<p id="p0032" num="0032">One form of detailed manufacturing process which can be used to fabricate monolithic ink jet print heads operating in accordance with the principles taught by the present embodiment can proceed utilizing the following steps:
<ol id="ol0001" compact="compact" ol-style="">
<li>1. Using a double sided polished wafer deposit 3 microns of epitaxial silicon heavily doped with boron.</li>
<li>2. Deposit 10 microns of epitaxial silicon, either p-type or n-type, depending upon the CMOS process used.</li>
<li>3. Complete drive transistors, data distribution, and timing circuits using a 0.5 micron, one poly, 2 metal CMOS process. This step is shown in Fig. 285. For clarity, these diagrams may not be to scale, and may not represent a cross section though any single plane of the nozzle. Fig. 284 is a key to representations of various materials in these manufacturing diagrams, and those of other cross referenced ink jet configurations.</li>
<li>4. Etch the CMOS oxide layers down to silicon or aluminum using Mask 1. This mask defines the nozzle chamber, and the edges of the print heads chips. This step is shown in Fig. 286.</li>
<li>5. Crystallographically etch the exposed silicon using, for example, KOH or EDP (ethylenediamine pyrocatechol). This etch stops on &lt;111&gt; crystallographic planes, and on the boron doped silicon buried layer. This step is shown in Fig. 287.</li>
<li>6. Deposit 12 microns of sacrificial material (polyimide). Planarize down to oxide using CMP. The sacrificial material temporarily fills the nozzle cavity. This step is shown in Fig. 288.</li>
<li>7. Deposit 1 micron of (sacrificial) photosensitive polyimide.</li>
<li>8. Expose and develop the photosensitive polyimide using Mask 2. This mask is a gray-scale mask which defines the concertina ridges of the flexible membrane containing the central part of the solenoid. The result of the etch is a series of triangular ridges across the whole length of the ink pushing membrane. This step is shown in Fig. 289.</li>
<li>9. Deposit 0.1 microns ofPECVD silicon nitride (Si<sub>3</sub>N<sub>4</sub>).</li>
<li>10. Etch the nitride layer using Mask 3. This mask defines the contact vias from the solenoid coil to the second-level metal contacts.</li>
<li>11. Deposit a seed layer of copper.</li>
<li>12. Spin on 2 microns of resist, expose with Mask 4, and develop. This mask defines the coil of the solenoid. The resist acts as an electroplating mold. This step is shown in Fig. 290.</li>
<li>13. Electroplate 1 micron of copper. Copper is used for its low resistivity (which results in higher efficiency) and its high electromigration resistance, which increases reliability at high current densities.</li>
<li>14. Strip the resist and etch the exposed copper seed layer. This step is shown in Fig. 291.</li>
<li>15. Deposit 0.1 microns of silicon nitride (Si<sub>3</sub>N<sub>4</sub>).<!-- EPO <DP n="10"> --></li>
<li>16. Etch the nitride layer using Mask 5. This mask defines the edges of the ink pushing membrane and the bond pads.</li>
<li>17. Wafer probe. All electrical connections are complete at this point, bond pads are accessible, and the chips are not yet separated.</li>
<li>18. Mount the wafer on a glass blank and back-etch the wafer using KOH with no mask. This etch thins the wafer and stops at the buried boron doped silicon layer. This step is shown in Fig. 292.</li>
<li>19. Plasma back-etch the boron doped silicon layer to a depth of 1 micron using Mask 6. This mask defines the nozzle rim. This step is shown in Fig. 293.</li>
<li>20. Plasma back-etch through the boron doped layer using Mask 7. This mask defines the nozzle, and the edge of the chips. At this stage, the chips are still mounted on the glass blank. This step is shown in Fig. 294.</li>
<li>21. Strip the adhesive layer to detach the chips from the glass blank. Etch the sacrificial layer. This process completely separates the chips. This step is shown in Fig. 295.</li>
<li>22. Mount the print heads in their packaging, which may be a molded plastic former incorporating ink channels which supply different colors of ink to the appropriate regions of the front surface of the wafer.</li>
<li>23. Connect the print heads to their interconnect systems.</li>
<li>24. Hydrophobize the front surface of the print heads.</li>
<li>25. Fill with ink, apply a strong magnetic field in the plane of the chip surface, and test the completed print heads. A filled nozzle is shown in Fig. 296.</li>
</ol><!-- EPO <DP n="11"> --></p>
<heading id="h0007"><b><u style="single">IJ USES</u></b></heading>
<p id="p0033" num="0033">The presently disclosed ink jet printing technology is potentially suited to a wide range of printing system including: colour and monochrome office printers, short run digital printers, high speed digital printers, offset press supplemental printers, low cost scanning printers high speed pagewidth printers, notebook computers with inbuilt pagewidth printers, portable colour and monochrome printers, colour and monochrome copiers, colour and monochrome facsimile machines, combined printer, facsimile and copying machines, label printers, large format plotters, photograph copies, printers for digital photographic "minilabs", video printers, PhotoCD printers portable printers for PDAs, wallpaper printers, indoor sign printers, billboard printers, fabric printers, camera printers and fault tolerant commercial printer arrays.<!-- EPO <DP n="12"> --></p>
<heading id="h0008"><b><u style="single">Ink Jet Technologies</u></b></heading>
<p id="p0034" num="0034">The embodiments of the invention use an ink jet printer type device. Of course many different devices could be used. However presently popular ink jet printing technologies are unlikely to be suitable:</p>
<p id="p0035" num="0035">The most significant problem with thermal inkjet is power consumption. This is approximately 100 times that required for high speed, and stems from the energy-inefficient means of drop ejection. This involves the rapid boiling of water to produce a vapor bubble which expels the ink. Water has a very high heat capacity, and must be superheated in thermal inkjet applications. This leads to an efficiency of around 0.02%, from electricity input to drop momentum (and increased surface area) out.</p>
<p id="p0036" num="0036">The most significant problem with piezoelectric inkjet is size and cost. Piezoelectric crystals have a very small deflection at reasonable drive voltages, and therefore require a large area for each nozzle. Also, each piezoelectric actuator must be connected to its drive circuit on a separate substrate. This is not a significant problem at the current limit of around 300 nozzles per print head, but is a major impediment to the fabrication of pagewide print heads with 19,200 nozzles.</p>
<p id="p0037" num="0037">Ideally, the inkjet technologies used meet the stringent requirements of in-camera digital color printing and other high quality, high speed, low cost printing applications. To meet the requirements of digital photography, new inkjet technologies have been created. The target features include:
<ul id="ul0002" list-style="none" compact="compact">
<li>low power (less than 10 Watts)</li>
<li>high resolution capability (1,600 dpi or more)</li>
<li>photographic quality output</li>
<li>low manufacturing cost</li>
<li>small size (pagewidth times minimum cross section)</li>
<li>high speed (&lt; 2 seconds per page).</li>
</ul></p>
<p id="p0038" num="0038">All of these features can be met or exceeded by the inkjet systems described below with differing levels of difficulty. 45 different inkjet technologies have been developed by the Assignee to give a wide range of choices for high volume manufacture. These technologies form part of separate applications assigned to the present Assignee as set out in the table below.</p>
<p id="p0039" num="0039">The inkjet designs shown here are suitable for a wide range of digital printing systems, from battery powered one-time use digital cameras, through to desktop and network printers, and through to commercial printing systems.</p>
<p id="p0040" num="0040">For ease of manufacture using standard process equipment, the print head is designed to be a monolithic 0.5 micron CMOS chip with MEMS post processing. For color photographic applications, the print head is 100 mm long, with a width which depends upon the inkjet type. The smallest print head designed is IJ38, which is 0.35 mm wide, giving a chip area of 35 square mm. The print heads each contain 19,200 nozzles plus data and control circuitry.</p>
<p id="p0041" num="0041">Ink is supplied to the back of the print head by injection molded plastic ink channels. The molding requires 50 micron features, which can be created using a lithographically micromachined insert in a standard injection molding tool. Ink flows through holes etched through the wafer to the nozzle chambers fabricated on the front surface of the wafer. The print head is connected to the camera circuitry by tape automated bonding.</p>
<heading id="h0009"><u style="single">Cross-Referenced Applications</u></heading><!-- EPO <DP n="13"> -->
<p id="p0042" num="0042">The following table is a guide to cross-referenced patent applications filed concurrently herewith and discussed hereinafter with the reference being utilized in subsequent tables when referring to a particular case:
<tables id="tabl0001" num="0001">
<table frame="all">
<tgroup cols="3">
<colspec colnum="1" colname="col1" colwidth="21mm"/>
<colspec colnum="2" colname="col2" colwidth="21mm"/>
<colspec colnum="3" colname="col3" colwidth="115mm"/>
<thead>
<row>
<entry valign="top"><b>Docket No.</b></entry>
<entry valign="top"><b>Reference</b></entry>
<entry align="center" valign="top"><b>Title</b></entry></row></thead>
<tbody>
<row>
<entry>IJOIUS</entry>
<entry>IJ01</entry>
<entry>Radiant Plunger Ink Jet Printer</entry></row>
<row>
<entry>IJ02US</entry>
<entry>IJ02</entry>
<entry>Electrostatic Ink Jet Printer</entry></row>
<row>
<entry>IJ03US</entry>
<entry>IJ03</entry>
<entry>Planar Thermoelastic Bend Actuator Ink Jet</entry></row>
<row>
<entry>IJ04US</entry>
<entry>IJ04</entry>
<entry>Stacked Electrostatic Ink Jet Printer</entry></row>
<row>
<entry>IJ05US</entry>
<entry>IJ05</entry>
<entry>Reverse Spring Lever Ink Jet Printer</entry></row>
<row>
<entry>IJ06US</entry>
<entry>IJ06</entry>
<entry>Paddle Type Ink Jet Printer</entry></row>
<row>
<entry>IJ07US</entry>
<entry>IJ07</entry>
<entry>Permanent Magnet Electromagnetic Ink Jet Printer</entry></row>
<row>
<entry>IJ08US</entry>
<entry>IJ08</entry>
<entry>Planar Swing Grill Electromagnetic Ink Jet Printer</entry></row>
<row>
<entry>IJ09US</entry>
<entry>IJ09</entry>
<entry>Pump Action Refill Ink Jet Printer</entry></row>
<row>
<entry>IJ10US</entry>
<entry>IJ10</entry>
<entry>Pulsed Magnetic Field Ink Jet Printer</entry></row>
<row>
<entry>IJ11US</entry>
<entry>IJ11</entry>
<entry>Two Plate Reverse Firing Electromagnetic Ink Jet Printer</entry></row>
<row>
<entry>IJ12US</entry>
<entry>IJ12</entry>
<entry>Linear Stepper Actuator Ink Jet Printer</entry></row>
<row>
<entry>IJ13US</entry>
<entry>IJ13</entry>
<entry>Gear Driven Shutter Ink Jet Printer</entry></row>
<row>
<entry>IJ14US</entry>
<entry>IJ14</entry>
<entry>Tapered Magnetic Pole Electromagnetic Ink Jet Printer</entry></row>
<row>
<entry>IJ15US</entry>
<entry>IJ15</entry>
<entry>Linear Spring Electromagnetic Grill Ink Jet Printer</entry></row>
<row>
<entry>IJ16US</entry>
<entry>IJ16</entry>
<entry>Lorenz Diaphragm Electromagnetic Ink Jet Printer</entry></row>
<row>
<entry>IJ17US</entry>
<entry>IJ17</entry>
<entry>PTFE Surface Shooting Shuttered Oscillating Pressure</entry></row>
<row>
<entry>IJ18US</entry>
<entry>IJ18</entry>
<entry>Buckle Grip Oscillating Pressure Ink Jet Printer</entry></row>
<row>
<entry>IJ19US</entry>
<entry>IJ19</entry>
<entry>Shutter Based Ink Jet Printer</entry></row>
<row>
<entry>IJ20US</entry>
<entry>IJ20</entry>
<entry>Curling Calyx Thermoelastic Ink Jet Printer</entry></row>
<row>
<entry>IJ21US</entry>
<entry>IJ21</entry>
<entry>Thermal Actuated Ink Jet Printer</entry></row>
<row>
<entry>IJ22US</entry>
<entry>IJ22</entry>
<entry>Iris Motion Ink Jet Printer</entry></row>
<row>
<entry>IJ23US</entry>
<entry>IJ23</entry>
<entry>Direct Firing Thermal Bend Actuator Ink Jet Printer</entry></row>
<row>
<entry>IJ24US</entry>
<entry>IJ24</entry>
<entry>Conductive PTFE Ben Activator Vented Ink Jet Printer</entry></row>
<row>
<entry>IJ25US</entry>
<entry>IJ25</entry>
<entry>Magnetostrictive Ink Jet Printer</entry></row>
<row>
<entry>IJ26US</entry>
<entry>IJ26</entry>
<entry>Shape Memory Alloy Ink Jet Printer</entry></row>
<row>
<entry>IJ27US</entry>
<entry>IJ27</entry>
<entry>Buckle Plate Ink Jet Printer</entry></row>
<row>
<entry>IJ28US</entry>
<entry>IJ28</entry>
<entry>Thermal Elastic Rotary Impeller Ink Jet Printer</entry></row>
<row>
<entry>IJ29US</entry>
<entry>IJ29</entry>
<entry>Thermoelastic Bend Actuator Ink Jet Printer</entry></row>
<row>
<entry>IJ30US</entry>
<entry>IJ30</entry>
<entry>Thermoelastic Bend Actuator Using PTFE and Corrugated Copper Ink Jet Printer</entry></row>
<row>
<entry>IJ31US</entry>
<entry>IJ31</entry>
<entry>Bead Actuator Direct ink Supply Ink Jet Printer</entry></row>
<row>
<entry>IJ32US</entry>
<entry>IJ32</entry>
<entry>A High Young's Modulus Thermoelastic Ink Jet Printer</entry></row>
<row>
<entry>IJ33US</entry>
<entry>IJ33</entry>
<entry>Thermally actuated slotted chamber wall ink jet printer</entry></row>
<row>
<entry>IJ34US</entry>
<entry>IJ34</entry>
<entry>Ink Jet Printer having a thermal acturator comprising an external coiled spring</entry></row>
<row>
<entry>IJ35US</entry>
<entry>IJ35</entry>
<entry>Trough Container Ink Jet Printer</entry></row><!-- EPO <DP n="14"> -->
<row>
<entry>IJ36US</entry>
<entry>IJ36</entry>
<entry>Dual Chamber Single Vertical Actuator Ink Jet</entry></row>
<row>
<entry>IJ37US</entry>
<entry>IJ37</entry>
<entry>Dual Nozzle Single Horizontal Fulcrum Actuator Ink Jet</entry></row>
<row>
<entry>IJ38US</entry>
<entry>IJ38</entry>
<entry>Dual Nozzle Single Horizontal Actuator Ink Jet</entry></row>
<row>
<entry>IJ39US</entry>
<entry>IJ39</entry>
<entry>A single bend actuator cupped paddle ink jet printing device</entry></row>
<row>
<entry>IJ40US</entry>
<entry>IJ40</entry>
<entry>A thermally actuated ink jet printer having a series of thermal actuator units</entry></row>
<row>
<entry>IJ41US</entry>
<entry>IJ41</entry>
<entry>A thermally actuated ink jet printer including a tapered heater element</entry></row>
<row>
<entry>IJ42US</entry>
<entry>IJ42</entry>
<entry>Radial Back-Curling Thermoelastic Ink Jet</entry></row>
<row>
<entry>IJ43US</entry>
<entry>IJ43</entry>
<entry>Inverted Radial Back-Curling Thermoelastic Ink Jet</entry></row>
<row>
<entry>IJ44US</entry>
<entry>IJ44</entry>
<entry>Surface bend actuator vented ink supply ink jet printer</entry></row>
<row>
<entry>IJ45US</entry>
<entry>IJ45</entry>
<entry>Coil Actuated Magnetic Plate Ink Jet Printer</entry></row></tbody></tgroup>
</table>
</tables></p>
<heading id="h0010"><u style="single">Tables of Drop-on-Demand Inkjets</u></heading>
<p id="p0043" num="0043">Eleven important characteristics of the fundamental operation of individual inkjet nozzles have been identified. These characteristics are largely orthogonal, and so can be elucidated as an eleven dimensional matrix. Most of the eleven axes of this matrix include entries developed by the present assignee.</p>
<p id="p0044" num="0044">The following tables form the axes of an eleven dimensional table of inkjet types.<br/>
Actuator mechanism (18 types)<br/>
Basic operation mode (7 types)<br/>
Auxiliary mechanism (8 types)<br/>
Actuator amplification or modification method (17 types)<br/>
Actuator motion (19 types)<br/>
Nozzle refill method (4 types)<br/>
Method of restricting back-flow through inlet (10 types)<br/>
Nozzle clearing method (9 types)<br/>
Nozzle plate construction (9 types)<br/>
Drop ejection direction (5 types)<br/>
Ink type (7 types)</p>
<p id="p0045" num="0045">The complete eleven dimensional table represented by these axes contains 36.9 billion possible configurations of inkjet nozzle. While not all of the possible combinations result in a viable inkjet technology, many million configurations are viable. It is clearly impractical to elucidate all of the possible configurations Instead, certain inkjet types have been investigated in detail. These are designated IJ01 to IJ45 above.</p>
<p id="p0046" num="0046">Other inkjet configurations can readily be derived from these 45 examples by substituting alternative configurations along one or more of the 11 axes. Most of the IJ01 to IJ45 examples can be made into inkjet print heads with characteristics superior to any currently available inkjet technology.</p>
<p id="p0047" num="0047">Where there are prior art examples known to the inventor, one or more of these examples are listed in the examples column of the tables below. The IJ01 to IJ45 series are also listed in the examples column. In some cases, a printer may be listed more than once in a table, where it shares characteristics with more than one entry.</p>
<p id="p0048" num="0048">Suitable applications include: Home printers, Office network printers, Short run digital printers, Commercial<!-- EPO <DP n="15"> --> print systems, Fabric printers, Pocket printers, Internet WWW printers, Video printers, Medical imaging, Wide format printers, Notebook PC printers, Fax machines, Industrial printing systems, Photocopiers, Photographic minilabs etc.</p>
<p id="p0049" num="0049">The information associated with the aforementioned 11 dimensional matrix are set out in the following tables.<!-- EPO <DP n="16"> --></p>
<heading id="h0011"><b><u style="single">Actuator mechanism (applied only to selected ink drops)</u></b></heading>
<p id="p0050" num="0050">
<tables id="tabl0002" num="0002">
<table frame="all">
<tgroup cols="5">
<colspec colnum="1" colname="col1" colwidth="32mm"/>
<colspec colnum="2" colname="col2" colwidth="38mm"/>
<colspec colnum="3" colname="col3" colwidth="34mm"/>
<colspec colnum="4" colname="col4" colwidth="31mm"/>
<colspec colnum="5" colname="col5" colwidth="33mm"/>
<thead>
<row>
<entry valign="top"><b>Actuator Mechanism</b></entry>
<entry valign="top"><b>Description</b></entry>
<entry valign="top"><b>Advantages</b></entry>
<entry valign="top"><b>Disadvantages</b></entry>
<entry valign="top"><b>Examples</b></entry></row></thead>
<tbody>
<row rowsep="0">
<entry rowsep="1"><b>Thermal bubble</b></entry>
<entry rowsep="1">An electrothermal heater heats the ink to above boiling point, transferring significant heat to the aqueous ink. A bubble nucleates and quickly forms, expelling the ink.<br/>
The efficiency of the process is low, with typically less than 0.05% of the electrical energy being transformed into kinetic energy of the drop.</entry>
<entry rowsep="1">◆ Large force generated<br/>
◆ Simple construction<br/>
◆ No moving parts<br/>
◆ Fast operation<br/>
◆ Small chip area required for actuator</entry>
<entry rowsep="1">◆ High power<br/>
◆ Ink carrier limited to water<br/>
◆ Low efficiency<br/>
◆ High temperatures required<br/>
◆ High mechanical stress<br/>
◆ Unusual materials required<br/>
◆ Large drive transistors<br/>
◆ Cavitation causes actuator failure<br/>
◆ Kogation reduces bubble formation<br/>
◆ Large print heads are difficult to fabricate</entry>
<entry rowsep="1">◆ Canon Bubblejet 1979 Endo et al GB patent 2,007,162<br/>
◆ Xerox heater-in-pit 1990 Hawkins et al USP 4,899,181<br/>
◆ Hewlett-Packard TIJ 1982 Vaught et al USP 4,490,728</entry></row>
<row>
<entry><b>Piezoelectric</b></entry>
<entry>A piezoelectric crystal such as lead lanthanum zirconate (PZT) is electrically activated, and either expands, shears, or bends to apply pressure to the ink, ejecting drops.</entry>
<entry>◆ Low power<br/>
consumption<br/>
◆ Many ink types can be used<br/>
◆ Fast operation<br/>
◆ High efficiency</entry>
<entry>◆ Very large area required for actuator<br/>
◆ Difficult to integrate with electronics<br/>
◆ High voltage drive transistors required<br/>
◆ Full pagewidth print heads impractical due to actuator size<br/>
◆ Requires electrical poling in high field strengths during manufacture</entry>
<entry>◆ Kyser et al USP 3,946,398<br/>
◆ Zoltan USP 3,683,212<br/>
◆ 1973 Stemme USP 3,747,120<br/>
◆ Epson Stylus<br/>
◆ Tektronix<br/>
◆ IJ04</entry></row><!-- EPO <DP n="17"> -->
<row rowsep="0">
<entry rowsep="1"><b>Electro-strictive</b></entry>
<entry rowsep="1">An electric field is used to activate electrostriction in relaxor materials such as lead lanthanum zirconate titanate (PLZT) or lead magnesium niobate (PMN).</entry>
<entry rowsep="1">◆ Low power consumption<br/>
◆ Many ink types can be used<br/>
◆ Low thermal expansion<br/>
◆ Electric field strength required (approx. 3.5 V/µm) can be generated without difficulty<br/>
◆ Does not require electrical poling</entry>
<entry rowsep="1">◆ Low maximum strain (approx. 0.01%)<br/>
◆ Large area required for actuator due to low strain<br/>
◆ Response speed is marginal (~10 µs)<br/>
◆ High voltage drive transistors required<br/>
◆ Full pagewidth print heads impractical due to actuator size</entry>
<entry rowsep="1">◆ Seiko Epson, Usui et all JP 253401/96<br/>
◆ IJ04</entry></row>
<row>
<entry><b>Ferroelectric</b></entry>
<entry>An electric field is used to induce a phase transition between the antiferroelectric (AFE) and ferroelectric (FE) phase.<br/>
Perovskite materials such as tin modified lead lantharium zirconate titanate exhibit large strains of up to 1% associated with the AFE to FE phase transition.</entry>
<entry>◆ Low power consumption<br/>
◆ Many ink types can be used<br/>
◆ Fast operation (&lt;1 µs) (PLZSnT)<br/>
◆ Relatively high longitudinal strain<br/>
◆ High efficiency<br/>
◆ Electric field strength of around 3 V/µm can be readily provided</entry>
<entry>◆ Difficult to integrate with electronics<br/>
◆ Unusual materials such as PLZSnT are required<br/>
◆ Actuators require a large area</entry>
<entry>◆ IJ04</entry></row><!-- EPO <DP n="18"> -->
<row rowsep="0">
<entry rowsep="1"><b>Electrostatic plates</b></entry>
<entry rowsep="1">Conductive plates are separated by a compressible or fluid dielectric (usually air). Upon application of a voltage, the plates attract each other and displace ink, causing drop ejection. The conductive plates may be in a comb or honeycomb structure, or stacked to increase the surface area and therefore the force.</entry>
<entry rowsep="1">◆ Low power consumption<br/>
◆ Many ink types can be used<br/>
◆ Fast operation</entry>
<entry rowsep="1">◆ Difficult to operate electrostatic devices in an aqueous environment<br/>
◆ The electrostatic actuator will normally need to be separated from the ink<br/>
◆ Very large area required to achieve high forces<br/>
◆ High voltage drive transistors may be required<br/>
◆ Full pagewidth print heads are not competitive due to actuator size</entry>
<entry rowsep="1">◆ IJ02, IJ04</entry></row>
<row>
<entry><b>Electrostatic pull an Ink</b></entry>
<entry>A strong electric field is applied to the ink, whereupon electrostatic attraction accelerates the ink towards the print medium.</entry>
<entry>◆ Low current consumption<br/>
◆ Low temperature</entry>
<entry>◆ High voltage required<br/>
◆ May be damaged by sparks due to air breakdown<br/>
◆ Required field strength increases as the drop size decreases<br/>
◆ High voltage drive transistors required<br/>
◆ Electrostatic field attracts dust</entry>
<entry>◆ 1989 Saito et al, USP 4,799,068<br/>
◆ 1989 Miura et al, USP 4,810,954<br/>
◆ Tone-jet</entry></row><!-- EPO <DP n="19"> -->
<row rowsep="0">
<entry rowsep="1"><b>Permanent magnet electromagnetic</b></entry>
<entry rowsep="1">An electromagnet directly attracts a permanent magnet, displacing ink and causing drop ejection. Rare earth magnet with a field strength around 1 Tesla can be used. Examples are: Samarium Cobalt (SaCo) and magnetic materials in the neodymium iron boron family (NdFeB, NdDyFeBNb, NdDyFeB, etc)</entry>
<entry rowsep="1">◆ Low power consumption<br/>
◆ Many ink types can be used<br/>
◆ Fast operation<br/>
◆ High efficiency<br/>
◆ Easy extension from single nozzles to pagewidth print heads</entry>
<entry rowsep="1">◆ Complex fabrication<br/>
◆ Permanent magnetic material such as Neodymium Iron Boron (NdFeB) required.<br/>
◆ High local currents required<br/>
◆ Copper metalization should be used for long electromigration lifetime and low resistivity<br/>
◆ Pigmented inks are usually infeasible<br/>
◆ Operating temperature limited to the Curie temperature (around 540 k)</entry>
<entry rowsep="1">◆ IJ07, IJ10</entry></row>
<row>
<entry><b>Soft magnetic core electro-magnetic</b></entry>
<entry>A solenoid induced a magnetic field in a soft magnetic core or yoke fabricated from a ferrous material such as electroplated iron alloys such as CoNiFe [1], CoFe, or NiFe alloys. Typically, the soft magnetic material is in two parts, which are normally held apart by a spring. When the solenoid is actuated, the two parts attract, displacing the ink.</entry>
<entry>◆ Low power consumption<br/>
◆Many ink types can be used<br/>
◆ Fast operation<br/>
◆ High efficiency<br/>
◆ Easy extension from single nozzles to pagewidth print heads</entry>
<entry>◆ Complex fabrication<br/>
◆ Materials not usually present in a CMOS fab such as NiFe, CoNiFe, or CoFe are required<br/>
◆ High local currents required<br/>
◆ Copper metalization should be used for long electromigration lifetime and low resistivity<br/>
◆ Electroplating is required<br/>
◆ High saturation flux density is required (2.0-2.1 T is achievable with CoNiFe [I])</entry>
<entry>◆ IJ01, IJ05, IJ08, IJ10<br/>
◆ IJ12, IJ14, IJ15, IJ17</entry></row><!-- EPO <DP n="20"> -->
<row rowsep="0">
<entry rowsep="1"><b>Magnetic Lorenz force</b></entry>
<entry rowsep="1">The Lorenz force acting on a current carrying wire in a magnetic field is utilized. This allows the magnetic field to be supplied externally to the print head, for example with rare earth permanent magnets. Only the current carrying wire need be fabricated on the print-head, simplifying materials requirements.</entry>
<entry rowsep="1">◆ Low power consumption<br/>
◆ Many ink types can be used<br/>
◆ Fast operation<br/>
◆ High efficiency<br/>
◆ Easy extension from single nozzles to pagewidth print heads</entry>
<entry rowsep="1">◆ Force acts as a twisting motion<br/>
◆Typically, only a quarter of the solenoid length provides force in a useful direction<br/>
◆ High local currents required<br/>
◆ Copper metalization should be used for long electromigration lifetime and low resistivity<br/>
◆ Pigmented inks are usually infeasible</entry>
<entry rowsep="1">◆ IJ06, IJ11, IJ13, IJ16</entry></row>
<row>
<entry><b>Magneto-striction</b></entry>
<entry>The actuator uses the giant magnetostrictive effect of materials such as Terfenol-D (an alloy of terbium, dysprosium and iron developed at the Naval Ordnance Laboratory, hence Ter-Fe-NOL). For best efficiency, the actuator should be pre-stressed to approx. 8 MPa.</entry>
<entry>◆ Many ink types can be used<br/>
◆ Fast operation<br/>
◆ Easy extension from single nozzles to pagewidth print heads<br/>
◆ High force is available</entry>
<entry>◆ Force acts as a twisting motion<br/>
◆ Unusual materials such as Terfenol-D are required<br/>
◆ High local currents required<br/>
◆ Copper metalization should be used for long electromigration lifetime and low resistivity<br/>
◆ Pre-stressing may be required</entry>
<entry>◆ Fischenbeck, USP 4,032,929<br/>
◆ IJ25</entry></row><!-- EPO <DP n="21"> -->
<row rowsep="0">
<entry rowsep="1"><b>Surface tension reduction</b></entry>
<entry rowsep="1">Ink under positive pressure is held in a nozzle by surface tension. The surface tension of the ink is reduced below the bubble threshold, causing the ink to egress from the nozzle.</entry>
<entry rowsep="1">◆ Low power consumption<br/>
◆ Simple construction<br/>
◆ No unusual materials required in fabrication<br/>
◆ High efficiency<br/>
◆ Easy extension from single nozzles to pagewidth print heads</entry>
<entry rowsep="1">◆ Requires supplementary force to effect drop separation<br/>
◆ Requires special ink surfactants<br/>
◆ Speed may be limited by surfactant properties</entry>
<entry rowsep="1">◆ Silverbrook, EP 0771 658 A2 and related patent applications</entry></row>
<row rowsep="0">
<entry rowsep="1"><b>Viscosity reduction</b></entry>
<entry rowsep="1">The ink viscosity is locally reduced to select which drops are to be ejected. A viscosity reduction can be achieved electrothermally with most inks, but special inks can be engineered for a 100:1 viscosity reduction.</entry>
<entry rowsep="1">◆ Simple construction<br/>
◆ No unusual materials required in fabrication<br/>
◆ Easy extension from single nozzles to pagewidth print heads</entry>
<entry rowsep="1">◆ Requires supplementary force to effect drop separation<br/>
◆ Requires special ink viscosity properties<br/>
◆ High speed is difficult to achieve<br/>
◆ Requires oscillating ink pressure<br/>
◆ A high temperature difference (typically 80 degrees) is required</entry>
<entry rowsep="1">◆ Silverbrook, EP 0771 658 A2 and related patent applications</entry></row>
<row>
<entry><b>Acoustic</b></entry>
<entry>An acoustic wave is generated and focussed upon the drop ejection region.</entry>
<entry>◆ Can operate without a nozzle plate</entry>
<entry>◆ Complex drive circuitry<br/>
◆ Complex fabrication<br/>
◆ Low efficiency<br/>
◆ Poor control of drop position<br/>
◆ Poor control of drop volume</entry>
<entry>◆ 1993 Hadimioglu et al, EUP 550,192<br/>
◆ 1993 Elrod et al, EUP 572,220</entry></row><!-- EPO <DP n="22"> -->
<row>
<entry><b>Thermoelastic bend actuator</b></entry>
<entry>An actuator which relies upon differential thermal expansion upon Joule heating is</entry>
<entry>◆Low power consumption<br/>
◆ Many ink types can be used used.<br/>
◆ Simple planar fabrication<br/>
◆ Small chip area required for each actuator<br/>
◆ Fast operation<br/>
◆ High efficiency<br/>
◆ CMOS compatible voltages and currents<br/>
◆ Standard MEMS processes can be used<br/>
◆ Easy extension from single nozzles to pagewidth print heads</entry>
<entry>◆Efficient aqueous operation requires a thermal insulator on the hot side<br/>
◆ Corrosion prevention can be difficult<br/>
◆ Pigmented inks may be infeasible, as pigment particles may jam the bend actuator</entry>
<entry>◆ IJ03, IJ09, IJ17, U18<br/>
◆IJ19, IJ20, IJ21,IJ22<br/>
◆IJ23, IJ24, IJ27, IJ28<br/>
◆IJ29, IJ30, IJ31, IJ32<br/>
◆ IJ33, IJ34, IJ35, IJ36<br/>
◆ IJ37, IJ38, IJ39, IJ40<br/>
◆ IJ41</entry></row><!-- EPO <DP n="23"> -->
<row>
<entry><b>High CTE thermoelastic actuator</b></entry>
<entry>A material with a very high coefficient of thermal expansion (CTE) such as polytetrafluoroethylene (PTFE) is used. As high CTE materials are usually non- conductive, a heater fabricated from a conductive material is incorporated. A 50 µ m long PTFE bend actuator with polysilicon heater and 15 mW power input can provide 180 µN force and 10 µm deflection. Actuator motions include:<br/>
1) Bend<br/>
2) Push<br/>
3) Buckle<br/>
4) Rotate</entry>
<entry>◆ High force can be generated<br/>
◆ PTFE is a candidate for low dielectric constant insulation in ULSI<br/>
◆ Very low power consumption<br/>
◆ Many ink types can be used<br/>
◆ Simple planar fabrication<br/>
◆ Small chip area required for each actuator<br/>
◆ Fast operation<br/>
◆ High efficiency<br/>
◆ CMOS compatible voltages and currents<br/>
◆ Easy extension from single nozzles to pagewidth print heads</entry>
<entry>◆ Requires special material (e.g. PTFE)<br/>
◆ Requires a PTFE deposition process, which is not yet standard in ULSI fabs<br/>
◆ PTFE deposition cannot be followed with high temperature (above 350 °C) processing<br/>
◆ Pigmented inks may be infeasible, as pigment particles may jam the bend actuator</entry>
<entry>◆ IJ09,IJ17,IJ18, IJ20<br/>
◆ IJ21, IJ22, IJ23, IJ24<br/>
◆ IJ27, IJ28, IJ29, IJ30<br/>
◆IJ31, IJ42, IJ43, IJ44</entry></row><!-- EPO <DP n="24"> -->
<row rowsep="0">
<entry rowsep="1"><b>Conductive polymer thermoelastic actuator</b></entry>
<entry rowsep="1">A polymer with a high coefficient of thermal expansion (such as PTFE) is doped with conducting substances to increase its conductivity to about 3 orders of magnitude below that of copper. The conducting polymer expands when resistively heated. Examples of conducting dopants include: 1) Carbon nanotubes 2) Metal fibers 3) Conductive polymers such as doped polythiophene 4) Carbon granules</entry>
<entry rowsep="1">◆ High force can be generated<br/>
◆ Very low power consumption<br/>
◆ Many ink types can be used<br/>
◆ Simple planar fabrication<br/>
◆ Small chip area required for each actuator<br/>
◆ Fast operation<br/>
◆ High efficiency<br/>
◆ CMOS compatible voltages and currents<br/>
◆ Easy extension from single nozzles to pagewidth print heads</entry>
<entry rowsep="1">◆ Requires special materials development (High CTE conductive polymer)<br/>
◆ Requires a PTFE deposition process, which is not yet standard in ULSI fabs<br/>
◆ PTFE deposition cannot be followed with high temperature (above 350 °C) processing<br/>
◆ Evaporation and CVD deposition techniques cannot be used<br/>
◆ Pigmented inks may be infeasible, as pigment particles may jam the bend actuator</entry>
<entry rowsep="1">◆ IJ24</entry></row>
<row>
<entry><b>Shape memory alloy</b></entry>
<entry>A shape memory alloy such as TiNi (also known as Nitinol - Nickel Titanium alloy developed at the Naval Ordnance Laboratory) is thermally switched between its weak martensitic state and its high stiffness austenic state. The shape of the actuator in its martensitic state is deformed relative to the austenic shape. The shape change causes ejection of a drop.</entry>
<entry>◆ High force is available (stresses of hundreds of MPa)<br/>
◆ Large strain is available (more than 3%)<br/>
◆ High corrosion resistance<br/>
◆ Simple construction<br/>
◆ Easy extension from single nozzles to pagewidth print heads<br/>
◆ Low voltage operation</entry>
<entry>◆ Fatigue limits maximum number of cycles<br/>
◆ Low strain (1%) is required to extend fatigue resistance<br/>
◆ Cycle rate limited by heat removal<br/>
◆ Requires unusual materials (TiNi)<br/>
◆ The latent heat of transformation must be provided<br/>
◆ High current operation<br/>
◆ Requires pre-stressing to distort the martensitic state</entry>
<entry>◆ IJ26</entry></row><!-- EPO <DP n="25"> -->
<row rowsep="0">
<entry><b>Linear Magnetic Actuator</b></entry>
<entry>Linear magnetic actuators include the Linear Induction Actuator (LIA), Linear Permanent Magnet Synchronous Actuator (LPMSA), Linear Reluctance Synchronous Actuator (LRSA), Linear Switched Reluctance Actuator (LSRA), and the Linear Stepper Actuator (LSA).</entry>
<entry>◆ Linear Magnetic actuators can be constructed with high thrust, long travel, and high efficiency using planar semiconductor fabrication techniques<br/>
◆ Long actuator travel is available<br/>
◆ Medium force is available<br/>
◆ Low voltage operation</entry>
<entry>◆ Requires unusual semiconductor materials such as soft magnetic alloys (e.g. CoNiFe [1])<br/>
◆ Some varieties also require permanent magnetic materials such as Neodymium iron boron (NdFeB)<br/>
◆ Requires complex multi-phase drive circuitry<br/>
◆ High current operation</entry>
<entry>◆ IJ12</entry></row></tbody></tgroup>
</table>
</tables></p>
<heading id="h0012"><b><u style="single">Basic operation made</u></b></heading>
<p id="p0051" num="0051">
<tables id="tabl0003" num="0003">
<table frame="all">
<tgroup cols="5">
<colspec colnum="1" colname="col1" colwidth="33mm"/>
<colspec colnum="2" colname="col2" colwidth="32mm"/>
<colspec colnum="3" colname="col3" colwidth="32mm"/>
<colspec colnum="4" colname="col4" colwidth="35mm"/>
<colspec colnum="5" colname="col5" colwidth="35mm"/>
<thead>
<row>
<entry valign="top"><b>Operational mode</b></entry>
<entry valign="top"><b>Description</b></entry>
<entry valign="top"><b>Advantages</b></entry>
<entry valign="top"><b>Disadvantages</b></entry>
<entry valign="top"><b>Examples</b></entry></row></thead>
<tbody>
<row>
<entry><b>Actuator directly pushes ink</b></entry>
<entry>This is the simplest mode of operation: the actuator directly supplies sufficient kinetic energy 10 expel the drop. The drop must have a sufficient velocity to overcome the surface tension.</entry>
<entry>◆ Simple operation.<br/>
◆ No external fields required<br/>
◆ Satellite drops can be avoided if drop velocity is less than 4 m/s<br/>
◆ Can be efficient, depending upon the actuator used</entry>
<entry>◆ Drop repetition rate is usually limited to less than 10 kHz. However, this is not fundamental to the method, but is related to the refill method normally used<br/>
◆ All of the drop kinetic energy must be provided by theactuator<br/>
◆ Satellite drops usually form if drop velocity is greater than 4.5 m/s</entry>
<entry>◆ Thermal inkjet<br/>
◆ Piezoelectric inkjet<br/>
◆ IJ01, IJ02, IJ03, IJ04<br/>
◆ IJ05, IJ06, IJ07, IJ09<br/>
◆ IJ11, IJ12, IJ14, IJ16<br/>
◆ IJ20, IJ22, IJ23, IJ24<br/>
◆ IJ25, IJ26, IJ27, IJ28<br/>
◆ IJ29, IJ30, IJ31, IJ32<br/>
◆ IJ33, IJ34, IJ35, IJ36<br/>
◆ IJ37, IJ38, IJ39, IJ40<br/>
◆ IJ41, IJ42, IJ43, IJ44</entry></row><!-- EPO <DP n="26"> -->
<row rowsep="0">
<entry rowsep="1"><b>Proximity</b></entry>
<entry rowsep="1">The drops to be printed are selected by some manner (e.g. thermally induced surface tension reduction of pressurized ink). Selected drops are separated from the ink in the nozzle by contact with the print medium or a transfer roller.</entry>
<entry rowsep="1">◆ Very simple print head fabrication can be used<br/>
◆ The drop selection means does not need to provide the energy required to separate the drop from the nozzle</entry>
<entry rowsep="1">◆ Requires close proximity between the print head and the print media or transfer roller<br/>
◆ May require two print heads printing alternate rows of the image<br/>
◆ Monolithic color print heads are difficult</entry>
<entry rowsep="1">◆ Silverbrook, EP 0771 658 A2 and related patent applications</entry></row>
<row rowsep="0">
<entry rowsep="1"><b>Electrostatic pull on ink</b></entry>
<entry rowsep="1">The drops to be printed are selected by some manner (e.g. thermally induced surface tension reduction of pressurized ink). Selected drops are separated from the ink in the nozzle by a strong electric field,</entry>
<entry rowsep="1">◆ Very simple print head fabrication can be used<br/>
◆ The drop selection means does not need to provide the energy required to separate the drop from the nozzle</entry>
<entry rowsep="1">◆ Requires very high electrostatic field<br/>
◆ Electrostatic field for small nozzle sizes is above air breakdown<br/>
◆ Electrostatic field may attract dust</entry>
<entry rowsep="1">◆ Silverbrook, EP 0771 658 A2 and related patent applications<br/>
◆ Tone-Jet</entry></row>
<row>
<entry><b>Magnetic pull on ink</b></entry>
<entry>The drops to be printed are selected by some manner (e.g. thermally induced surface tension reduction of pressurized ink). Selected drops are separated from the ink in the nozzle by a strong magnetic field acting on the magnetic ink.</entry>
<entry>◆ Very simple print head fabrication can be used<br/>
◆ The drop selection means does not need to provide the energy requited to separate the drop from the nozzle</entry>
<entry>◆ Requires magnetic ink<br/>
◆ Ink colors other than black are difficult<br/>
◆ Requires very high magnetic fields</entry>
<entry>◆ Silverbrook, EP 0771 658 A2 and related patent applications</entry></row><!-- EPO <DP n="27"> -->
<row rowsep="0">
<entry rowsep="1"><b>Shutter</b></entry>
<entry rowsep="1">The actuator moves a shutter to block ink flow to the nozzle. The ink pressure is pulsed at a multiple of the drop ejection frequency.</entry>
<entry rowsep="1">◆ High speed (&gt;50 KHz) operation can be achieved due to reduced refill time<br/>
◆ Drop timing can be very accurate<br/>
◆ The actuator energy can be very low</entry>
<entry rowsep="1">◆ Moving parts are required<br/>
◆ Requires ink pressure modulator<br/>
◆ Friction and wear must be considered<br/>
◆ Stiction is possible</entry>
<entry rowsep="1">◆ IJ13, IJ17, IJ21</entry></row>
<row rowsep="0">
<entry rowsep="1"><b>Shuttered grill</b></entry>
<entry rowsep="1">The actuator moves a shutter to block ink flow through a grill to the nozzle. The shutter movement need only be equal to the width of the grill holes.</entry>
<entry rowsep="1">◆ Actuators with small travel can be used<br/>
◆ Actuators with small force can be used<br/>
◆ High speed (&gt;50 KHz) operation can be achieved</entry>
<entry rowsep="1">◆ Moving parts are required<br/>
◆ Requires ink pressure modulator<br/>
◆ Friction and wear must be considered<br/>
◆ Stiction is possible</entry>
<entry rowsep="1">◆ IJ08, IJ15, IJ18, IJ19</entry></row>
<row rowsep="0">
<entry><b>Pulsed magnetic pull on ink pusher</b></entry>
<entry>A pulsed magnetic field attracts an 'ink pusher' at the drop ejection frequency. An actuator controls a catch, which prevents the ink pusher from moving when a drop is not to be ejected.</entry>
<entry>◆ Extremely low energy operation is possible<br/>
◆ No heat dissipation problems</entry>
<entry>◆ Requires an external pulsed magnetic field<br/>
◆ Requires special materials for both the actuator and the ink pusher<br/>
◆ Complex construction</entry>
<entry>◆ IJ10</entry></row></tbody></tgroup>
</table>
</tables></p>
<heading id="h0013"><b><u style="single">Auxillary mechanism (applied to all nozzles)</u></b></heading>
<p id="p0052" num="0052">
<tables id="tabl0004" num="0004">
<table frame="all">
<tgroup cols="5" rowsep="0">
<colspec colnum="1" colname="col1" colwidth="33mm"/>
<colspec colnum="2" colname="col2" colwidth="32mm"/>
<colspec colnum="3" colname="col3" colwidth="33mm"/>
<colspec colnum="4" colname="col4" colwidth="34mm"/>
<colspec colnum="5" colname="col5" colwidth="35mm"/>
<thead>
<row>
<entry rowsep="1" valign="top"><b>Auxillary Mechanism</b></entry>
<entry rowsep="1" valign="top"><b>Description</b></entry>
<entry rowsep="1" valign="top"><b>Advantages</b></entry>
<entry rowsep="1" valign="top"><b>Disadvantages</b></entry>
<entry rowsep="1" valign="top"><b>Examples</b></entry></row></thead>
<tbody>
<row rowsep="1">
<entry><b>None</b></entry>
<entry>The actuator directly fires the ink drop, and there is no external field or other mechanism required.</entry>
<entry>◆ Simplicity of construction<br/>
◆ Simplicity of operation<br/>
◆ Small physical size</entry>
<entry>◆ Drop ejection energy must be supplied by individual nozzle actuator</entry>
<entry>◆ Most inkjets, including piezoelectric and thermal bubble.<br/>
◆ IJ01-IJ07, IJ09, IJ11<br/>
◆ IJ12, IJ14, IJ20, IJ22<br/>
◆ IJ23-IJ45</entry></row><!-- EPO <DP n="28"> -->
<row>
<entry rowsep="1"><b>Oscillating ink pressure (including acoustic stimulation)</b></entry>
<entry rowsep="1">The ink pressure oscillates, providing much of the drop ejection energy. The actuator selects which drops are to be fired by selectively blocking or enabling nozzles. The ink pressure oscillation may be achieved by vibrating the print head, or preferably by an actuator in the ink supply.</entry>
<entry rowsep="1">◆ Oscillating ink pressure can provide a refill pulse, allowing higher operating speed<br/>
◆ The actuators may operate with much lower energy<br/>
◆ Acoustic lenses can be used to focus the sound on the nozzles</entry>
<entry rowsep="1">◆ Requires external ink pressure oscillator<br/>
◆ Ink pressure phase and amplitude must be carefully controlled<br/>
◆ Acoustic reflections in the ink chamber must be designed for</entry>
<entry rowsep="1">◆ Silverbrook, EP 0771 658 A2 and related patent applications<br/>
◆ IJ08, IJ13, IJ15, IJ17<br/>
◆ IJ18, IJ19, IJ21</entry></row>
<row rowsep="1">
<entry><b>Media proximity</b></entry>
<entry>The print head is placed in close proximity to the print medium. Selected drops protrude from the print head further than unselected drops, and contact the print medium. The drop soaks into the medium fast enough to cause drop separation.</entry>
<entry>◆ Low power<br/>
◆ High accuracy<br/>
◆ Simple print head construction</entry>
<entry>◆ Precision assembly required<br/>
◆ Paper fibers may cause problems<br/>
◆ Cannot print on rough substrates</entry>
<entry>◆ Silverbrook, EP 0771 658 A2 and related patent applications</entry></row><!-- EPO <DP n="29"> -->
<row>
<entry rowsep="1"><b>Transfer roller</b></entry>
<entry rowsep="1">Drops are printed to a transfer roller instead of straight to the print medium. A transfer roller can also be used for proximity drop separation.</entry>
<entry rowsep="1">◆ High accuracy<br/>
◆ Wide range of print substrates can be used<br/>
◆ Ink can be dried on the transfer roller</entry>
<entry rowsep="1">◆ Bulky<br/>
◆ Expensive<br/>
◆ Complex construction</entry>
<entry rowsep="1">◆ Silverbrook, EP 0771 658 A2 and related patent applications<br/>
◆ Tektronix hot melt piezoelectric inkjet<br/>
◆ Any of the IJ series</entry></row>
<row>
<entry rowsep="1"><b>Electrostatic</b></entry>
<entry rowsep="1">An electric field is used to accelerate selected drops towards the print medium.</entry>
<entry rowsep="1">◆ Low power<br/>
◆ Simple print head construction</entry>
<entry rowsep="1">◆ Field strength required for separation of small drops is near or above air breakdown</entry>
<entry rowsep="1">◆ Silverbrook, EP 0771 658 A2 and related patent applications<br/>
◆ Tone-jet</entry></row>
<row>
<entry rowsep="1"><b>Direct magnetic field</b></entry>
<entry rowsep="1">A magnetic field is used to accelerate selected drops of magnetic ink towards the print medium.</entry>
<entry rowsep="1">◆ Low power<br/>
◆ Simple print head construction</entry>
<entry rowsep="1">◆ Requires magnetic ink<br/>
◆ Requires strong magnetic field</entry>
<entry rowsep="1">◆ Silverbrook, BP 0771 658 A2 and related patent applications</entry></row>
<row>
<entry rowsep="1"><b>Cross magnetic field</b></entry>
<entry rowsep="1">The print head is placed in a constant magnetic field. The Lorenz force in a current carrying wire is used to move the actuator.</entry>
<entry rowsep="1">◆ Does not require magnetic materials to be integrated in the print head manufacturing process</entry>
<entry rowsep="1">◆ Requires external magnet<br/>
◆ Current densities may be high, resulting in electromigration problems</entry>
<entry rowsep="1">◆ IJ06, IJ16</entry></row>
<row>
<entry><b>Pulsed magnetic field</b></entry>
<entry>A pulsed magnetic field is used to cyclically attract a paddle, which pushes on the ink. A small actuator moves a catch, which selectively prevents the paddle from moving.</entry>
<entry>◆ Very low power operation is possible<br/>
◆ Small print head size</entry>
<entry>◆ Complex print head construction<br/>
◆ Magnetic materials required in print head</entry>
<entry>◆ IJ10</entry></row></tbody></tgroup>
</table>
</tables></p>
<heading id="h0014"><b><u style="single">Actuator amplification or modification method</u></b></heading><!-- EPO <DP n="30"> -->
<p id="p0053" num="0053">
<tables id="tabl0005" num="0005">
<table frame="all">
<tgroup cols="5">
<colspec colnum="1" colname="col1" colwidth="32mm"/>
<colspec colnum="2" colname="col2" colwidth="33mm"/>
<colspec colnum="3" colname="col3" colwidth="34mm"/>
<colspec colnum="4" colname="col4" colwidth="34mm"/>
<colspec colnum="5" colname="col5" colwidth="35mm"/>
<thead>
<row>
<entry valign="top"><b>Actuator amplification</b></entry>
<entry valign="top"><b>Description</b></entry>
<entry valign="top"><b>Advantages</b></entry>
<entry valign="top"><b>Disadvantages</b></entry>
<entry valign="top"><b>Examples</b></entry></row></thead>
<tbody>
<row rowsep="0">
<entry rowsep="1"><b>None</b></entry>
<entry rowsep="1">No actuator mechanical amplification is used. The actuator directly drives the drop ejection process.</entry>
<entry rowsep="1">◆ Operational simplicity</entry>
<entry rowsep="1">◆ Many actuator mechanisms have insufficient travel, or insufficient force, to efficiently drive the drop ejection process</entry>
<entry rowsep="1">◆ Thermal Bubble inkjet<br/>
◆ IJ01, IJ02, U06, U07<br/>
◆ IJ16, IJ25, IJ26</entry></row>
<row rowsep="0">
<entry rowsep="1"><b>Differential expansion bend actuator</b></entry>
<entry rowsep="1">An actuator material expands more on one side than on the other. The expansion may be thermal, piezoelectric, magnetostrictive, or other mechanism.</entry>
<entry rowsep="1">◆ Provides greater travel in a reduced print head area<br/>
◆ The bend actuator converts a high force low travel actuator mechanism to high travel, lower force mechanism.</entry>
<entry rowsep="1">◆ High stresses are involved<br/>
◆ Care must be taken that the materials do not delaminate<br/>
◆ Residual bend resulting from high temperature or high stress during formation</entry>
<entry rowsep="1">◆ Piezoelectric<br/>
◆ IJ03, IJ09, IJ17-IJ24<br/>
◆IJ27, IJ29-IJ39, U42,<br/>
◆ IJ43, IJ44</entry></row>
<row rowsep="0">
<entry rowsep="1"><b>Transient bend actuator</b></entry>
<entry rowsep="1">A trilayer bend actuator where the two outside layers are identical. This cancels bend due to ambient temperature and residual stress. The actuator only responds to transient heating of one side or the other.</entry>
<entry rowsep="1">◆ Very good temperature stability<br/>
◆ High speed, as a new drop can be fired before heat dissipates<br/>
◆ Cancels residual stress of formation</entry>
<entry rowsep="1">◆ High stresses are involved<br/>
◆ Care must be taken that the materials do not delaminate</entry>
<entry rowsep="1">◆ IJ40, IJ41</entry></row>
<row>
<entry><b>Actuator stack</b></entry>
<entry>A series of thin actuators are stacked. This can be appropriate where actuators require high electric field strength, such as electrostatic and piezoelectric actuators.</entry>
<entry>◆ Increased travel<br/>
◆ Reduced drive voltage</entry>
<entry>◆ Increased fabrication complexity<br/>
◆ Increased possibility of short circuits due to pinholes</entry>
<entry>◆ Some piezoelectric ink jets<br/>
◆ IJ04</entry></row><!-- EPO <DP n="31"> -->
<row rowsep="0">
<entry rowsep="1"><b>Multiple actuators</b></entry>
<entry rowsep="1">Multiple smaller actuators are used simultaneously to move the ink. Each actuator need provide only a portion of the force required.</entry>
<entry rowsep="1">◆ Increases the force available from an actuator<br/>
◆ Multiple actuators can be positioned to control ink Bow accurately</entry>
<entry rowsep="1">◆ Actuator forces may not add linearly, reducing efficiency</entry>
<entry rowsep="1">◆ IJ12, IJ13, IJ18, IJ20<br/>
◆ IJ22, IJ28, U42, IJ43</entry></row>
<row rowsep="0">
<entry rowsep="1"><b>Linear Spring</b></entry>
<entry rowsep="1">A linear spring is used to transform a motion with small travel and high force into a longer travel, lower force motion.</entry>
<entry rowsep="1">◆ Matches low travel actuator with higher travel requirements<br/>
◆ Non-contact method of motion transformation</entry>
<entry rowsep="1">◆ Requires print head area for the spring</entry>
<entry rowsep="1">◆ IJ15</entry></row>
<row rowsep="0">
<entry rowsep="1"><b>Reverse spring</b></entry>
<entry rowsep="1">The actuator loads a spring. When the actuator is turned off, the spring releases, This can reverse the force/distanoe curve of the actuator to make it compatible with the force/time requirements of the drop ejection.</entry>
<entry rowsep="1">◆ Better coupling to the ink</entry>
<entry rowsep="1">◆ Fabrication complexity<br/>
◆ High stress in the spring</entry>
<entry rowsep="1">◆ IJ05, IJ11</entry></row>
<row>
<entry><b>Coiled actuator</b></entry>
<entry>A bend actuator is coiled to provide greater travel in a reduced chip area.</entry>
<entry>◆ Increases travel<br/>
◆ Reduces chip area<br/>
◆ Planar implementations are relatively easy to fabricate.</entry>
<entry>◆ Generally restricted to planar implementations due to extreme fabrication difficulty in other orientations.</entry>
<entry>◆ IJ17, IJ21, U34, IJ35</entry></row><!-- EPO <DP n="32"> -->
<row rowsep="0">
<entry rowsep="1"><b>Flexure bend actuator</b></entry>
<entry rowsep="1">A bend actuator bas a small region near the fixture point, which flexes much more readily than the remainder of the actuator. The actuator flexing is effectively converted from an even coiling to an angular bend, resulting in greater travel of the actuator tip.</entry>
<entry rowsep="1">◆ Simple means of increasing travel of a bend actuator</entry>
<entry rowsep="1">◆ Care must be taken not to exceed the clastic limit in the flexure area<br/>
◆ Stress distribution is very uneven<br/>
◆ Difficult to accurately model with finite element analysis</entry>
<entry rowsep="1">◆ IJ10, IJ19, IJ33</entry></row>
<row rowsep="0">
<entry rowsep="1"><b>Gean</b></entry>
<entry rowsep="1">Gears can be used to increase travel at the expense of duration. Circular gears, rack and pinion, ratchets, and other gearing methods can be used.</entry>
<entry rowsep="1">◆ Low force, low travel actuators can be used<br/>
◆ Can be fabricated using standard surface MEMS processes</entry>
<entry rowsep="1">◆ Moving parts are required<br/>
◆ Several actuator cycles are required<br/>
◆ More complex drive electronics<br/>
◆ Complex construction<br/>
◆ Friction, friction, and wear are possible</entry>
<entry rowsep="1">◆ IJ13</entry></row>
<row rowsep="0">
<entry rowsep="1"><b>Catch</b></entry>
<entry rowsep="1">The actuator controls a small catch. The catch either enables or disables movement of an ink pusher that is controlled in a bulk manner.</entry>
<entry rowsep="1">◆ Very low actuator energy<br/>
◆ Very small actuator size</entry>
<entry rowsep="1">◆ Complex construction<br/>
◆ Requires external force<br/>
◆ Unsuitable for pigmented inks</entry>
<entry rowsep="1">◆ IJ10</entry></row>
<row>
<entry><b>Buckle plate</b></entry>
<entry>A buckle plate can be used to change a slow actuator into a fast motion. It can also convert a high force, low travel actuator into a high travel, medium force motion.</entry>
<entry>◆ Very fast movement achievable</entry>
<entry>◆ Must stay within elastic limits of the materials for long device life<br/>
◆ High stresses involved<br/>
◆ Generally high power requirement</entry>
<entry>◆ S.Hirata et al,"An Ink-jet Head ...", Proc. IEEE MEMS, Feb. 1996, pp 418-423.<br/>
◆ IJ18, IJ27</entry></row><!-- EPO <DP n="33"> -->
<row>
<entry><b>Tapered magnetic pole</b></entry>
<entry>A tapered magnetic pole can increase travel at the expense of force.</entry>
<entry>◆ Linearizes the magnetic force/distance curve</entry>
<entry>◆ Complex construction</entry>
<entry>◆ IJ14</entry></row>
<row rowsep="0">
<entry rowsep="1"><b>Lever</b></entry>
<entry rowsep="1">A lever and fulcrum is used to transform a motion with small travel and high force into a motion with longer travel and lower force. The lever can also reverse the direction of travel.</entry>
<entry rowsep="1">◆ Matches low travel actuator with higher travel requirements<br/>
◆ Fulcrum area has no linear movement, and can be used for a fluid seal</entry>
<entry rowsep="1">◆ High stress around the fulcrum</entry>
<entry rowsep="1">◆ IJ32, IJ36, IJ37</entry></row>
<row rowsep="0">
<entry rowsep="1"><b>Rotary impeller</b></entry>
<entry rowsep="1">The actuator is connected to a rotary impeller. A small angular deflection of the actuator results in a rotation of the impeller vanes, which push the ink against stationary vanes and out of the nozzle.</entry>
<entry rowsep="1">◆ High mechanical advantage<br/>
◆ The ratio of force to travel of the actuator can be matched to the nozzle requirements by varying the number of impeller vanes</entry>
<entry rowsep="1">◆ Complex construction<br/>
◆ Unsuitable for pigmented inks</entry>
<entry rowsep="1">◆ IJ28</entry></row>
<row rowsep="0">
<entry rowsep="1"><b>Acoustic lens</b></entry>
<entry rowsep="1">A refractive or diffractive (e.g. zone plate) acoustic lens is used to concentrate sound Waves.</entry>
<entry rowsep="1">◆ No moving parts</entry>
<entry rowsep="1">◆ Large area required<br/>
◆ Only relevant for acoustic ink jets</entry>
<entry rowsep="1">◆ 1993 Hadimioglu et al, EUP 550,192<br/>
◆ 1993 Elrod et al, BUP 572,220</entry></row>
<row rowsep="0">
<entry><b>Sharp conductive point</b></entry>
<entry>A sharp point is used to concentrate an electrostatic field.</entry>
<entry>◆ Simple construction</entry>
<entry>◆ Difficult to fabricate using standard VLSI processes for a surface ejecting ink-jet<br/>
◆ Only relevant for electrostatic ink jets</entry>
<entry>◆Tone-jet</entry></row></tbody></tgroup>
</table>
</tables></p>
<heading id="h0015"><b><u style="single">Actuator motion</u></b></heading><!-- EPO <DP n="34"> -->
<p id="p0054" num="0054">
<tables id="tabl0006" num="0006">
<table frame="all">
<tgroup cols="5">
<colspec colnum="1" colname="col1" colwidth="33mm"/>
<colspec colnum="2" colname="col2" colwidth="33mm"/>
<colspec colnum="3" colname="col3" colwidth="35mm"/>
<colspec colnum="4" colname="col4" colwidth="34mm"/>
<colspec colnum="5" colname="col5" colwidth="33mm"/>
<thead>
<row>
<entry valign="top"><b>Actuator motion</b></entry>
<entry valign="top"><b>Description</b></entry>
<entry valign="top"><b>Advantages</b></entry>
<entry valign="top"><b>Disadvantages</b></entry>
<entry valign="top"><b>Examples</b></entry></row></thead>
<tbody>
<row rowsep="0">
<entry rowsep="1"><b>Volume expansion</b></entry>
<entry rowsep="1">The volume of the actuator changes, pushing the ink in all directions.</entry>
<entry rowsep="1">◆ Simple construction in the case of thermal ink jet</entry>
<entry rowsep="1">◆ High energy is typically required to achieve volume expansion. This leads to thermal stress, cavitation, and kogation in thermal ink jet implementations</entry>
<entry rowsep="1">◆ Hewlett-Packard Thermal Inkjet<br/>
◆ Canon Bubblejet</entry></row>
<row rowsep="0">
<entry rowsep="1"><b>Linear, normal to chip surface</b></entry>
<entry rowsep="1">The actuator moves in a direction normal to the print head surface. The nozzle is typically in the line of movement.</entry>
<entry rowsep="1">◆ Efficient coupling to ink drops ejected normal to the surface</entry>
<entry rowsep="1">◆ High fabrication complexity may be required to achieve perpendicular motion</entry>
<entry rowsep="1">◆ IJ01, IJ02, IJ04, IJ07<br/>
◆ IJ11, IJ14</entry></row>
<row rowsep="0">
<entry rowsep="1"><b>Linear, parallel to chip surface</b></entry>
<entry rowsep="1">The actuator moves parallel to the print head surface. Drop ejection may still be normal to the surface.</entry>
<entry rowsep="1">◆ Suitable for planar fabrication</entry>
<entry rowsep="1">◆ Fabrication complexity<br/>
◆ Friction<br/>
◆ Stiction</entry>
<entry rowsep="1">◆ IJ12, IJ13, IJ15, IJ33,<br/>
◆IJ34, IJ35, IJ36</entry></row>
<row rowsep="0">
<entry rowsep="1"><b>Membrane push</b></entry>
<entry rowsep="1">An actuator with a high force but small area is used to push a stiff membrane that is in contact with the ink.</entry>
<entry rowsep="1">◆ The effective area of the actuator becomes the membrane area</entry>
<entry rowsep="1">◆ Fabrication complexity<br/>
◆ Actuator size<br/>
◆ Difficulty of integration in a VLSI process</entry>
<entry rowsep="1">◆1982 Howkins USP 4,459,601</entry></row>
<row>
<entry><b>Rotary</b></entry>
<entry>The actuator causes the rotation of some element, such a grill or impeller</entry>
<entry>◆ Rotary levers may be used to increase travel<br/>
◆ Small chip area requirements</entry>
<entry>◆ Device complexity<br/>
◆May have friction at a pivot point</entry>
<entry>◆ IJ05, IJ08, IJ13, IJ28</entry></row><!-- EPO <DP n="35"> -->
<row rowsep="0">
<entry rowsep="1"><b>Bend</b></entry>
<entry rowsep="1">The actuator bends when energized. This may be due to differential thermal expansion, piezoelectric expansion, magnetostriction, or other form of relative dimensional change.</entry>
<entry rowsep="1">◆ A very small change in dimensions can be converted to a large motion.</entry>
<entry rowsep="1">◆ Requires the actuator to be made from at least two distinct layers, or to have a thermal difference across the actuator</entry>
<entry rowsep="1">◆1970 Kyser et al USP 3,946,398<br/>
◆ 1973 Stemme USP 3,747,120<br/>
◆ IJ03, IJ09, IJ10, IJ19<br/>
◆ IJ23, IJ24, IJ25, IJ29<br/>
◆ IJ30, IJ31, IJ33, IJ34<br/>
◆ IJ35</entry></row>
<row rowsep="0">
<entry rowsep="1"><b>Swivel</b></entry>
<entry rowsep="1">The actuator swivels around a central pivot. This motion is suitable where there are opposite forces applied to opposite sides of the paddle, e.g. Lorenz force.</entry>
<entry rowsep="1">◆ Allows operation where the net linear force on the paddle is zero<br/>
◆ Small chip area requirements</entry>
<entry rowsep="1">◆ Inefficient coupling to the ink motion</entry>
<entry rowsep="1">◆ IJ06</entry></row>
<row>
<entry><b>Straighten</b></entry>
<entry>The actuator is normally bent, and straightens when energized.</entry>
<entry>◆ Can be used with shape memory alloys where the austenic phase is planar</entry>
<entry>◆ Requires careful balance of stresses to ensure that the quiescent bend is accurate</entry>
<entry>◆ IJ16,IJ32</entry></row>
<row rowsep="0">
<entry rowsep="1"><b>Double bend</b></entry>
<entry rowsep="1">The actuator bends in one direction when one element is energized, and bends the other way when another element is energized.</entry>
<entry rowsep="1">◆ One actuator can be used to power two nozzles.<br/>
◆ Reduced chip size.<br/>
◆ Not sensitive to ambient temperature</entry>
<entry rowsep="1">◆ Difficult to make the drops ejected by both bend directions identical.<br/>
◆ A small efficiency loss compared to equivalent single bend actuators.</entry>
<entry rowsep="1">◆ IJ36, IJ37, IJ38</entry></row>
<row>
<entry><b>Shear</b></entry>
<entry>Energizing the actuator causes a shear motion in the actuator material.</entry>
<entry>◆ Can increase the effective travel of piezoelectric actuators</entry>
<entry>◆ Not readily applicable to other actuator mechanisms</entry>
<entry>◆ 1985 Fishbeck USP 4,584,590</entry></row><!-- EPO <DP n="36"> -->
<row>
<entry><b>Radial constriction</b></entry>
<entry>The actuator squeezes an ink reservoir, forcing ink from a constricted nozzle.</entry>
<entry>◆ Relatively easy to fabricate single nozzles from glass tubing as macroscopic structures</entry>
<entry>◆ High force required<br/>
◆ Inefficient<br/>
◆ Difficult to integrate with VLSI processes</entry>
<entry>◆ 1970 Zoltan USP 3,683,212</entry></row>
<row>
<entry><b>Coil/uncoil</b></entry>
<entry>A coiled actuator uncoils or coils more tightly. The motion of the free end of the actuator ejects the ink.</entry>
<entry>◆ Easy to fabricate as a planar VLSI process<br/>
◆ Small area required, therefore low cost</entry>
<entry>◆ Difficult to fabricate for non-planar devices<br/>
◆ Poor out-of-plane stiffness</entry>
<entry>◆ IJ17, IJ21, IJ34, IJ35</entry></row>
<row>
<entry><b>Bow</b></entry>
<entry>The actuator bows (or buckles) in the middle when energized.</entry>
<entry>◆ Can increase the speed of travel<br/>
◆ Mechanically rigid</entry>
<entry>◆ Maximum travel is constrained<br/>
◆ High force required</entry>
<entry>◆ IJ16, IJ18, IJ27</entry></row>
<row>
<entry><b>Push-Pull</b></entry>
<entry>Two actuators control a shutter. One actuator pulls the shutter, and the other pushes it.</entry>
<entry>◆ The structure is pinned at both ends, so has a high out-of-plane rigidity</entry>
<entry>◆ Not readily suitable for inkjets which directly push the ink</entry>
<entry>◆ IJ18</entry></row>
<row>
<entry><b>Curl inwards</b></entry>
<entry>A set of actuators curl inwards to reduce the volume of ink that they enclose.</entry>
<entry>◆ Good fluid flow to the region behind the actuator increases efficiency</entry>
<entry>◆ Design complexity</entry>
<entry>◆ IJ20, IJ42</entry></row>
<row>
<entry><b>Curl outwards</b></entry>
<entry>A set of actuators curl outwards, pressurizing Ink in a chamber surrounding the actuators, and expelling ink from a nozzle in the chamber.</entry>
<entry>◆ Relatively simple construction</entry>
<entry>◆ Relatively large chip area</entry>
<entry>◆ IJ43</entry></row>
<row>
<entry><b>Iris</b></entry>
<entry>Multiple vanes enclose a volume of ink. These simultaneously rotate, reducing the volume between the vanes.</entry>
<entry>◆ High efficiency<br/>
◆ Small chip area</entry>
<entry>◆ High fabrication complexity<br/>
◆ Not suitable for pigmented inks</entry>
<entry>◆ IJ22</entry></row><!-- EPO <DP n="37"> -->
<row rowsep="0">
<entry rowsep="1"><b>Acoustic vibration</b></entry>
<entry rowsep="1">The actuator vibrates at a high frequency,</entry>
<entry rowsep="1">◆ The actuator can be physically distant from the ink</entry>
<entry rowsep="1">◆ Large area required for efficient operation at useful frequencies<br/>
◆ Acoustic coupling and crosstalk<br/>
◆ Complex drive circuitry<br/>
◆ Poor control of drop volume and position</entry>
<entry rowsep="1">◆ 1993 Hadimioglu et al, EUP 550,192<br/>
◆ 1993 Elrod et al, EUP 572,220</entry></row>
<row rowsep="0">
<entry><b>None</b></entry>
<entry>In various inkjet designs the actuator does not move.</entry>
<entry>◆ No moving parts</entry>
<entry>◆ Various other tradeoffs are required to eliminate moving parts</entry>
<entry>◆ Silverbrook, EP 0771 658 A2 and related patent applications<br/>
◆ Tone-jet</entry></row></tbody></tgroup>
</table>
</tables></p>
<heading id="h0016"><b><u style="single">Nozzle refill method</u></b></heading>
<p id="p0055" num="0055">
<tables id="tabl0007" num="0007">
<table frame="all">
<tgroup cols="5">
<colspec colnum="1" colname="col1" colwidth="32mm"/>
<colspec colnum="2" colname="col2" colwidth="32mm"/>
<colspec colnum="3" colname="col3" colwidth="34mm"/>
<colspec colnum="4" colname="col4" colwidth="35mm"/>
<colspec colnum="5" colname="col5" colwidth="35mm"/>
<thead>
<row>
<entry valign="top"><b>Nozzle refill method</b></entry>
<entry valign="top"><b>Description</b></entry>
<entry valign="top"><b>Advantages</b></entry>
<entry valign="top"><b>Disadvantages</b></entry>
<entry valign="top"><b>Examples</b></entry></row></thead>
<tbody>
<row>
<entry><b>Surface tension</b></entry>
<entry>After the actuator is energized, it typically returns rapidly to its normal position. This return sucks in air through the nozzle opening. The ink surface tension at the nozzle then exerts a small force restoring the meniscus to a minimum area.</entry>
<entry>◆ Fabrication simplicity rapid<br/>
◆ Operational simplicity</entry>
<entry>◆ Low speed<br/>
◆ Surface tension force relatively small compared to actuator force<br/>
◆ Long refill time usually dominates the total repetition rate</entry>
<entry>◆ Thermal inkjet<br/>
◆ Piezoelectric inkjet<br/>
◆ IJ01-IJ07, IJ10-IJ14<br/>
◆ IJ16, IJ20, IJ22-IJ45</entry></row><!-- EPO <DP n="38"> -->
<row rowsep="0">
<entry rowsep="1"><b>Shuttered oscillating ink pressure</b></entry>
<entry rowsep="1">Ink to the nozzle chamber is provided at a pressure that oscillates at twice the drop ejection frequency. When a drop is to be ejected, the shutter is opened for 3 half cycles: drop ejection, actuator return, and refill.</entry>
<entry rowsep="1">◆ High speed<br/>
◆ Low actuator energy, as the actuator need only open or close the shutter, instead of ejecting the ink drop</entry>
<entry rowsep="1">◆ Requires common ink pressure oscillator<br/>
◆ May not be suitable for pigmented inks</entry>
<entry rowsep="1">◆ IJ08, IJ13, IJ151, IJ17<br/>
◆ IJ18, IJ19, IJ21</entry></row>
<row>
<entry><b>Refill actuator</b></entry>
<entry>After the main actuator has ejected a drop a second (refill) actuator is energized. The refill actuator pushes ink into the nozzle chamber. The refill actuator returns slowly, to prevent its return from emptying the chamber again.</entry>
<entry>◆ High speed, as the nozzle is actively refilled</entry>
<entry>◆ Requires two independent actuators per nozzle</entry>
<entry>◆ IJ09</entry></row>
<row rowsep="0">
<entry><b>Positive ink pressure</b></entry>
<entry>The ink is held a slight positive pressure. After the ink drop is ejected, the nozzle chamber fills quickly as surface tension and ink pressure both operate to refill the nozzle.</entry>
<entry>◆ High refill rate, therefore a high drop repetition rate is possible</entry>
<entry>◆ Surface spill must be prevented<br/>
◆ Highly hydrophobic print head surfaces are required</entry>
<entry>◆ Sillverbrook, EP 0771 658 A2 and related patent applications<br/>
◆ Alternative for:<br/>
◆ IJ01-IJ07, IJ10-IJ14<br/>
◆ IJ16, IJ20, IJ22-IJ45</entry></row></tbody></tgroup>
</table>
</tables></p>
<heading id="h0017"><b><u style="single">Method of restricting back-flow through inlet</u></b></heading>
<p id="p0056" num="0056">
<tables id="tabl0008" num="0008">
<table frame="all">
<tgroup cols="5" rowsep="0">
<colspec colnum="1" colname="col1" colwidth="33mm"/>
<colspec colnum="2" colname="col2" colwidth="32mm"/>
<colspec colnum="3" colname="col3" colwidth="32mm"/>
<colspec colnum="4" colname="col4" colwidth="34mm"/>
<colspec colnum="5" colname="col5" colwidth="35mm"/>
<thead>
<row>
<entry rowsep="1" valign="top"><b>Inlet back-flow restriction method</b></entry>
<entry rowsep="1" valign="top"><b>Description</b></entry>
<entry rowsep="1" valign="top"><b>Advantages</b></entry>
<entry rowsep="1" valign="top"><b>Disadvantages</b></entry>
<entry rowsep="1" valign="top"><b>Examples</b></entry></row></thead>
<tbody>
<row rowsep="1">
<entry><b>Long inlet channel</b></entry>
<entry>The ink inlet channel to the nozzle chamber is made long and relatively narrow, relying on viscous drag to reduce inlet back-flow.</entry>
<entry>◆ Design simplicity<br/>
◆ Operational simplicity<br/>
◆ Reduces crosstalk</entry>
<entry>◆ Restricts refill rate<br/>
◆ May result in a relatively large chip area<br/>
◆ Only partially effective</entry>
<entry>◆ Thermal inkjet<br/>
◆ Piezoelectric inkjet<br/>
◆ IJ42, IJ43</entry></row><!-- EPO <DP n="39"> -->
<row>
<entry rowsep="1"><b>Positive ink pressure</b></entry>
<entry rowsep="1">The ink is under a positive pressure, so that in the quiescent state some of the ink drop already protrudes from the nozzle. This reduces the pressure in the nozzle chamber which is required to eject a certain volume of ink. The reduction in chamber pressure results in a reduction in ink pushed out through the inlet.</entry>
<entry rowsep="1">◆ Drop selection and separation forces can be reduced<br/>
◆ Fast refill time</entry>
<entry rowsep="1">◆ Requires a method (such as a nozzle rim or effective hydrophobizing, or both) to prevent flooding of the ejection surface of the print head.</entry>
<entry rowsep="1">◆ Silverbrook, EP 0771 658 A2 and related patent applications<br/>
◆ Possible operation of the following:<br/>
◆ IJ01-IJ07, IJ09-IJ12<br/>
◆ IJ14, IJ16, IJ20, IJ22,<br/>
◆ IJ23-IJ34, IJ36-IJ41<br/>
◆ IJ44</entry></row>
<row>
<entry rowsep="1"><b>Baffle</b></entry>
<entry rowsep="1">One or more baffles are placed in the inlet ink flow. When the actuator is energized, the rapid ink movement creates eddies which restrict the flow through the inlet. The slower refill process is unrestricted, and does not result in eddies.</entry>
<entry rowsep="1">◆ The refill rate is not as restricted as the inlet method.<br/>
◆ Reduces crosstalk</entry>
<entry rowsep="1">◆ Design complexity long<br/>
◆ May increase fabrication (e.g. Tektronix hot melt Piezoelectric print heads).</entry>
<entry rowsep="1">◆ HP Thermal Ink Jet complexity<br/>
◆ Tektronix piezoelectric ink jet</entry></row>
<row rowsep="1">
<entry><b>Flexible flap restricts inlet</b></entry>
<entry>In this method recently disclosed by Canon, the expanding actuator (bubble) pushes on a flexible flap that restricts the Inlet.</entry>
<entry>◆ Significantly reduces back-flow for edge-shooter thermal ink jet devices</entry>
<entry>◆ Not applicable to most inkjet configurations<br/>
◆ Increased fabrication complexity<br/>
◆ Inelastic deformation of polymer flap results in creep ova extended use</entry>
<entry>◆ Canon</entry></row><!-- EPO <DP n="40"> -->
<row>
<entry rowsep="1"><b>Inlet filter</b></entry>
<entry rowsep="1">A filter is located between the ink inlet and the nozzle chamber. The filter has a multitude of small holes or slots, restricting ink flow. The filter also removes particles which may block the nozzle.</entry>
<entry rowsep="1">◆ Additional advantage of ink filtration<br/>
◆ Ink filter may be fabricated with no additional process steps</entry>
<entry rowsep="1">◆ Restricts refill rate<br/>
◆ May result in complex construction</entry>
<entry rowsep="1">◆ IJ04, IJ12, IJ24, IJ27<br/>
◆ IJ29, IJ30</entry></row>
<row>
<entry rowsep="1"><b>Small inlet compared to nozzle</b></entry>
<entry rowsep="1">The ink inlet channel to the nozzle chamber has a substantially smaller cross section than that of the nozzle, resulting in easier ink egress out of the nozzle than out of the inlet.</entry>
<entry rowsep="1">◆ Design simplicity</entry>
<entry rowsep="1">◆ Restricts refill rate<br/>
◆ May result in a relatively large chip area<br/>
◆Only partially effective</entry>
<entry rowsep="1">◆ IJ02, IJ37, IJ44</entry></row>
<row rowsep="1">
<entry><b>Inlet shutter</b></entry>
<entry>A secondary actuator controls the position of a shutter, closing off the ink inlet when the main actuator is energized.</entry>
<entry>◆ Increases speed of the ink-jet print head operation</entry>
<entry>◆ Requires separate refill actuator and drive circuit</entry>
<entry>◆ IJ09</entry></row>
<row>
<entry rowsep="1"><b>The inlet is located behind the ink- pushing surface</b></entry>
<entry rowsep="1">The method avoids the problem of inlet back-flow by arranging the ink-pushing surface of the actuator between the inlet and the nozzle.</entry>
<entry rowsep="1">◆ Back-flow problem is eliminated</entry>
<entry rowsep="1">◆ Requires careful design to minimize the negative pressure behind the paddle</entry>
<entry rowsep="1">◆ IJ01, IJ03, IJ05, IJ06<br/>
◆ IJ07, IJ10, IJ11, IJ14<br/>
◆ IJ16, IJ22, IJ23, IJ25<br/>
◆ IJ28, IJ31, IJ32, IJ33<br/>
◆ IJ34, IJ35, IJ36, IJ39<br/>
◆ IJ40, IJ41</entry></row>
<row rowsep="1">
<entry><b>Part of the actuator moves to shut off the inlet</b></entry>
<entry>The actuator and a wall of the ink chamber are arranged so that the motion of the actuator closes off the inlet.</entry>
<entry>◆ Significant reductions in back-flow can be achieved<br/>
◆ Compact designs possible</entry>
<entry>◆ Small increase in fabrication complexity</entry>
<entry>◆ IJ07, IJ20, IJ26, IJ38</entry></row><!-- EPO <DP n="41"> -->
<row>
<entry><b>Nozzle actuator does not result to ink back-flow</b></entry>
<entry>In some configurations of ink jet, there is no expansion or movement of an actuator which may cause ink back-flow through the inlet.</entry>
<entry>◆Ink back-flow problem is eliminated</entry>
<entry>◆None related to ink back-flow on actuation</entry>
<entry>◆ Silverbrook, EP 0771 658 A2 and related patent applications<br/>
◆Valve-jet<br/>
◆ Tone-jet<br/>
◆ IJ08, IJ13, IJ15, IJ17.<br/>
◆IJ18, IJ19, IJ21</entry></row></tbody></tgroup>
</table>
</tables></p>
<heading id="h0018"><b><u style="single">Nozzle Clearing Method</u></b></heading>
<p id="p0057" num="0057">
<tables id="tabl0009" num="0009">
<table frame="all">
<tgroup cols="5">
<colspec colnum="1" colname="col1" colwidth="33mm"/>
<colspec colnum="2" colname="col2" colwidth="33mm"/>
<colspec colnum="3" colname="col3" colwidth="34mm"/>
<colspec colnum="4" colname="col4" colwidth="33mm"/>
<colspec colnum="5" colname="col5" colwidth="34mm"/>
<thead>
<row>
<entry valign="top"><b>Nozzle Clearing method</b></entry>
<entry valign="top"><b>Description</b></entry>
<entry valign="top"><b>Advantages</b></entry>
<entry valign="top"><b>Disadvantages</b></entry>
<entry valign="top"><b>Examples</b></entry></row></thead>
<tbody>
<row rowsep="0">
<entry rowsep="1"><b>Normal nozzle firing</b></entry>
<entry rowsep="1">All of the nozzles are fired periodically, before the ink has a chance to dry. When not in use the nozzles are sealed (capped) against air. The nozzle firing is usually performed during a special clearing cycle, after first moving the print head to a cleaning station.</entry>
<entry rowsep="1">◆ No added complexity on the print head</entry>
<entry rowsep="1">◆ May not be sufficient to displace dried ink</entry>
<entry rowsep="1">◆ Most ink jet systems<br/>
◆ IJ01-IJ07, IJ09-IJ12<br/>
◆ IJ14, IJ16, IJ20, IJ22<br/>
◆ IJ23-IJ34,IJ36-IJ45</entry></row>
<row>
<entry><b>Extra power to ink heater</b></entry>
<entry>in systems which heat the ink, but do not boil it under normal situations, nozzle clearing can be achieved by over powering the heater and boiling ink at the nozzle.</entry>
<entry>◆ Can be highly effective if the heater is adjacent to the nozzle</entry>
<entry>◆ Requires higher drive voltage for clearing<br/>
◆ May require larger drive transistors</entry>
<entry>◆ Silverbrook, EP 0771 658 A2 and related patent applications</entry></row><!-- EPO <DP n="42"> -->
<row rowsep="0">
<entry rowsep="1"><b>Rapid succession of actuator pulses</b></entry>
<entry rowsep="1">The actuator is fired in rapid succession. In some configurations, this may cause heat build-up at the nozzle which boils the ink, clearing the nozzle. In other situations, it may cause sufficient vibrations to dislodge clogged nozzles.</entry>
<entry rowsep="1">◆ Does not require extra drive circuits on the print head<br/>
◆ Can be readily controlled and Initiated by digital logic</entry>
<entry rowsep="1">◆ Effectiveness depends substantially upon the configuration of the inkjet nozzle</entry>
<entry rowsep="1">◆ May be used with:<br/>
◆ IJ02-IJ07, IJ09-IJ11<br/>
◆ IJ14, IJ16, IJ20, IJ22<br/>
◆ IJ23-IJ25, IJ27-IJ34<br/>
◆ IJ36-IJ45</entry></row>
<row>
<entry><b>Extra power to ink pushing actuator</b></entry>
<entry>Where an actuator is not normally driven to the limit of its motion, nozzle clearing may be assisted by providing an enhanced drive signal to the actuator.</entry>
<entry>◆ A simple solution where applicable</entry>
<entry>◆ Not suitable where there is a hard limit to actuator movement</entry>
<entry>◆ May be used with:<br/>
◆ IJ03, IJ09, IJ16, IJ20<br/>
◆ IJ23, IJ24, IJ25, IJ27<br/>
◆ IJ29, IJ30, IJ31, IJ32<br/>
◆ IJ39, IJ40, IJ41, IJ42<br/>
◆ IJ43, IJ44, IJ45</entry></row><!-- EPO <DP n="43"> -->
<row rowsep="0">
<entry rowsep="1"><b>Acoustic resonance</b></entry>
<entry rowsep="1">An ultrasonic wave is applied to the ink chamber. This wave is of an appropriate amplitude and frequency to cause sufficient force at the nozzle to clear blockages. This is easiest to achieve if the ultrasonic wave is at a resonant frequency of the ink cavity.</entry>
<entry rowsep="1">◆ A high nozzle clearing capability can be achieved<br/>
◆ May be implemented at very low cost in systems which already include acoustic actuators</entry>
<entry rowsep="1">◆ High implementation cost if system does not already include an acoustic actuator</entry>
<entry rowsep="1">◆ IJ08, IJ13, IJ15, IJ17<br/>
◆ IJ18, IJ19, IJ21</entry></row>
<row rowsep="0">
<entry rowsep="1"><b>Nozzle clearing plate</b></entry>
<entry rowsep="1">A microfabricated plate is pushed against the nozzles. The plate has a post for every nozzle. The array of posts</entry>
<entry rowsep="1">◆ Can clear severely clogged nozzles</entry>
<entry rowsep="1">◆ Accurate mechanical alignment is required<br/>
◆ Moving parts are required<br/>
◆ There is risk of damage to the nozzles<br/>
◆ Accurate fabrication is required</entry>
<entry rowsep="1">◆ Silverbrook, EP 0771 658 A2 and related patent applications</entry></row>
<row rowsep="0">
<entry rowsep="1"><b>Ink pressure pulse</b></entry>
<entry rowsep="1">The pressure of the ink is temporarily increased so that ink streams from all of the nozzles. This may be used in conjunction with actuator energizing.</entry>
<entry rowsep="1">◆ May be effective where other methods cannot be used</entry>
<entry rowsep="1">◆ Requires pressure pump or other pressure actuator<br/>
◆ Expensive<br/>
◆ Wasteful of ink</entry>
<entry rowsep="1">◆ May be used with all U series ink jets</entry></row>
<row>
<entry><b>Print head wiper</b></entry>
<entry>A flexible 'blade' is wiped across the print head surface. The blade is usually fabricated from a flexible polymer, e.g. rubber or synthetic elastomer.</entry>
<entry>◆ Effective for planar print head surfaces<br/>
◆ Low cost</entry>
<entry>◆ Difficult to use if print head surface is non-planar or very fragile<br/>
◆ Requires mechanical parts<br/>
◆ Blade can wear out in high volume print systems</entry>
<entry>◆ Many ink jet systems</entry></row><!-- EPO <DP n="44"> -->
<row rowsep="0">
<entry><b>Separate Ink bolling heater</b></entry>
<entry>A separate heater is provided at the nozzle although the normal drop e-ection mechanism does not require it. The heaters do not require individual drive circuits, as many nozzles can be cleared simultaneously, and no imaging is required.</entry>
<entry>◆ Can be effective where other nozzle clearing methods cannot be used<br/>
◆ Can be implemented at no additional cost in some inkjet configurations</entry>
<entry>◆ Fabrication complexity</entry>
<entry>◆ Can be used with many U series ink jets</entry></row></tbody></tgroup>
</table>
</tables></p>
<heading id="h0019"><b><u style="single">Nozzle plate construction</u></b></heading>
<p id="p0058" num="0058">
<tables id="tabl0010" num="0010">
<table frame="all">
<tgroup cols="5">
<colspec colnum="1" colname="col1" colwidth="32mm"/>
<colspec colnum="2" colname="col2" colwidth="32mm"/>
<colspec colnum="3" colname="col3" colwidth="33mm"/>
<colspec colnum="4" colname="col4" colwidth="35mm"/>
<colspec colnum="5" colname="col5" colwidth="35mm"/>
<thead>
<row>
<entry valign="top"><b>Nozzle plate construction</b></entry>
<entry valign="top"><b>Description</b></entry>
<entry valign="top"><b>Advantages</b></entry>
<entry valign="top"><b>Disadvantages</b></entry>
<entry valign="top"><b>Examples</b></entry></row></thead>
<tbody>
<row rowsep="0">
<entry rowsep="1"><b>Electroformed nickel</b></entry>
<entry rowsep="1">A nozzle plate is separately fabricated from electroformed nickel, and bonded to the print head chip.</entry>
<entry rowsep="1">◆ Fabrication simplicity</entry>
<entry rowsep="1">◆ High temperatures and pressures are required to bond nozzle plate<br/>
◆ Minimum thickness constraints<br/>
◆ Differential thermal expansion</entry>
<entry rowsep="1">◆ Hewlett Packard Thermal Inkjet</entry></row>
<row>
<entry><b>Laser ablated or drilled polymer</b></entry>
<entry>Individual nozzle boles are ablated by an intense UV laser in a nozzle plate, which is typically a polymer such as polyimide or polysulphone</entry>
<entry>◆ No masks required<br/>
◆ Can be quite fast<br/>
◆ Some control over nozzle profile is possible<br/>
◆ Equipment required is relatively low cost</entry>
<entry>◆ Each hole must be individually formed<br/>
◆ Special equipment required<br/>
◆ Slow where there are many thousands of nozzles per print head<br/>
◆ May produce thin burrs at exit holes</entry>
<entry>◆ Canon Bubblejet<br/>
◆ 1988 Sercel et al., SPIE, Vol. 998 Excimer Beam Applications, pp. 76-83<br/>
◆ 1993 Watanabe et al., USP 5,208,604</entry></row><!-- EPO <DP n="45"> -->
<row rowsep="0">
<entry rowsep="1"><b>Silicon micro- machined</b></entry>
<entry rowsep="1">A separate nozzle plate is micromachined from single crystal silicon, and bonded to the print head wafer.</entry>
<entry rowsep="1">◆ High accuracy is attainable</entry>
<entry rowsep="1">◆ Two part construction<br/>
◆ High cost<br/>
◆ Requires precision alignment<br/>
◆ Nozzles may be clogged by adhesive</entry>
<entry rowsep="1">◆ K. Bean, IEEE Transactions on Electron Devices, Vol. ED-25. No. 10, 1978, pp 1185-1195<br/>
◆ Xerox 1990 Hawkins et al., USP 4,899,181</entry></row>
<row>
<entry><b>Glass capillaries</b></entry>
<entry>Fine glass capillaries are drawn from glass tubing. This method has been used for making individual nozzles, but Is difficult to use for bulk manufacturing of print heads with thousands of nozzles.</entry>
<entry>◆ No expensive equipment required<br/>
◆ Simple to make single nozzles</entry>
<entry>◆ Very small nozzle sizes are difficult to form<br/>
◆ Not suited for mass production</entry>
<entry>◆ 1970 Zoltan USP 3,683,212</entry></row><!-- EPO <DP n="46"> -->
<row rowsep="0">
<entry rowsep="1"><b>Monolithic, surface micro-machined using VLSI lithographic processes</b></entry>
<entry rowsep="1">The nozzle plate is deposited as a layer using standard VLSI deposition techniques. Nozzles are etched in the nozzle plate using VLSI lithography and etching.</entry>
<entry rowsep="1">◆ High accuracy (&lt;1 µm)<br/>
◆ Monolithic<br/>
◆ Low cost<br/>
◆ Existing processes can be used</entry>
<entry rowsep="1">◆ Requires sacrificial layer under the nozzle plate to form the nozzle chamber<br/>
◆ Surface may be fragile to the touch</entry>
<entry rowsep="1">◆ Silverbrook, EP 0771 658 A2 and related patent applications<br/>
◆ IJ01, IJ02, IJ04, IJ11<br/>
◆ IJ12, IJ17, IJ18, IJ20<br/>
◆ IJ22, IJ24, IJ27, IJ28<br/>
◆ IJ29, IJ30, IJ31, IJ32<br/>
◆ IJ33, IJ34, IJ36, IJ37<br/>
◆ IJ38, IJ39, IJ40, IJ41<br/>
◆ IJ42, IJ43, IJ44</entry></row>
<row>
<entry><b>Monolithic, etched through substrate</b></entry>
<entry>The nozzle plate is a buried etch stop in the wafer. Nozzle chambers are etched in the front of the wafer, and the wafer is thinned from the back side. Nozzles are then etched in the etch stop layer.</entry>
<entry>◆ High accuracy (&lt;1 µm)<br/>
◆ Monolithic<br/>
◆ Low cost<br/>
◆ No differential expansion</entry>
<entry>◆ Requires long etch times<br/>
◆ Requires a support wafer</entry>
<entry>◆ IJ03, IJ05, IJ06, IJ07<br/>
◆ IJ08, IJ09, IJ10, IJ13<br/>
◆ IJ14, IJ15, IJ16, IJ19<br/>
◆ IJ21, IJ23, IJ25, IJ26</entry></row><!-- EPO <DP n="47"> -->
<row rowsep="0">
<entry rowsep="1"><b>No nozzle plate</b></entry>
<entry rowsep="1">Various methods have been tried to eliminate the nozzles entirely, to prevent nozzle clogging. These include thermal bubble mechanisms and acoustic lens mechanisms</entry>
<entry rowsep="1">◆ No nozzles to become clogged</entry>
<entry rowsep="1">◆ Difficult to control drop position accurately<br/>
◆ Crosstalk problems</entry>
<entry rowsep="1">◆ Ricoh 1995 Sekiya et at USP 5,412,413<br/>
◆ 1993 Hadimioglu et al EUP 550,192<br/>
◆ 1993 Elrod et al EUP 572,220</entry></row>
<row rowsep="0">
<entry rowsep="1"><b>Trough</b></entry>
<entry rowsep="1">Each drop ejector has a trough through which a paddle moves. There is no nozzle plate.</entry>
<entry rowsep="1">◆ Reduced manufacturing complexity<br/>
◆ Monolithic</entry>
<entry rowsep="1">◆ Drop firing direction is sensitive to wicking.</entry>
<entry rowsep="1">◆ IJ35</entry></row>
<row rowsep="0">
<entry><b>Nozzle slit instead of individual nozzles</b></entry>
<entry>The elimination of nozzle holes and replacement by a slit encompassing many actuator positions reduces nozzle clogging, but increases crosstalk due to Ink surface waves</entry>
<entry>◆ No nozzles to become clogged</entry>
<entry>◆ Difficult to control drop position accurately<br/>
◆ Crosstalk problems</entry>
<entry>◆ 1989 Saito et al USP 4,799,068</entry></row></tbody></tgroup>
</table>
</tables></p>
<heading id="h0020"><b><u style="single">Drop ejection direction</u></b></heading>
<p id="p0059" num="0059">
<tables id="tabl0011" num="0011">
<table frame="all">
<tgroup cols="5" rowsep="0">
<colspec colnum="1" colname="col1" colwidth="33mm"/>
<colspec colnum="2" colname="col2" colwidth="32mm"/>
<colspec colnum="3" colname="col3" colwidth="33mm"/>
<colspec colnum="4" colname="col4" colwidth="35mm"/>
<colspec colnum="5" colname="col5" colwidth="35mm"/>
<thead>
<row>
<entry rowsep="1" valign="top"><b>Ejection direction</b></entry>
<entry rowsep="1" valign="top"><b>Description</b></entry>
<entry rowsep="1" valign="top"><b>Advantages</b></entry>
<entry rowsep="1" valign="top"><b>Disadvantages</b></entry>
<entry rowsep="1" valign="top"><b>Examples</b></entry></row></thead>
<tbody>
<row rowsep="1">
<entry><b>Edge. ('edge shooter')</b></entry>
<entry>Ink flow is along the surface of the chip, and ink drops are ejected from the chip edge.</entry>
<entry>◆ Simple construction<br/>
◆ No silicon etching required<br/>
◆ Good heat sinking via substrate<br/>
◆ Mechanically strong<br/>
◆ Ease of chip handing</entry>
<entry>◆ Nozzles limited to edge<br/>
◆ High resolution is difficult<br/>
◆ Fast color printing requires one print head per color head per color</entry>
<entry>◆ Canon Bubblejet 1979 Endo et al GB patent 2,007,162<br/>
◆ Xerox heater-in-pit 1990 Hawkins et al USP 4,899,181<br/>
◆ Tone-jet</entry></row><!-- EPO <DP n="48"> -->
<row>
<entry rowsep="1"><b>Surface ('roof shooter')</b></entry>
<entry rowsep="1">Ink flow is along the surface of the chip, and ink drops are ejected from the chip surface, normal to the plane of the chip.</entry>
<entry rowsep="1">◆ No bulk silicon etching required<br/>
◆ Silicon can make an effective heat sink<br/>
◆ Mechanical strength</entry>
<entry rowsep="1">◆ Maximum ink flow is severely restricted</entry>
<entry rowsep="1">◆ Hewlett-Packard TIJ 1982 Vaught et al USP 4,490,728<br/>
◆ IJ02, IJ11, IJ12, IJ20<br/>
◆ IJ22</entry></row>
<row rowsep="1">
<entry><b>Through chip, forward ('up shooter')</b></entry>
<entry>Ink flow is through the chip, and ink drops are ejected from the front surface of the chip.</entry>
<entry>◆ High ink flow<br/>
◆ Suitable for pagewidth print<br/>
◆ High nozzle packing density therefore low manufacturing cost</entry>
<entry>◆ Requires bulk silicon etching</entry>
<entry>◆ Silverbrook, EP 0771 658 A2 and related patent applications<br/>
◆ IJ04, IJ17, IJ18, IJ24<br/>
◆ IJ27-IJ45</entry></row><!-- EPO <DP n="49"> -->
<row>
<entry rowsep="1"><b>Through chip, reverse ('down shooter')</b></entry>
<entry rowsep="1">Ink flow is through the chip, and ink drops are ejected from the rear surface of the chip.</entry>
<entry rowsep="1">◆ High ink flow<br/>
◆ Suitable for pagewidth print<br/>
◆ High nozzle packing density therefore low manufacturing cost</entry>
<entry rowsep="1">◆ Requires wafer thinning<br/>
◆ Requires special handling during manufacture</entry>
<entry rowsep="1">◆ IJ01, IJ03, IJ05, IJ06<br/>
◆ IJ07, IJ08, IJ09, IJ10<br/>
◆ IJ13. IJ14, IJ15, IJ16<br/>
◆ IJ19, IJ21, IJ23, IJ25<br/>
◆ IJ26</entry></row>
<row>
<entry><b>Through actuator</b></entry>
<entry>Ink flow is though the actuator, which is not fabricated as part of the same substrate as the drive transistors.</entry>
<entry>◆ Suitable for piezoelectric print heads</entry>
<entry>◆ Pagewidth print heads require several thousand connections to drive circuits<br/>
◆ Cannot be manufactured in standard CMOS fabs<br/>
◆ Complex assembly required</entry>
<entry>◆ Epson Stylus<br/>
◆ Tektronix hot melt piezoelectric ink Jets</entry></row></tbody></tgroup>
</table>
</tables></p>
<heading id="h0021"><b><u style="single">Ink type</u></b></heading>
<p id="p0060" num="0060">
<tables id="tabl0012" num="0012">
<table frame="all">
<tgroup cols="5" rowsep="0">
<colspec colnum="1" colname="col1" colwidth="34mm"/>
<colspec colnum="2" colname="col2" colwidth="33mm"/>
<colspec colnum="3" colname="col3" colwidth="33mm"/>
<colspec colnum="4" colname="col4" colwidth="33mm"/>
<colspec colnum="5" colname="col5" colwidth="34mm"/>
<thead>
<row>
<entry rowsep="1" valign="top"><b>Ink type</b></entry>
<entry rowsep="1" valign="top"><b>Description</b></entry>
<entry rowsep="1" valign="top"><b>Advantages</b></entry>
<entry rowsep="1" valign="top"><b>Disadvantages</b></entry>
<entry rowsep="1" valign="top"><b>Examples</b></entry></row></thead>
<tbody>
<row rowsep="1">
<entry><b>Aqueous, dye</b></entry>
<entry>Water based ink which typically contains: water, dye, surfactant, humectant, and biocide. Modem ink dyes have high water- fastness, light fastness</entry>
<entry>◆ Environmentally friendly<br/>
◆ No odor</entry>
<entry>◆ Slow drying<br/>
◆ Corrosive<br/>
◆ Bleeds on paper<br/>
◆ May strikethrough<br/>
◆ Cockles paper</entry>
<entry>◆ Most existing inkjets<br/>
◆ All IJ series ink jets<br/>
◆ Silverbrook, EP 0771 658 A2 and related patent applications</entry></row><!-- EPO <DP n="50"> -->
<row>
<entry rowsep="1"><b>Aqueous, pigment</b></entry>
<entry rowsep="1">Water based ink which typically contains: water, pigment, surfactant, humectant, and biocide. Pigments have an advantage in reduced bleed, wicking and strikethrough.</entry>
<entry rowsep="1">◆ Environmentally friendly<br/>
◆ No odor<br/>
◆ Reduced bleed<br/>
◆ Reduced wicking<br/>
◆ Reduced strikethrough</entry>
<entry rowsep="1">◆ Slow drying<br/>
◆ Corrosive<br/>
◆ Pigment may clog nozzles<br/>
◆ Pigment may clog actuator mechanisms<br/>
◆ Cockles paper</entry>
<entry rowsep="1">◆ IJ02, IJ04, IJ21, IJ26<br/>
◆ IJ27, IJ30<br/>
◆ Silverbrook, EP 0771658 A2 and related patent applications<br/>
◆ Piezoelectric ink-jets<br/>
◆ Thermal ink jets (with significant restrictions)</entry></row>
<row rowsep="1">
<entry><b>Methyl Ethyl Ketone (MEK)</b></entry>
<entry>MEK is a highly volatile solvent used for industrial printing on difficult surfaces such as aluminum cans.</entry>
<entry>◆ Very fast drying<br/>
◆ Prints on various substrates such as metals and plastics</entry>
<entry>◆ Odorous<br/>
◆ Flammable</entry>
<entry><b>◆</b> All IJ series ink jets</entry></row><!-- EPO <DP n="51"> -->
<row>
<entry rowsep="1"><b>Alcohol (ethanol, 2-butanol, and others)</b></entry>
<entry rowsep="1">Alcohol based inks can be used where the printer must operate at temperatures below the freezing point of water. An example of this is in-camera consumer photographic printing.</entry>
<entry rowsep="1">◆ Fast drying<br/>
◆ Operates at sub-freezing temperatures<br/>
◆ Reduced paper cockle<br/>
◆ Low cost</entry>
<entry rowsep="1">◆ Slight odor<br/>
◆ Flammable</entry>
<entry rowsep="1">◆ All IJ series ink jets</entry></row>
<row>
<entry rowsep="1"><b>Phase change (hot melt)</b></entry>
<entry rowsep="1">The ink is solid at room temperature, and is melted in the print head before jetting. Hot melt inks are usually wax based, with a melting point around 80 °C. After jetting the ink freezes almost instantly upon contacting the print medium or a transfer roller.</entry>
<entry rowsep="1">◆ No drying time- ink instantly freezes on the print medium<br/>
◆ Almost any print medium can be used<br/>
◆ No paper cockle occurs<br/>
◆ No wicking occurs<br/>
◆No bleed occurs<br/>
◆ No strikethrough occurs</entry>
<entry rowsep="1">◆ High viscosity<br/>
◆ Printed ink typically has a 'waxy' feel<br/>
◆ Printed pages may 'block'<br/>
◆ Ink temperature may be above the curie point of permanent magnets<br/>
◆ Ink heaters consume power<br/>
◆ Long warm-up time</entry>
<entry rowsep="1">◆ Tektronix hot melt piezoelectric ink jets<br/>
◆ 1989 Nowak USP 4,820,346<br/>
◆All IJ series ink jets</entry></row>
<row>
<entry><b>Oil</b></entry>
<entry>Oil based inks are extensively used in offset printing. They have advantages in improved characteristics on paper (especially no wicking or coclde). Oil soluble dies and pigments are required.</entry>
<entry>◆ High solubility medium for some dyes<br/>
◆ Does not cockle paper<br/>
◆ Does not wick through paper</entry>
<entry>◆ High viscosity: this is a significant limitation for use in inkjets, which usually require a low viscosity. Some short chain and mwd-branched oils have a sufficiently low viscosity<br/>
◆ Slow drying</entry>
<entry>◆ All IJ series ink jets</entry></row></tbody></tgroup>
</table>
</tables><!-- EPO <DP n="52"> --></p>
<heading id="h0022"><b><u style="single">Ink Jet Printing</u></b></heading>
<p id="p0061" num="0061">A large number of new forms of ink jet printers have been developed to facilitate alternative ink jet technologies for the image processing and data distribution system. Various combinations of ink jet devices can be included in printer devices incorporated as part of the present invention.<!-- EPO <DP n="53"> --></p>
<heading id="h0023"><b><u style="single">Ink Jet Manufacturing</u></b></heading>
<p id="p0062" num="0062">Further, the present application may utilize advanced semiconductor fabrication techniques in the construction of large arrays of ink jet printers.<!-- EPO <DP n="54"> --></p>
<heading id="h0024"><b><u style="single">Fluid Supply</u></b></heading>
<p id="p0063" num="0063">Further, the present application may utilize an ink delivery system to the ink jet head.</p>
<heading id="h0025"><b><u style="single">MEMS Technology</u></b></heading>
<p id="p0064" num="0064">Further, the present application may utilize advanced semiconductor microelectromechanical techniques in the construction of large arrays of ink jet printers.<!-- EPO <DP n="55"> --></p>
<heading id="h0026"><b><u style="single">IR Technologies</u></b></heading>
<p id="p0065" num="0065">Further, the present application may include the utilization of a disposable camera system.</p>
<heading id="h0027"><b><u style="single">DotCard Technologies</u></b></heading>
<p id="p0066" num="0066">Further, the present application may include the utilization of a data distribution system.<!-- EPO <DP n="56"> --></p>
<heading id="h0028"><b><u style="single">Arteam Technologies</u></b></heading>
<p id="p0067" num="0067">Further, the present application may include the utilization of camera and data processing techniques such as an Artcam type device.<!-- EPO <DP n="57"> --></p>
<p id="p0068" num="0068">It would be appreciated by a person skilled in the art that numerous variations and/or modifications may be made to the present invention as shown in the specific embodiment without departing from the scope of the invention as broadly described. The present embodiment is, therefore, to be considered in all respects to be illustrative and not restrictive.</p>
</description><!-- EPO <DP n="58"> -->
<claims id="claims01" lang="en">
<claim id="c-en-01-0001" num="0001">
<claim-text>An ink jet nozzle arrangement (1510), said nozzle comprising:
<claim-text>a nozzle chamber (1518) having an ink ejection port (1513) and having one moveable wall (1511) including an electromagnetic coil (1514), said nozzle chamber being in a magnetic field such that, upon activation of said electromagnetic coil, said moveable wall experiences a lorenz force and is caused to move so as to result in the ejection of ink from said nozzle chamber via said ink ejection port,</claim-text>
<b>characterized in that</b> said moveable wall interconnects said nozzle chamber (1518) with an ink supply chamber (1519) and said nozzle chamber is refilled from said ink supply chamber upon said ejection of ink.</claim-text></claim>
<claim id="c-en-01-0002" num="0002">
<claim-text>An ink jet nozzle arrangement (1510) as claimed in claim 1 wherein said moveable wall is caused to bend upon activation.</claim-text></claim>
<claim id="c-en-01-0003" num="0003">
<claim-text>An ink jet nozzle arrangement (1510) as claimed in claims 1 or 2 wherein said moveable wall (1511) is corrugated for providing an elastic bending motion.</claim-text></claim>
<claim id="c-en-01-0004" num="0004">
<claim-text>The inkjet nozzle arrangement (1510) as claimed in any one of claims 1 to 3, wherein refill of said nozzle chamber (1518) is via two slots (1522, 1523) on either side of said moveable wall (1511).</claim-text></claim>
<claim id="c-en-01-0005" num="0005">
<claim-text>An ink jet nozzle arrangement (1510) as claimed in any of claims 1 to 4 wherein said electromagnetic coil (1514) includes multiple layers.</claim-text></claim>
<claim id="c-en-01-0006" num="0006">
<claim-text>An ink jet nozzle arrangement (1510) as claimed in any of claims 1 to 5 wherein said electromagnetic coil (1514) comprises substantially copper.</claim-text></claim>
<claim id="c-en-01-0007" num="0007">
<claim-text>An ink jet nozzle arrangement (1510) as claimed in any of claims 1 to 6 wherein said magnetic field is permanent.</claim-text></claim>
<claim id="c-en-01-0008" num="0008">
<claim-text>An ink jet nozzle arrangement (1510) as claimed in claim 7 wherein said magnetic field is provided by neodymium iron boron magnets.</claim-text></claim>
</claims><!-- EPO <DP n="59"> -->
<claims id="claims02" lang="de">
<claim id="c-de-01-0001" num="0001">
<claim-text>Tintenstrahl-Düsenanordnung (1510), wobei die Düse umfasst:
<claim-text>eine Düsenkammer (1518) mit einer Tintenausstoßöffnung (1513) und einer bewegbaren Wand (1511) mit einer elektromagnetischen Spule (1514), wobei sich die Düsenkammer so in einem magnetischen Feld befindet, dass bei Aktivierung der elektromagnetischen Spule die bewegbare Wand eine Lorenz-Kraft erfährt und dazu gebracht wird, sich zu bewegen, was zum Ausstoßen von Tinte aus der Düsenkammer über die Tintenausstoßöffnung führt,</claim-text>
<b>dadurch gekennzeichnet, dass</b> die bewegbare Wand die Düsenkammer (1518) mit einer Tintenzufuhrkammer (1519) verbindet und die Düsenkammer beim Ausstoßen von Tinte aus der Tintenzufuhrkammer wieder mit Tinte aufgefüllt wird.</claim-text></claim>
<claim id="c-de-01-0002" num="0002">
<claim-text>Tintenstrahl-Düsenanordnung (1510) nach Anspruch 1, bei der die bewegbare Wand dazu gebracht wird, sich bei Aktivierung zu verbiegen.</claim-text></claim>
<claim id="c-de-01-0003" num="0003">
<claim-text>Tintenstrahl-Düsenanordnung (1510) nach Anspruch 1 oder 2, bei der die bewegbare Wand (1511) zur Bereitstellung einer elastischen Biegebewegung gewellt ist.</claim-text></claim>
<claim id="c-de-01-0004" num="0004">
<claim-text>Tintenstrahl-Düsenanordnung (1510) nach einem der Ansprüche 1 bis 3, bei der das Wiederauffüllen der Düsenkammer (1518) über zwei Schlitze (1522, 1523) auf jeder Seite der bewegbaren Wand (1511) stattfindet.</claim-text></claim>
<claim id="c-de-01-0005" num="0005">
<claim-text>Tintenstrahl-Düsenanordnung (1510) nach einem der Ansprüche 1 bis 4, bei der die elektromagnetische Spule (1514) mehrere Schichten umfasst.<!-- EPO <DP n="60"> --></claim-text></claim>
<claim id="c-de-01-0006" num="0006">
<claim-text>Tintenstrahl-Düsenanordnung (1510) nach einem der Ansprüche 1 bis 5, bei der die elektromagnetische Spule (1514) im Wesentlichen aus Kupfer besteht.</claim-text></claim>
<claim id="c-de-01-0007" num="0007">
<claim-text>Tintenstrahl-Düsenanordnung (1510) nach einem der Ansprüche 1 bis 6, bei der das magnetische Feld permanent ist.</claim-text></claim>
<claim id="c-de-01-0008" num="0008">
<claim-text>Tintenstrahl-Düsenanordnung (1510) nach Anspruch 7, bei der das magnetische Feld durch Neodym/Eisen/Bor-Magnete bereitgestellt wird.</claim-text></claim>
</claims><!-- EPO <DP n="61"> -->
<claims id="claims03" lang="fr">
<claim id="c-fr-01-0001" num="0001">
<claim-text>Agencement de buse de jet d'encre (1510), ladite buse comprenant :
<claim-text>une chambre de buse (1518) ayant un port d'éjection d'encre (1513) et ayant une paroi mobile (1511) incluant une bobine électromagnétique (1514), ladite chambre de buse étant dans un champ magnétique tel que, suite à l'activation de ladite bobine électromagnétique, ladite paroi mobile subit une force de lorenz et est mise en mouvement de manière à résulter en l'éjection de l'encre de ladite chambre de buse par ledit port d'éjection d'encre,</claim-text>
<b>caractérisé en ce que</b> la paroi mobile interconnecte ladite chambre de buse (1518) avec une chambre de fourniture d'encre (1519) et ladite chambre de buse est remplie à partir de ladite chambre de fourniture d'encre suite à ladite éjection d'encre.</claim-text></claim>
<claim id="c-fr-01-0002" num="0002">
<claim-text>Un agencement de buse de jet d'encre (1510) tel que revendiqué dans la revendication 1 dans lequel l'activation provoque une courbure de ladite paroi mobile.</claim-text></claim>
<claim id="c-fr-01-0003" num="0003">
<claim-text>Agencement de buse de jet d'encre (1510) comme revendiqué dans la revendication 1 ou 2 dans lequel ladite paroi mobile (1511) est ondulée pour fournir un mouvement de courbure élastique.</claim-text></claim>
<claim id="c-fr-01-0004" num="0004">
<claim-text>Agencement de buse de jet d'encre (1510) comme revendiqué dans l'une quelconque des revendications 1 à 3, dans lequel le remplissage de ladite chambre de buse (1518) a eu lieu par deux fentes (1522, 1523) de chaque côté de ladite paroi mobile (1511).</claim-text></claim>
<claim id="c-fr-01-0005" num="0005">
<claim-text>Agencement de buse de jet d'encre (1510) comme revendiqué dans les revendications 1 à 4 dans lequel ladite bobine électromagnétique (1514) comporte plusieurs couches.</claim-text></claim>
<claim id="c-fr-01-0006" num="0006">
<claim-text>Agencement de buse de jet d'encre (1510) comme revendiqué dans l'une quelconque des revendications 1 à 5 dans lequel la bobine électromagnétique (1514) comporte substantiellement du cuivre.</claim-text></claim>
<claim id="c-fr-01-0007" num="0007">
<claim-text>Agencement de buse de jet d'encre (1510) comme revendiqué dans l'une quelconque des revendications 1 à 6 dans lequel ledit champ magnétique est permanent.</claim-text></claim>
<claim id="c-fr-01-0008" num="0008">
<claim-text>Agencement de buse de jet d'encre (1510) comme revendiqué dans la revendication 7 dans lequel ledit champ magnétique est fourni par des aimants néodyme fer bore.</claim-text></claim>
</claims><!-- EPO <DP n="62"> -->
<drawings id="draw" lang="en">
<figure id="f0001" num=""><img id="if0001" file="imgf0001.tif" wi="162" he="217" img-content="drawing" img-format="tif"/></figure><!-- EPO <DP n="63"> -->
<figure id="f0002" num=""><img id="if0002" file="imgf0002.tif" wi="137" he="219" img-content="drawing" img-format="tif"/></figure><!-- EPO <DP n="64"> -->
<figure id="f0003" num=""><img id="if0003" file="imgf0003.tif" wi="165" he="205" img-content="drawing" img-format="tif"/></figure><!-- EPO <DP n="65"> -->
<figure id="f0004" num=""><img id="if0004" file="imgf0004.tif" wi="157" he="215" img-content="drawing" img-format="tif"/></figure><!-- EPO <DP n="66"> -->
<figure id="f0005" num=""><img id="if0005" file="imgf0005.tif" wi="161" he="210" img-content="drawing" img-format="tif"/></figure><!-- EPO <DP n="67"> -->
<figure id="f0006" num=""><img id="if0006" file="imgf0006.tif" wi="165" he="227" img-content="drawing" img-format="tif"/></figure><!-- EPO <DP n="68"> -->
<figure id="f0007" num=""><img id="if0007" file="imgf0007.tif" wi="165" he="218" img-content="drawing" img-format="tif"/></figure><!-- EPO <DP n="69"> -->
<figure id="f0008" num=""><img id="if0008" file="imgf0008.tif" wi="165" he="205" img-content="drawing" img-format="tif"/></figure><!-- EPO <DP n="70"> -->
<figure id="f0009" num=""><img id="if0009" file="imgf0009.tif" wi="165" he="158" img-content="drawing" img-format="tif"/></figure><!-- EPO <DP n="71"> -->
<figure id="f0010" num=""><img id="if0010" file="imgf0010.tif" wi="165" he="144" img-content="drawing" img-format="tif"/></figure>
</drawings>
</ep-patent-document>
