<?xml version="1.0" encoding="UTF-8"?>
<!DOCTYPE ep-patent-document PUBLIC "-//EPO//EP PATENT DOCUMENT 1.1//EN" "ep-patent-document-v1-1.dtd">
<ep-patent-document id="EP04024060B1" file="EP04024060NWB1.xml" lang="en" country="EP" doc-number="1510339" kind="B1" date-publ="20070124" status="n" dtd-version="ep-patent-document-v1-1">
<SDOBI lang="en"><B000><eptags><B001EP>ATBECHDEDKESFRGBGRITLI..NLSE..PTIE......FI......................................</B001EP><B005EP>J</B005EP><B007EP>DIM360 (Ver 1.5  21 Nov 2005) -  2100000/0</B007EP></eptags></B000><B100><B110>1510339</B110><B120><B121>EUROPEAN PATENT SPECIFICATION</B121></B120><B130>B1</B130><B140><date>20070124</date></B140><B190>EP</B190></B100><B200><B210>04024060.8</B210><B220><date>19980715</date></B220><B240><B241><date>20041008</date></B241><B242><date>20051026</date></B242></B240><B250>en</B250><B251EP>en</B251EP><B260>en</B260></B200><B300><B310>PO806697</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO807297</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO807197</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO804797</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO803597</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO804497</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO806397</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO805697</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO806997</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO804997</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO803697</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO804897</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO807097</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO806797</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO800197</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO804197</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO800497</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO793597</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO793697</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO806197</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO805497</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO806597</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO805597</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO805397</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO793397</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO795097</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO794997</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO806097</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO805997</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO807397</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO807697</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO807597</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO807797</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PO805897</B310><B320><date>19970715</date></B320><B330><ctry>AU</ctry></B330><B310>PP398398</B310><B320><date>19980609</date></B320><B330><ctry>AU</ctry></B330><B310>PP398298</B310><B320><date>19980609</date></B320><B330><ctry>AU</ctry></B330></B300><B400><B405><date>20070124</date><bnum>200704</bnum></B405><B430><date>20050302</date><bnum>200509</bnum></B430><B450><date>20070124</date><bnum>200704</bnum></B450><B452EP><date>20060831</date></B452EP></B400><B500><B510EP><classification-ipcr sequence="1"><text>B41J   2/045       20060101AFI20050105BHEP        </text></classification-ipcr><classification-ipcr sequence="2"><text>B41J   2/14        20060101ALI20050105BHEP        </text></classification-ipcr><classification-ipcr sequence="3"><text>B41J   2/16        20060101ALI20050105BHEP        </text></classification-ipcr></B510EP><B540><B541>de</B541><B542>Durch magnetische Impulse betriebene Tintenstrahldüse</B542><B541>en</B541><B542>Inkjet nozzle actuated by magnetic pulses</B542><B541>fr</B541><B542>Buse de jet d'encre actionnée par des impulsions magnétiques</B542></B540><B560><B561><text>DE-A- 3 245 283</text></B561><B562><text>PATENT ABSTRACTS OF JAPAN vol. 018, no. 133 (M-1571), 4 March 1994 (1994-03-04) &amp; JP 05 318724 A (SEIKOSHA CO LTD), 3 December 1993 (1993-12-03)</text></B562><B562><text>PATENT ABSTRACTS OF JAPAN vol. 017, no. 248 (M-1411), 18 May 1993 (1993-05-18) &amp; JP 04 368851 A (SEIKO EPSON CORP), 21 December 1992 (1992-12-21)</text></B562><B562><text>PATENT ABSTRACTS OF JAPAN vol. 009, no. 294 (M-431), 20 November 1985 (1985-11-20) &amp; JP 60 131254 A (RICOH KK), 12 July 1985 (1985-07-12)</text></B562></B560><B590><B598>138</B598></B590></B500><B600><B620><parent><pdoc><dnum><anum>98933350.5</anum><pnum>0999933</pnum></dnum><date>19980715</date></pdoc></parent></B620></B600><B700><B720><B721><snm>Silverbrook, Kia</snm><adr><str>214 Catherine Street</str><city>Leichhardt
NSW 2040</city><ctry>AU</ctry></adr></B721></B720><B730><B731><snm>Silverbrook Research Pty. Limited</snm><iid>02699020</iid><irf>IJF-EP Div4</irf><adr><str>393 Darling Street</str><city>Balmain, NSW 2041</city><ctry>AU</ctry></adr></B731></B730><B740><B741><snm>Moore, Barry</snm><sfx>et al</sfx><iid>00126142</iid><adr><str>Hanna, Moore &amp; Curley 
13 Lower Lad Lane</str><city>Dublin 2</city><ctry>IE</ctry></adr></B741></B740></B700><B800><B840><ctry>AT</ctry><ctry>BE</ctry><ctry>CH</ctry><ctry>DE</ctry><ctry>DK</ctry><ctry>ES</ctry><ctry>FI</ctry><ctry>FR</ctry><ctry>GB</ctry><ctry>GR</ctry><ctry>IE</ctry><ctry>IT</ctry><ctry>LI</ctry><ctry>NL</ctry><ctry>PT</ctry><ctry>SE</ctry></B840><B880><date>20050309</date><bnum>200510</bnum></B880></B800></SDOBI><!-- EPO <DP n="1"> -->
<description id="desc" lang="en">
<heading id="h0001"><b>Field of Invention</b></heading>
<p id="p0001" num="0001">The present invention relates to the field of ink jet printing systems.</p>
<heading id="h0002"><b>Background of the Art</b></heading>
<p id="p0002" num="0002">Many different types of printing have been invented, a large number of which are presently in use. The known forms of print have a variety of methods for marking the print media with a relevant marking media. Commonly used forms of printing include offset printing, laser printing and copying devices, dot matrix type impact printers, thermal paper printers, film recorders, thermal wax printers, dye sublimation printers and ink jet printers both of the drop on demand and continuous flow type. Each type of printer has its own advantages and problems when considering cost, speed, quality, reliability, simplicity of construction and operation etc.</p>
<p id="p0003" num="0003">In recent years, the field of ink jet printing, wherein each individual pixel of ink is derived from one or more ink nozzles has become increasingly popular primarily due to its inexpensive and versatile nature.</p>
<p id="p0004" num="0004">Many different techniques of ink jet printing have been invented. For a survey of the field, reference is made to an article by J Moore, "Non-Impact Printing: Introduction and Historical Perspective", Output Hard Copy Devices, Editors R Dubeck and S Sherr, pages 207 - 220 (1988).</p>
<p id="p0005" num="0005">Ink jet printers themselves come in many different types. The utilisation of a continuous stream ink in ink jet printing appears to date back to at least 1929 wherein US Patent No. 1941001 by Hansell discloses a simple form of continuous stream electro-static inkjet printing.</p>
<p id="p0006" num="0006">US Patent 3596275 by Sweet also discloses a process of a continuous ink jet printing including the step wherein the ink jet stream is modulated by a high frequency electro-static field so as to cause drop separation. This technique is still utilized by several manufacturers including Elmjet and Scitex (see also US Patent No. 3373437 by Sweet et al)</p>
<p id="p0007" num="0007">Piezo-electric ink jet printers are also one form of commonly utilized ink jet printing device. Piezo-electric systems are disclosed by Kyser et. al. in US Patent No. 3946398 (1970) which utilises a diaphragm mode of operation, by Zolten in US Patent 3683212 (1970) which discloses a squeeze mode of operation of a piezo electric crystal, Stemme in US Patent No. 3747120 (1972) discloses a bend mode of piezo-electric operation, Howkins in US Patent No. 4459601 discloses a Piezo electric push mode actuation of the ink jet stream and Fischbeck in US 4584590 which discloses a sheer mode type of piezo-electric transducer element.</p>
<p id="p0008" num="0008">Recently, thermal ink jet printing has become an extremely popular form of ink jet printing. The ink jet printing techniques include those disclosed by Endo et al in GB 2007162 (1979) and Vaught et al in US Patent 4490728. Both the aforementioned references disclosed ink jet printing techniques rely upon the activation of an electrothermal actuator which results in the creation of a bubble in a constricted space, such as a nozzle, which thereby causes the ejection of ink from an aperture connected to the confined space onto a relevant print media. Printing devices utilising the electro-thermal actuator are manufactured by manufacturers such as Canon and Hewlett Packard.</p>
<p id="p0009" num="0009">DE3234283 describes an inkjet nozzle comprising an electromagnet and an armature constructed as a tongue. When the electromagnet is activated and deactivated, the tongue rapidly moves, thereby ejecting ink from the nozzle.</p>
<p id="p0010" num="0010">JP05318724 describes an inkjet nozzle comprising a plastic magnetic plate positioned adjacent a magnetic substrate. Upon activation of an electromagnet, the magnetic plate is moved relative the substrate, thereby generating a pressure wave in the nozzle and causing ejection of ink.</p>
<p id="p0011" num="0011">As can be seen from the foregoing, many different types of printing technologies are available. Ideally, a printing technology should have a number of desirable attributes. These include inexpensive construction and<!-- EPO <DP n="2"> --> operation, high speed operation, safe and continuous long term operation etc. Each technology may have its own advantages and disadvantages in the areas of cost, speed, quality, reliability, power usage, simplicity of construction operation, durability and consumables.</p>
<p id="p0012" num="0012">Many ink jet printing mechanisms are known. Unfortunately, in mass production techniques, the production of ink jet heads is quite difficult. For example, often, the orifice or nozzle plate is constructed separately from the ink supply and ink ejection mechanism and bonded to the mechanism at a later stage (Hewlett-Packard Journal, Vol. 36 no 5, pp33-37 (1985)). These separate material processing steps required in handling such precision devices often adds a substantially expense in manufacturing.</p>
<p id="p0013" num="0013">Additionally, side shooting ink jet technologies (U.S. Patent No. 4,899,181) are often used but again, this limit the amount ofmass production throughput given any particular capital investment.</p>
<p id="p0014" num="0014">Additionally, more esoteric techniques are also often utilized. These can include electroforming of nickel stage (Hewiett-Packard Journal, Vol. 36 no 5, pp33-37 (1985)), electro-discharge machining, laser ablation (U.S. Patent No. 5,208,604), micro-punching, etc.</p>
<p id="p0015" num="0015">The utilisation of the above techniques is likely to add substantial expense to the mass production of ink jet print heads and therefore add substantially to their final cost.</p>
<p id="p0016" num="0016">It would therefore be desirable if an efficient system for the mass production of ink jet print heads could be developed.</p>
<heading id="h0003"><b><u style="single">Summary of the invention</u></b></heading>
<p id="p0017" num="0017">It is an object of the present invention to provide for an ink jet printing mechanism having a series of ink ejection nozzles, with the nozzles including an internal selective actuator mechanism activated on a nozzle by nozzle basis by the placement of a field around said nozzles.</p>
<p id="p0018" num="0018">Accordingly the invention provides an arrangement according to claim 1. Advantageous embodiments are provided in the dependent claims.<!-- EPO <DP n="3"> --></p>
<heading id="h0004"><b><u style="single">Brief Description of the Drawings</u></b></heading>
<p id="p0019" num="0019">Notwithstanding any other forms which may fall within the scope of the present invention, preferred forms of the invention will now be described, by way of example only, with reference to the accompanying drawings in which:<!-- EPO <DP n="4"> -->
<ul id="ul0001" list-style="none" compact="compact">
<li>Fig. 138 is a perspective, partly sectional view of a single ink jet nozzle in its quiescent position constructed in accordance with an embodiment;</li>
<li>Fig. 139 is a perspective, partly sectional view of a single ink jet nozzle in its firing position constructed in accordance with an embodiment;</li>
<li>Fig. 140 is an exploded perspective illustrating the construction of a single ink jet nozzle in accordance with an embodiment;</li>
<li>Fig. 141 provides a legend of the materials indicated in Fig. 142 to Fig. 156; and</li>
<li>Fig. 142 to Fig. 156 illustrate sectional views of the manufacturing steps in one form of construction of an ink jet printhead nozzle.</li>
</ul><!-- EPO <DP n="5"> --></p>
<heading id="h0005"><b><u style="single">Description of the Preferred and Other Embodiments</u></b></heading>
<p id="p0020" num="0020">The preferred embodiments and other embodiments will be discussed under separate headings with the heading including an IJ number for ease of reference. The headings also include a type designator with T indicating thermal, S indicating shutter type and F indicating a field type.<!-- EPO <DP n="6"> --></p>
<heading id="h0006"><b><u style="single">Description of IJ10 TF</u></b></heading>
<p id="p0021" num="0021">In an embodiment, an array of ink jet nozzles is provided with each of the nozzles being under the influence of a outside pulsed magnetic field. The outside pulsed magnetic field causes selected nozzles to eject ink from their ink nozzle chambers.</p>
<p id="p0022" num="0022">Turning to Fig. 138 and Fig. 139, there is illustrated a side perspective view, partly in section, of a single ink jet nozzle 910. Fig. 138 illustrates a nozzle in a quiescent position and Fig. 139 illustrates a nozzle in an ink ejection position. The ink jet nozzle 910 has an ink ejection port 911 for the ejection of ink on demand. The ink jet ejection port 911 is connected to an ink nozzle chamber 912 which is usually filled with ink and supplied from an ink reservoir 913 via holes eg. 915.</p>
<p id="p0023" num="0023">A magnetic actuation device 925 is included and comprises a magnetic soft core 917 which is surrounded by a nitride coating eg. 918. The nitride coating includes an end protuberance 927.</p>
<p id="p0024" num="0024">The magnetic core 917, operates under the influence of an external pulsed magnetic field. Hence, when the external magnetic field is very high, the actuator 925 is caused to move rapidly downwards and to thereby cause the ejection of ink from the ink ejection port 911. Adjacent the actuator 920 is provided a locking mechanism 920 which comprises a thermal actuator which includes a copper resistive circuit having two arms 922, 924. A current is passed through the connected arms 922, 924 thereby causing them to be heated. The arm 922, being of a thinner construction undergoes more resistive heating than the arm 924 which has a much thicker structure. The arm 922 is also of a serpentine nature and is encased in polytetrafluoroethylene (PTFE) which has a high coefficient of thermal expansion, thereby increasing the degree of expansion upon heating. The copper portions expand with the PTFE<!-- EPO <DP n="7"> --> portions by means of concertinaing. The arm 924 has a thinned portion 929 (Fig. 140) which becomes the concentrated bending region in the resolution of the various forces activated upon heating. Hence, any bending of arm 924 is accentuated in the region 929 and upon heating, the region 929 bends so that end portion 926 (Fig. 138) moves out to block any downward movement of the edge 927 of the actuator 925. Hence, when it is desired to eject an ink drop from a current nozzle chamber, the locking mechanism 920 is not activated and as a result ink is ejected from the ink ejection port during the next external magnetic pulse phase. When a current nozzle is not to eject ink, the locking mechanism 920 is activated to block any movement of the actuator 925 and therefore stop the ejection of ink from the chamber.</p>
<p id="p0025" num="0025">Importantly, the actuator 920 is located within a cavity 928 such that the volume of ink flowing past arm 922 is extremely low whereas the arm 924 receives a much larger volume of ink flow during operation.</p>
<p id="p0026" num="0026">Turning now to Fig. 140, there is illustrated an exploded perspective view of a single ink jet nozzle 910 illustrating the various layers which make up the nozzle. The nozzle 910 can be constructed on a semiconductor wafer utilizing standard semiconductor processing techniques in addition to those techniques commonly used for the construction of micro-electromechanical systems (MEMS). For a general introduction to a micro-electro mechanical system (MEMS) reference is made to standard proceedings in this field including the proceedings of the SPIE (International Society for Optical Engineering), volumes 2642 and 2882 which contain the proceedings for recent advances and conferences in this field. At the bottom level 930 is constructed the nozzle plate including the ink ejection port 911. The nozzle plate 930 can be constructed from a buried boron doped epitaxial layer of a silicon wafer which has been back etched to the point of the epitaxial layer. The epitaxial layer itself is then etched utilizing a mask so as to form the nozzle rim (not shown) and the nozzle hole 911.</p>
<p id="p0027" num="0027">Next, is the silicon wafer layer 932 which is etched so as to include the nozzle chamber 912. The silicon layer 932 can be etched to contain substantially vertical side walls through the utilisation of high density, low pressure plasma etching such as that available from Surface Technology. Systems and subsequently filled with sacrificial material which will be later etched away.</p>
<p id="p0028" num="0028">On top of the silicon layer is deposited a two level CMOS circuitry layer 933 which comprises substantially glass in addition to the usual metal and poly layers. The layer 933 includes the formation of the heater element contacts which can be constructed from copper. The PTFE layer 935 can be provided as a departure from normal construction with a bottom PTFE layer being first deposited followed by the copper layer 934 and a second PTFE layer to cover the copper layer 934.</p>
<p id="p0029" num="0029">Next, a nitride passivation layer 936 is provided which acts to provide a passivation surface for the lower layers in addition to providing a base for a soft magnetic Nickel Ferrous layer 917 which forms the magnetic actuator portion of the actuator 925. The nitride layer 936 includes bending portions 940 utilized in the bending of the actuator.</p>
<p id="p0030" num="0030">Next a nitride passivation layer 939 is provided so as to passivate the top and side surfaces of the nickel iron (NiFe) layer 917.</p>
<p id="p0031" num="0031">One form of detailed manufacturing process which can be used to fabricate monolithic ink jet print heads operating in accordance with the principles taught by the present embodiment can proceed utilizing the following steps:
<ol id="ol0001" compact="compact" ol-style="">
<li>1. Using a double sided polished wafer deposit 3 microns of epitaxial silicon heavily doped with boron.<!-- EPO <DP n="8"> --></li>
<li>2. Deposit 10 microns of epitaxial silicon, either p-type or n-type, depending upon the CMOS process used.</li>
<li>3. Complete drive transistors, data distribution, and timing circuits using a 0.5 micron, one poly, 2 metal CMOS process. Relevant features of the wafer at this step are shown in Fig. 142. For clarity, these diagrams may not be to scale, and may not represent a cross section though any single plane of the nozzle. Fig. 141 is a key to representations of various materials in these manufacturing diagrams, and those of other cross referenced ink jet configurations.</li>
<li>4. Etch the CMOS oxide layers down to silicon or aluminum using Mask 1. This mask defines the nozzle chamber, and the edges of the print head chips. This step is shown in Fig. 143.</li>
<li>5. Crystallographically etch the exposed silicon using, for example, KOH or EDP (ethylenediamine pyrocatechol). This etch stops on &lt;111&gt; crystallographic planes, and on the boron doped silicon buried layer. This step is shown in Fig. 144.</li>
<li>6. Deposit 0.5 microns of silicon nitride (Si<sub>3</sub>N<sub>4</sub>).</li>
<li>7. Deposit 10 microns of sacrificial material. Planarize down to one micron over nitride using CMP. The sacrificial material temporarily fills the nozzle cavity. This step is shown in Fig. 145.</li>
<li>8. Deposit 0.5 microns of polytetrafluoroethylene (PTFE).</li>
<li>9. Etch contact vias in the PTFE, the sacrificial material, nitride, and CMOS oxide layers down to second level metal using Mask 2. This step is shown in Fig. 146.</li>
<li>10. Deposit 1 micron of titanium nitride (TiN).</li>
<li>11. Etch the TiN using Mask 3. This mask defines the heater pattern for the hot arm of the catch actuator, the cold arm of the catch actuator, and the catch. This step is shown in Fig. 147.</li>
<li>12. Deposit 1 micron of PTFE.</li>
<li>13. Etch both layers of PTFE using Mask 4. This mask defines the sleeve of the hot arm of the catch actuator. This step is shown in Fig. 148.</li>
<li>14. Deposit a seed layer for electroplating.</li>
<li>15. Spin on 11 microns of resist, and expose and develop the resist using Mask 5. This mask defines the magnetic paddle. This step is shown in Fig. 149.</li>
<li>16. Electroplate 10 microns of ferromagnetic material such as nickel iron (NiFe). This step is shown in Fig. 150.</li>
<li>17. Strip the resist and etch the seed layer.</li>
<li>18. Deposit 0.5 microns of low stress PECVD silicon nitride.</li>
<li>19. Etch the nitride using Mask 6, which defines the spring. This step is shown in Fig. 151.</li>
<li>20. Mount the wafer on a glass blank and back-etch the wafer using KOH with no mask. This etch thins the wafer and stops at the buried boron doped silicon layer, This step is shown in Fig. 152.</li>
<li>21. Plasma back-etch the boron doped silicon layer to a depth of 1 micron using Mask 7. This mask defines the nozzle rim. This step is shown in Fig. 153.</li>
<li>22. Plasma back-etch through the boron doped layer using Mask 8. This mask defines the nozzle, and the edge of the chips.</li>
<li>23. Plasma back-etch nitride up to the glass sacrificial layer through the holes in the boron doped silicon layer. At this stage, the chips are separate, but are still mounted on the glass blank. This step is shown in Fig. 154.<!-- EPO <DP n="9"> --></li>
<li>24. strip the adhesive layer to detach the chips from the glass blank.</li>
<li>25. Etch the sacrificial layer. This step is shown in Fig. 155.</li>
<li>26. Mount the print heads in their packaging, which may be a molded plastic former incorporating ink channels which supply different colors of ink to the appropriate regions of the front surface of the wafer.</li>
<li>27. Connect the print heads to their interconnect systems.</li>
<li>28. Hydrophobize the front surface of the print heads.</li>
<li>29. Fill the completed print heads with ink, apply an oscillating magnetic field, and test the print heads. This step is shown in Fig. 156.</li>
</ol><!-- EPO <DP n="10"> --></p>
<heading id="h0007"><b><u style="single">IJ USES</u></b></heading>
<p id="p0032" num="0032">The presently disclosed ink jet printing technology is potentially suited to a wide range of printing system including: colour and monochrome office printers, short run digital printers, high speed digital printers, offset press supplemental printers, low cost scanning printers high speed pagewidth printers, notebook computers with inbuilt pagewidth printers, portable colour and monochrome printers, colour and monochrome copiers, colour and monochrome facsimile machines, combined printer, facsimile and copying machines, label printers, large format plotters, photograph copiers, printers for digital photographic "minilabs", video printers, PhotoCD printers, portable printers for PDAs, wallpaper printers, indoor sign printers, billboard printers, fabric printers, camera printers and fault tolerant commercial printer arrays.<!-- EPO <DP n="11"> --></p>
<heading id="h0008"><b><u style="single">Ink Jet Technologies</u></b></heading>
<p id="p0033" num="0033">The embodiments of the invention use an ink jet printer type device. Of course many different devices could be used. However presently popular ink jet printing technologies are unlikely to be suitable.</p>
<p id="p0034" num="0034">The most significant problem with thermal inkjet is power consumption. This is approximately 100 times that required for high speed, and stems from the energy-inefficient means of drop ejection. This involves the rapid boiling of water to produce a vapor bubble which expels the ink. Water has a very high heat capacity, and must be superheated in thermal inkjet applications. This leads to an efficiency of around 0.02%, from electricity input to drop momentum (and increased surface area) out.</p>
<p id="p0035" num="0035">The most significant problem with piezoelectric inkjet is size and cost. Piezoelectric crystals have a very small deflection at reasonable drive voltages, and therefore require a large area for each nozzle. Also, each piezoelectric actuator must be connected to its drive circuit on a separate substrate. This is not a significant problem at the current limit of around 300 nozzles per print head, but is a major impediment to the fabrication of pagewide print heads with 19,200 nozzles.</p>
<p id="p0036" num="0036">Ideally, the inkjet technologies used meet the stringent requirements of in-camera digital color printing and other high quality, high speed, low cost printing applications. To meet the requirements of digital photography, new inkjet technologies have been created. The target features include:
<ul id="ul0002" list-style="none" compact="compact">
<li>low power (less than 10 Watts)</li>
<li>high resolution capability (1,600 dpi or more)</li>
<li>photographic quality output</li>
<li>low manufacturing cost</li>
<li>small size (pagewidth times minimum cross section)</li>
<li>high speed (&lt;2 seconds per page).</li>
</ul></p>
<p id="p0037" num="0037">All of these features can be met or exceeded by the inkjet systems described below with differing levels of difficulty. 45 different inkjet technologies have been developed by the Assignee to give a wide range of choices for high volume manufacture. These technologies form part of separate applications assigned to the present Assignee as set out in the table below.</p>
<p id="p0038" num="0038">The inkjet designs shown here are suitable for a wide range of digital printing systems, from battery powered one-time use digital cameras, through to desktop and network printers, and through to commercial printing systems</p>
<p id="p0039" num="0039">For ease of manufacture using standard process equipment, the print head is designed to be a monolithic 0.5 micron CMOS chip with MEMS post processing. For color photographic applications, the print head is 100 mm long, with a width which depends upon the inkjet type. The smallest print head designed is IJ38, which is 0.35 mm wide, giving a chip area of 35 square mm. The print heads each contain 19,200 nozzles plus data and control circuitry.</p>
<p id="p0040" num="0040">Ink is supplied to the back of the print head by injection molded plastic ink channels. The molding requires 50 micron features, which can be created using a lithographically micromachined insert in a standard injection molding tooL Ink flows through holes etched through the wafer to the nozzle chambers fabricated on the front surface of the wafer. The print head is connected to the camera circuitry by tape automated bonding.</p>
<heading id="h0009"><b><u style="single">Cross-Referenced Applications</u></b></heading><!-- EPO <DP n="12"> -->
<p id="p0041" num="0041">The following table is a guide to cross-referenced patent applications filed concurrently herewith and discussed hereinafter with the reference being utilized in subsequent tables when referring to a particular case:
<tables id="tabl0001" num="0001">
<table frame="all">
<tgroup cols="3">
<colspec colnum="1" colname="col1" colwidth="21mm"/>
<colspec colnum="2" colname="col2" colwidth="21mm"/>
<colspec colnum="3" colname="col3" colwidth="115mm"/>
<thead>
<row>
<entry valign="top"><b>Docket No.</b></entry>
<entry valign="top"><b>Reference</b></entry>
<entry align="center" valign="top"><b>Title</b></entry></row></thead>
<tbody>
<row>
<entry>IJ01US</entry>
<entry>IJ01</entry>
<entry>Radiant Plunger Ink Jet Printer</entry></row>
<row>
<entry>IJ02US</entry>
<entry>U02</entry>
<entry>Electrostatic Ink Jet Printer</entry></row>
<row>
<entry>IJ03US</entry>
<entry>IJ03</entry>
<entry>Planar Thermoelastic Bend Actuator Ink Jet</entry></row>
<row>
<entry>IJ04US</entry>
<entry>IJ04</entry>
<entry>Stacked Electrostatic Ink Jet Printer</entry></row>
<row>
<entry>IJ05US</entry>
<entry>IJ05</entry>
<entry>Reverse Spring Lever Ink Jet Printer</entry></row>
<row>
<entry>IJ06US</entry>
<entry>IJ06</entry>
<entry>Paddle Type Ink Jet Printer</entry></row>
<row>
<entry>IJ07US</entry>
<entry>U07</entry>
<entry>Permanent Magnet Electromagnetic Ink Jet Printer</entry></row>
<row>
<entry>IJ08US</entry>
<entry>IJ08</entry>
<entry>Planar Swing Grill Electromagnetic Ink Jet Printer</entry></row>
<row>
<entry>IJ09US</entry>
<entry>IJ09</entry>
<entry>Pump Action Refill Ink Jet Printer</entry></row>
<row>
<entry>IJ10US</entry>
<entry>IJ10</entry>
<entry>Pulsed Magnetic Field Ink Jet Printer</entry></row>
<row>
<entry>IJ11US</entry>
<entry>IJ11</entry>
<entry>Two Plate Reverse Firing Electromagnetic Ink Jet Printer</entry></row>
<row>
<entry>IJ12US</entry>
<entry>IJ12</entry>
<entry>Linear Stepper Actuator Ink Jet Printer</entry></row>
<row>
<entry>IJ13US</entry>
<entry>IJ13</entry>
<entry>Gear Driven Shutter Ink Jet Printer</entry></row>
<row>
<entry>IJ14US</entry>
<entry>U14</entry>
<entry>Tapered Magnetic Pole Electromagnetic Ink Jet Printer</entry></row>
<row>
<entry>IJ15US</entry>
<entry>IJ15</entry>
<entry>Linear Spring Electromagnetic Grill Ink Jet Printer</entry></row>
<row>
<entry>IJ16US</entry>
<entry>IJ16</entry>
<entry>Lorenz Diaphragm Electromagnetic Ink Jet Printer</entry></row>
<row>
<entry>IJ17US</entry>
<entry>IJ17</entry>
<entry>PTFE Surface Shooting Shuttered Oscillating Pressure Ink Jet Printer</entry></row>
<row>
<entry>IJ18US</entry>
<entry>IJ18</entry>
<entry>Buckle Grip Oscillating Pressure Ink Jet Printer</entry></row>
<row>
<entry>IJ19US</entry>
<entry>IJ19</entry>
<entry>Shutter Based Ink Jet Printer</entry></row>
<row>
<entry>IJ20US</entry>
<entry>IJ20</entry>
<entry>Curling Calyx Thermoelastic Ink Jet Printer</entry></row>
<row>
<entry>IJ21US</entry>
<entry>IJ21</entry>
<entry>Thermal Actuated Ink Jet Printer</entry></row>
<row>
<entry>IJ22US</entry>
<entry>U22</entry>
<entry>Iris Motion Ink Jet Printer</entry></row>
<row>
<entry>IJ23US</entry>
<entry>IJ23</entry>
<entry>Direct Firing Thermal Bend Actuator Ink Jet Printer</entry></row>
<row>
<entry>IJ24US</entry>
<entry>IJ24</entry>
<entry>Conductive PTFE Ben Activator Vented Ink Jet Printer</entry></row>
<row>
<entry>IJ25US</entry>
<entry>IJ25</entry>
<entry>Magnetostrictive Ink Jet Printer</entry></row>
<row>
<entry>IJ26US</entry>
<entry>IJ26</entry>
<entry>Shape Memory Alloy Ink Jet Printer</entry></row>
<row>
<entry>IJ27US</entry>
<entry>IJ27</entry>
<entry>Buckle Plate Ink Jet Printer</entry></row>
<row>
<entry>IJ28US</entry>
<entry>IJ28</entry>
<entry>Thermal Elastic Rotary Impeller Ink Jet Printer</entry></row>
<row>
<entry>IJ29US</entry>
<entry>IJ29</entry>
<entry>Thermoelastic Bend Actuator Ink Jet Printer</entry></row>
<row>
<entry>IJ30US</entry>
<entry>IJ30</entry>
<entry>Thermoelastic Bend Actuator Using PTFE and Corrugated Copper Ink Jet Printer</entry></row>
<row>
<entry>IJ31US</entry>
<entry>IJ31</entry>
<entry>Bend Actuator Direct Ink Supply Ink Jet Printer</entry></row>
<row>
<entry>IJ32US</entry>
<entry>IJ32</entry>
<entry>A High Young's Modulus Thermoelastic Ink Jet Printer</entry></row>
<row>
<entry>U33US</entry>
<entry>IJ33</entry>
<entry>Thermally actuated slotted chamber wall ink jet printer</entry></row>
<row>
<entry>U34US</entry>
<entry>IJ34</entry>
<entry>Ink Jet Printer having a thermal actuator comprising an external coiled spring</entry></row>
<row>
<entry>IJ35US</entry>
<entry>IJ35</entry>
<entry>Trough Container Ink Jet Printer</entry></row><!-- EPO <DP n="13"> -->
<row>
<entry>IJ36US</entry>
<entry>U36</entry>
<entry>Dual Chamber Single Vertical Actuator Ink Jet</entry></row>
<row>
<entry>IJ37US</entry>
<entry>IJ37</entry>
<entry>Dual Nozzle Single Horizontal Fulcrum Actuator Ink Jet</entry></row>
<row>
<entry>IJ38US</entry>
<entry>IJ38</entry>
<entry>Dual Nozzle Single Horizontal Actuator Ink Jet</entry></row>
<row>
<entry>IJ39US</entry>
<entry>IJ39</entry>
<entry>A single bend actuator capped paddle ink jet printing device</entry></row>
<row>
<entry>IJ40US</entry>
<entry>IJ40</entry>
<entry>A thermally actuated ink jet printer having a series of thermal actuator units</entry></row>
<row>
<entry>IJ41US</entry>
<entry>IJ41</entry>
<entry>A thermally actuated ink jet printer including a tapered heater element</entry></row>
<row>
<entry>U42US</entry>
<entry>IJ42</entry>
<entry>Radial Back-Curling Thermoelastic Ink Jet</entry></row>
<row>
<entry>IJ43US</entry>
<entry>IJ43</entry>
<entry>Inverted Radial Back-Curling Thermoelastic Ink Jet</entry></row>
<row>
<entry>IJ44US</entry>
<entry>IJ44</entry>
<entry>Surface bend actuator vented ink supply ink jet printer</entry></row>
<row>
<entry>IJ45US</entry>
<entry>IJ45</entry>
<entry>Coil Actuated Magnetic Plate Ink Jet Printer</entry></row></tbody></tgroup>
</table>
</tables></p>
<heading id="h0010"><u style="single">Tables of Drop-on-Demand Inkjets</u></heading>
<p id="p0042" num="0042">Eleven important characteristics of the fundamental operation of individual inkjet nozzles have been identified. These characteristics are largely orthogonal, and so can be elucidated as an eleven dimensional matrix. Most of the eleven axes of this matrix include entries developed by the present assignee.</p>
<p id="p0043" num="0043">The following tables form the axes of an eleven dimensional table of inkjet types.
<ul id="ul0003" list-style="none" compact="compact">
<li>Actuator mechanism (18 types)</li>
<li>Basic operation mode (7 types)</li>
<li>Auxiliary mechanism (8 types)</li>
<li>Actuator amplification or modification method (17 types)</li>
<li>Actuator motion (19 types)</li>
<li>Nozzle refill method (4 types)</li>
<li>Method of restricting back-flow through inlet (10 types)</li>
<li>Nozzle clearing method (9 types)</li>
<li>Nozzle plate construction (9 types)</li>
<li>Drop ejection direction (5 types)</li>
<li>Ink type (7 types)</li>
</ul></p>
<p id="p0044" num="0044">The complete eleven dimensional table represented by these axes contains 36.9 billion possible configurations of inkjet nozzle. While not all of the possible combinations result in a viable inkjet technology, many million configurations are viable, h is clearly impractical to elucidate all of the possible configurations. Instead, certain inkjet types have been investigated in detail. These are designated IJ01 to IJ45 above.</p>
<p id="p0045" num="0045">Other inkjet configurations can readily be derived from these 45 examples by substituting alternative configurations along one or more of the 11 axes. Most of the IJ01 to IJ45 examples can be made into inkjet print heads with characteristics superior to any currently available inkjet technology.</p>
<p id="p0046" num="0046">Where there are prior art examples known to the inventor, one or more of these examples are listed in the examples column of the tables below. The IJ01 to IJ45 series are also listed in the examples column. In some cases, a printer may be listed more than once in a table, where it shares characteristics with more than one entry.</p>
<p id="p0047" num="0047">Suitable applications include: Home printers, Office network printers, Short run digital printers, Commercial<!-- EPO <DP n="14"> --> print systems, Fabric printers, Pocket printers, Internet WWW printers, Video printers, Medical imaging, Wide format printers, Notebook PC printers, Fax machines, Industrial printing systems, Photocopiers, Photographic minilabs etc.</p>
<p id="p0048" num="0048">The information associated with the aforementioned 11 dimensional matrix are set out in the following tables.<!-- EPO <DP n="15"> -->
<tables id="tabl0002" num="0002">
<table frame="all">
<title><b><u style="single">Actuator mechanism (applied only to selected ink drops)</u></b></title>
<tgroup cols="5">
<colspec colnum="1" colname="col1" colwidth="31mm"/>
<colspec colnum="2" colname="col2" colwidth="38mm"/>
<colspec colnum="3" colname="col3" colwidth="33mm"/>
<colspec colnum="4" colname="col4" colwidth="33mm"/>
<colspec colnum="5" colname="col5" colwidth="33mm"/>
<thead>
<row>
<entry valign="top"><b>Actuator Mechanism</b></entry>
<entry valign="top"><b>Description</b></entry>
<entry valign="top"><b>Advantages</b></entry>
<entry valign="top"><b>Disadvantages</b></entry>
<entry valign="top"><b>Examples</b></entry></row></thead>
<tbody>
<row rowsep="0">
<entry morerows="9" rowsep="1"><b>Thermal bubble</b></entry>
<entry morerows="3">An electrothermal heater heats the ink to above boiling point, transferring significant heat to the aqueous ink. A bubble nucleates and quickly forms, expelling the ink.</entry>
<entry>◆ Large force generated</entry>
<entry>◆ High power</entry>
<entry>◆ Canon Bubblejet 1979 Endo et al GB patent 2,007,162</entry></row>
<row rowsep="0">
<entry>◆ Simple construction</entry>
<entry>◆ Ink carrier limited to water</entry>
<entry>◆ Xerox heater-in-pit 1990 Hawkins et al USP 4,899,181</entry></row>
<row rowsep="0">
<entry>◆ No moving parts</entry>
<entry>◆ Low efficiency</entry>
<entry morerows="7" rowsep="1">◆ Hewlett-Packard TIJ 1982 Vaught et at USP 4,490,728</entry></row>
<row rowsep="0">
<entry>◆ Fast operation</entry>
<entry>◆ High temperatures required</entry></row>
<row rowsep="0">
<entry morerows="5" rowsep="1">The efficiency of the process is low, with typically less than 0.05% of the electrical energy being transformed into kinetic energy of the drop.</entry>
<entry morerows="5" rowsep="1">◆ Small chip area required for actuator</entry>
<entry>◆ High mechanical stress</entry></row>
<row rowsep="0">
<entry>◆ Unusual materials required</entry></row>
<row rowsep="0">
<entry>◆ Large drive transistors</entry></row>
<row rowsep="0">
<entry>◆ Cavitation causes actuator failure</entry></row>
<row rowsep="0">
<entry>◆ Kogation reduces bubble formation</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Large print heads are difficult to fabricate</entry></row>
<row rowsep="0">
<entry morerows="5" rowsep="1"><b>Piezoelectric</b></entry>
<entry morerows="5" rowsep="1">A piezoelectric crystal such as lead lanthanum zirconate (PZT) is electrically activated, and either expands, shears, or bends to apply pressure to the ink, ejecting drops.</entry>
<entry>◆ Low power consumption</entry>
<entry>◆ Very large area required for actuator</entry>
<entry>◆ Kyser et al USP 3,946,398</entry></row>
<row rowsep="0">
<entry>◆ Many ink types can be used</entry>
<entry>◆ Difficult to integrate with electronics</entry>
<entry>◆ Zoltan USP 3,683,212</entry></row>
<row rowsep="0">
<entry>◆ Fast operation</entry>
<entry>◆ High voltage drive transistors required</entry>
<entry>◆ 1973 Stemme USP 3,747,120</entry></row>
<row rowsep="0">
<entry morerows="2" rowsep="1">◆ High efficiency</entry>
<entry>◆ Full pagewidth print heads impractical due to actuator size</entry>
<entry>◆ Epson Stylus</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1">◆ Requires electrical poling in high field strengths during manufacture</entry>
<entry>◆ Tektronix</entry></row>
<row>
<entry>◆ IJ04</entry></row><!-- EPO <DP n="16"> -->
<row rowsep="0">
<entry morerows="4" rowsep="1"><b>Electro-strictive</b></entry>
<entry morerows="4" rowsep="1">An electric field is used to activate electrostriction in relaxor materials such as lead lanthanum zirconate titanate (PLZT) or lead magnesium niobate (PMN).</entry>
<entry>◆ Low power consumption</entry>
<entry>◆ Low maximum strain (approx. 0.01%)</entry>
<entry>◆ Seiko Epson, Usui et all JP 253401/96</entry></row>
<row rowsep="0">
<entry>◆ Many ink types can be used</entry>
<entry>◆ Large area required for actuator due to low strain</entry>
<entry morerows="3" rowsep="1">◆ IJ04</entry></row>
<row rowsep="0">
<entry>◆ Low thermal expansion</entry>
<entry>◆ Response speed is marginal (∼ 10 µs)</entry></row>
<row rowsep="0">
<entry>◆ Electric field strength required (approx. 3.5 V/µm) can be generated without difficulty</entry>
<entry>◆ High voltage drive transistors required</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Does not require electrical poling</entry>
<entry rowsep="1">◆ Full pagewidth print heads impractical due to actuator size</entry></row>
<row rowsep="0">
<entry morerows="6" rowsep="1"><b>Ferroelectric</b></entry>
<entry morerows="1">An electric field is used to induce a phase transition between the antiferroelectric (AFE) and ferroelectric (FE) phase.</entry>
<entry>◆ Low power consumption</entry>
<entry>◆ Difficult to integrate with electronics</entry>
<entry morerows="6" rowsep="1">◆ IJ04</entry></row>
<row rowsep="0">
<entry>◆ Many ink types can be used</entry>
<entry>◆ Unusual materials such as PLZSnT are required</entry></row>
<row rowsep="0">
<entry morerows="4" rowsep="1">Perovskite materials such as tin modified lead lanthanum zirconate titanate (PLZSnT) exhibit large strains of up to 1% associated with the AFE to FE phase transition.</entry>
<entry>◆ Fast operation (&lt; 1 µs)</entry>
<entry morerows="4" rowsep="1">◆ Actuators require a large area</entry></row>
<row rowsep="0">
<entry>◆ Relatively high</entry></row>
<row rowsep="0">
<entry>longitudinal strain</entry></row>
<row rowsep="0">
<entry>◆ High efficiency</entry></row>
<row>
<entry>◆ Electric field strength of around 3 V/µm can be readily provided</entry></row><!-- EPO <DP n="17"> -->
<row rowsep="0">
<entry morerows="4" rowsep="1"><b>Electrostatic plates</b></entry>
<entry morerows="4" rowsep="1">Conductive plates are separated by a compressible or fluid dielectric (usually air). Upon application of a voltage, the plates attract each other and displace ink, causing drop ejection. The conductive plates may be in a comb or honeycomb structure, or stacked to increase the surface area and therefore the force.</entry>
<entry>◆ Low power consumption</entry>
<entry>◆ Difficult to operate electrostatic devices in an aqueous environment</entry>
<entry morerows="4" rowsep="1">◆ IJ02, IJ04</entry></row>
<row rowsep="0">
<entry>◆ Many ink types can be used</entry>
<entry>◆ The electrostatic actuator will normally need to be separated from the ink</entry></row>
<row rowsep="0">
<entry morerows="2" rowsep="1">◆ Fast operation</entry>
<entry>◆ Very large area required to achieve high forces</entry></row>
<row rowsep="0">
<entry>◆ High voltage drive transistors may be required</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Full pagewidth print heads are not competitive due to actuator size</entry></row>
<row rowsep="0">
<entry morerows="4" rowsep="1"><b>Electrostatic pull on ink</b></entry>
<entry morerows="4" rowsep="1">A strong electric field is applied to tho ink, whereupon electrostatic attraction accelerates the ink towards the print medium.</entry>
<entry>◆ Low current consumption</entry>
<entry>◆ High voltage required</entry>
<entry>◆ 1989 Saito et al, USP 4,799,068</entry></row>
<row rowsep="0">
<entry morerows="3" rowsep="1">◆ Low temperature</entry>
<entry>◆ May be damaged by sparks due to air breakdown</entry>
<entry>◆ 1989 Miura et al, USP 4,810,954</entry></row>
<row rowsep="0">
<entry>◆ Required field strength increases as the drop size decreases</entry>
<entry morerows="2" rowsep="1">◆ Tone-jet</entry></row>
<row rowsep="0">
<entry>◆ High voltage drive transistors required</entry></row>
<row>
<entry>◆ Electrostatic field attracts dust</entry></row><!-- EPO <DP n="18"> -->
<row rowsep="0">
<entry morerows="5" rowsep="1"><b>Permanent magnet electro-magnetic</b></entry>
<entry morerows="5" rowsep="1">An electromagnet directly attracts a permanent magnet, displacing ink and causing drop ejection. Rare earth magnets with a field strength around 1 Tesla can be used. Examples are: Samarium Cobalt (SaCo) and magnetic materials in the neodymium iron boron family (NdFeB, NdDyFeBNb, NdDyFeB, etc)</entry>
<entry>◆ Low power consumption</entry>
<entry>◆ Complex fabrication</entry>
<entry morerows="5" rowsep="1">◆ IJ07, IJ10</entry></row>
<row rowsep="0">
<entry>◆ Many ink types can be used</entry>
<entry>◆ Permanent magnetic material such as Neodymium Iron Boron (NdFeB) required.</entry></row>
<row rowsep="0">
<entry>◆ Fast operation</entry>
<entry>◆ High local currents required</entry></row>
<row rowsep="0">
<entry>◆ High efficiency</entry>
<entry>◆ Copper metalization should be used for long electromigration lifetime and low resistivity</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1">◆ Easy extension from single nozzles to pagewidth print heads</entry>
<entry>◆ Pigmented inks are usually infeasible</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Operating temperature limited to the Curie temperature (around 540 K)</entry></row>
<row rowsep="0">
<entry morerows="5" rowsep="1"><b>Soft magnetic core electro-magnetic</b></entry>
<entry morerows="5" rowsep="1">A solenoid induced a magnetic field in a soft magnetic core or yoke fabricated from a ferrous material such as electroplated iron alloys such as CoNiFe [1], CoFe, or NiFe alloys. Typically, the soft magnetic material is in two parts, which are normally held apart by a spring. When the solenoid is actuated, the two parts attract, displacing the ink.</entry>
<entry>◆ Low power consumption</entry>
<entry>◆ Complex fabrication</entry>
<entry>◆ IJ01, IJ05, IJ08, IJ10</entry></row>
<row rowsep="0">
<entry>◆ Many ink types can be used</entry>
<entry>◆ Materials not usually present in a CMOS fab such as NiFe, CoNiFe, or CoFe are required</entry>
<entry morerows="4" rowsep="1">◆ IJ12, IJ14, IJ15, IJ17</entry></row>
<row rowsep="0">
<entry>◆ Fast operation</entry>
<entry>◆ High local currents required</entry></row>
<row rowsep="0">
<entry>◆ High efficiency</entry>
<entry>◆ Copper metalization should be used for long electromigration life time and low resistivity</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1">◆ Easy extension from single nozzles to pagewidth print heads</entry>
<entry>◆ Electroplating is required</entry></row>
<row>
<entry>◆ High saturation flux density is required (2.0-2.1 T is achievable with CoNiFe [1])</entry></row><!-- EPO <DP n="19"> -->
<row rowsep="0">
<entry morerows="4" rowsep="1"><b>Magnetic Lorenz force</b></entry>
<entry>The Lorenz force acting on a current carrying wire in a magnetic field is utilized.</entry>
<entry>◆ Low power consumption</entry>
<entry>◆ Force acts as a twisting motion</entry>
<entry morerows="4" rowsep="1">◆ IJ06, IJ11, IJ13, IJ16</entry></row>
<row rowsep="0">
<entry morerows="2">This allows the magnetic field to be supplied externally to the print head, for example with rare earth permanent magnets.</entry>
<entry>◆ Many ink types can be used</entry>
<entry>◆ Typically, only a quarter of the solenoid length provides force in a useful direction</entry></row>
<row rowsep="0">
<entry>◆ Fast operation</entry>
<entry>◆ High local currents required</entry></row>
<row rowsep="0">
<entry>◆ High efficiency</entry>
<entry>◆ Copper metalization should be used for long electromigration lifetime and low resistivity</entry></row>
<row rowsep="0">
<entry rowsep="1">Only the current carrying wire need be fabricated on the print-head, simplifying materials requirements.</entry>
<entry rowsep="1">◆ Easy extension from single nozzles to pagewidth print heads</entry>
<entry rowsep="1">◆ Pigmented inks are usually infeasible</entry></row>
<row rowsep="0">
<entry morerows="4" rowsep="1"><b>Magneto-striction</b></entry>
<entry morerows="4" rowsep="1">The actuator uses the giant magnetostrictive effect of materials such as Terfenol-D (an alloy of terbium, dysprosium and iron developed at the Naval Ordnance Laboratory, hence Ter-Fe-NOL). For best efficiency, the actuator should be pre-stressed to approx. 8 MPa.</entry>
<entry>◆ Many ink types can be used</entry>
<entry>◆ Force acts as a twisting motion</entry>
<entry>◆ Fischenbeck, USP 4,032,929</entry></row>
<row rowsep="0">
<entry>◆ Fast operation</entry>
<entry>◆ Unusual materials such as Terfenol-D are required</entry>
<entry morerows="3" rowsep="1">◆ IJ25</entry></row>
<row rowsep="0">
<entry>◆ Easy extension from single nozzles to pagewidth print heads</entry>
<entry>◆ High local currents required</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1">◆ High force is available</entry>
<entry>◆ Copper metalization should be used for long electromigration lifetime and low resistivity</entry></row>
<row>
<entry>◆ Pre-stressing may be required</entry></row><!-- EPO <DP n="20"> -->
<row rowsep="0">
<entry morerows="4" rowsep="1"><b>Surface tension reduction</b></entry>
<entry morerows="4" rowsep="1">Ink under positive pressure is held in a nozzle by surface tension. The surface tension of the ink is reduced below the bubble threshold, causing the ink to egress from the nozzle.</entry>
<entry>◆ Low power consumption</entry>
<entry>◆ Requires supplementary force to effect drop separation</entry>
<entry morerows="4" rowsep="1">◆ Silverbrook, EP 0771 658 A2 and related patent applications</entry></row>
<row rowsep="0">
<entry>◆ Simple construction</entry>
<entry>◆ Requires special ink surfactants</entry></row>
<row rowsep="0">
<entry>◆ No unusual materials required in fabrication</entry>
<entry morerows="2" rowsep="1">◆ Speed may be limited by surfactant properties</entry></row>
<row rowsep="0">
<entry>◆ High efficiency</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Easy extension from single nozzles to pagewidth print heads</entry></row>
<row rowsep="0">
<entry morerows="4" rowsep="1"><b>Viscosity reduction</b></entry>
<entry morerows="4" rowsep="1">The ink viscosity is locally reduced to select which drops are to be ejected. A viscosity reduction can be achieved electrothermally with most inks, but special inks can be engineered for a 100:1 viscosity reduction.</entry>
<entry>◆ Simple construction</entry>
<entry>◆ Requires supplementary force to effect drop separation</entry>
<entry morerows="4" rowsep="1">◆ Silverbrook, EP 0771 658 A2 and related patent applications</entry></row>
<row rowsep="0">
<entry>◆ No unusual materials required in fabrication</entry>
<entry>◆ Requires special ink viscosity properties</entry></row>
<row rowsep="0">
<entry morerows="2" rowsep="1">◆ Easy extension from single nozzles to pagewidth print heads</entry>
<entry>◆ High speed is difficult to achieve</entry></row>
<row rowsep="0">
<entry>◆ Requires oscillating ink pressure</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ A high temperature difference (typically 80 degrees) is required</entry></row>
<row rowsep="0">
<entry morerows="4" rowsep="1"><b>Acoustic</b></entry>
<entry morerows="4" rowsep="1">An acoustic wave is generated and focussed upon the drop ejection region.</entry>
<entry morerows="4" rowsep="1">◆ Can operate without a nozzle plate</entry>
<entry>◆ Complex drive circuitry</entry>
<entry>◆ 1993 Hadimioglu et al, EUP 550,192</entry></row>
<row rowsep="0">
<entry>◆ Complex fabrication</entry>
<entry morerows="3" rowsep="1">◆ 1993 Elrod et al, EUP 572,220</entry></row>
<row rowsep="0">
<entry>◆ Low efficiency</entry></row>
<row rowsep="0">
<entry>◆ Poor control of drop position</entry></row>
<row>
<entry>◆ Poor control of drop volume</entry></row><!-- EPO <DP n="21"> -->
<row rowsep="0">
<entry morerows="8" rowsep="1"><b>Thermoelastic bend actuator</b></entry>
<entry morerows="8" rowsep="1">An actuator which relies upon differential thermal expansion upon Joule heating is used.</entry>
<entry>◆ Low power consumption</entry>
<entry>◆ Efficient aqueous operation requires a thermal insulator on the hot side</entry>
<entry>◆ IJ03, IJ09, IJ17, IJ18</entry></row>
<row rowsep="0">
<entry>◆ Many ink types can be used</entry>
<entry>◆ Corrosion prevention can be difficult</entry>
<entry>◆ IJ19, IJ20, IJ21, IJ22</entry></row>
<row rowsep="0">
<entry>◆ Simple planar fabrication</entry>
<entry morerows="6" rowsep="1">◆ Pigmented inks may be infeasible, as pigment particles may jam the bend actuator</entry>
<entry>◆ IJ23, IJ24, IJ27, IJ28</entry></row>
<row rowsep="0">
<entry>◆ Small chip area required for each actuator</entry>
<entry>◆ IJ29, IJ30, IJ31, IJ32</entry></row>
<row rowsep="0">
<entry>◆ Fast operation</entry>
<entry>◆ IJ33, IJ34, IJ35, IJ36</entry></row>
<row rowsep="0">
<entry>◆ High efficiency</entry>
<entry>◆ IJ37, IJ38 ,IJ39, IJ40</entry></row>
<row rowsep="0">
<entry>◆ CMOS compatible voltages and currents</entry>
<entry morerows="2" rowsep="1">◆ IJ41</entry></row>
<row rowsep="0">
<entry>◆ Standard MEMS processes can be used</entry></row>
<row>
<entry>◆ Easy extension from single nozzles to pagewidth print heads</entry></row><!-- EPO <DP n="22"> -->
<row rowsep="0">
<entry morerows="9" rowsep="1"><b>High CTE thermoelastic actuator</b></entry>
<entry>A material with a very high coefficient of thermal expansion (CTE) such as polytetrafluoroethylene (PTFE) is used. As high CTE materials are usually non-conductive, a heater fabricated from a conductive material is incorporated. A 50 µm long PTFE bend actuator with polysilicon heater and 15 mW power input can provide 180 µN force and 10 µm deflection. Actuator motions include:</entry>
<entry>◆ High force can be generated</entry>
<entry>◆ Requires special material (e.g. PTFE)</entry>
<entry>◆ IJ09, IJ17, IJ18, IJ20</entry></row>
<row rowsep="0">
<entry>1) Bend</entry>
<entry>◆ PTFE is a candidate for low dielectric constant insulation in ULSI</entry>
<entry>◆ Requires a PTFE deposition process, which is not yet standard in ULSI fabs</entry>
<entry>◆ IJ21, IJ22, IJ23, IJ24</entry></row>
<row rowsep="0">
<entry>2) Push</entry>
<entry>◆ Very low power consumption</entry>
<entry>◆ PTFE deposition cannot be followed with high temperature (above 350 °C) processing</entry>
<entry>◆ IJ27, IJ28, IJ29, IJ30</entry></row>
<row rowsep="0">
<entry>3) Buckle</entry>
<entry>◆ Many ink types can be used</entry>
<entry morerows="6" rowsep="1">◆ Pigmented inks may be infeasible, as pigment particles may jam the bend actuator</entry>
<entry morerows="6" rowsep="1">◆ IJ31, IJ42, IJ43, IJ44</entry></row>
<row rowsep="0">
<entry morerows="5" rowsep="1">4) Rotate</entry>
<entry>◆ Simple planar fabrication</entry></row>
<row rowsep="0">
<entry>◆ Small chip area required for each actuator</entry></row>
<row rowsep="0">
<entry>◆ Fast operation</entry></row>
<row rowsep="0">
<entry>◆ High efficiency</entry></row>
<row rowsep="0">
<entry>◆ CMOS compatible voltages and currents</entry></row>
<row>
<entry>◆ Easy extension from single nozzles to pagewidth print heads</entry></row><!-- EPO <DP n="23"> -->
<row rowsep="0">
<entry morerows="8" rowsep="1"><b>Conductive polymer thermoelastic actuator</b></entry>
<entry>A polymer with a high coefficient of thermal expansion (such as PTFE) is doped with conducting substances to increase its conductivity to about 3 orders of magnitude below that of copper. The conducting polymer expands when resistively heated, Examples of conducting dopants include:</entry>
<entry>◆ High force can be generated</entry>
<entry>◆ Requires special materials development (High CTE conductive polymer)</entry>
<entry morerows="8" rowsep="1">◆ IJ24</entry></row>
<row rowsep="0">
<entry>1) Carbon nanotubes</entry>
<entry>◆ Very low power consumption</entry>
<entry>◆ Requires a PTFE deposition process, which is not yet standard in ULSI fabs</entry></row>
<row rowsep="0">
<entry>2) Metal fibers</entry>
<entry>◆ Many ink types can be used</entry>
<entry>◆ PTFE deposition cannot be followed with high temperature (above 350 °C) processing</entry></row>
<row rowsep="0">
<entry>3) Conductive polymers such as doped polythiophene</entry>
<entry>◆ Simple planar fabrication</entry>
<entry>◆ Evaporation and CVD deposition techniques cannot be used</entry></row>
<row rowsep="0">
<entry morerows="4" rowsep="1">4) Carbon granules</entry>
<entry>◆ Small chip area required for each actuator</entry>
<entry morerows="4" rowsep="1">◆ Pigmented inks may be infeasible, as pigment particles may jam the bend actuator</entry></row>
<row rowsep="0">
<entry>◆ Fast operation</entry></row>
<row rowsep="0">
<entry>◆ High efficiency</entry></row>
<row rowsep="0">
<entry>◆ CMOS compatible voltages and currents</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Easy extension from single nozzles to pagewidth print heads</entry></row>
<row rowsep="0">
<entry morerows="7" rowsep="1"><b>Shape memory alloy</b></entry>
<entry morerows="7" rowsep="1">A shape memory alloy such as TiNi (also known as Nitinol - Nickel Titanium alloy developed at the Naval Ordnance Laboratory) is thermally switched between its weak martensitic state and its high stiffness austenic state. The shape of the actuator in its martensitic state is deformed relative to the austenic shape. The shape change causes ejection of a drop.</entry>
<entry>◆ High force is available (stresses of hundreds of MPa)</entry>
<entry>◆ Fatigue limits maximum number of cycles</entry>
<entry morerows="7" rowsep="1">◆ IJ26</entry></row>
<row rowsep="0">
<entry>◆ Large strain is available (more than 3%)</entry>
<entry>◆ Low strain (1%) is required to extend fatigue resistance</entry></row>
<row rowsep="0">
<entry>◆ High corrosion resistance</entry>
<entry/></row>
<row rowsep="0">
<entry>◆ Simple construction</entry>
<entry>◆ Cycle rate limited by heat removal</entry></row>
<row rowsep="0">
<entry>◆ Easy extension from single nozzles to pagewidth print heads</entry>
<entry>◆ Requires unusual materials (TiNi)</entry></row>
<row rowsep="0">
<entry morerows="2" rowsep="1">◆ Low voltage operation</entry>
<entry>◆ The latent heat of transformation must be provided</entry></row>
<row rowsep="0">
<entry>◆ High current operation</entry></row>
<row>
<entry>◆ Requires pre-stressing to distort the martensitic state</entry></row><!-- EPO <DP n="24"> -->
<row rowsep="0">
<entry morerows="3" rowsep="1"><b>Linear Magnetic Actuator</b></entry>
<entry morerows="3" rowsep="1">Linear magnetic actuators include the Linear Induction Actuator (LIA), Linear Permanent Magnet Synchronous Actuator (LPMSA), Linear Reluctance Synchronous Actuator (LRSA), Linear Switched Reluctance Actuator (LSRA), and the Linear Stepper Actuator (LSA).</entry>
<entry>◆ Linear Magnetic actuators can be constructed with high thrust, long travel, and high efficiency using planar semiconductor fabrication techniques</entry>
<entry>◆ Requires unusual semiconductor materials such as soft magnetic alloys (e.g. CoNiFe [1])</entry>
<entry morerows="3" rowsep="1">◆ IJ12</entry></row>
<row rowsep="0">
<entry>◆ Long actuator travel is available</entry>
<entry>◆ Some varieties also require permanent magnetic materials such as Neodymium iron boron (NdFeB)</entry></row>
<row rowsep="0">
<entry>◆ Medium force is available</entry>
<entry>◆ Requires complex multi-phase drive circuitry</entry></row>
<row rowsep="0">
<entry>◆ Low voltage operation</entry>
<entry>◆ High current operation</entry></row></tbody></tgroup>
</table>
</tables>
<tables id="tabl0003" num="0003">
<table frame="all">
<title><b><u style="single">Basic operation mode</u></b></title>
<tgroup cols="5">
<colspec colnum="1" colname="col1" colwidth="33mm"/>
<colspec colnum="2" colname="col2" colwidth="32mm"/>
<colspec colnum="3" colname="col3" colwidth="33mm"/>
<colspec colnum="4" colname="col4" colwidth="35mm"/>
<colspec colnum="5" colname="col5" colwidth="34mm"/>
<thead>
<row>
<entry valign="top"><b>Operational mode</b></entry>
<entry valign="top"><b>Description</b></entry>
<entry valign="top"><b>Advantages</b></entry>
<entry valign="top"><b>Disadvantages</b></entry>
<entry valign="top"><b>Examples</b></entry></row></thead>
<tbody>
<row rowsep="0">
<entry morerows="10" rowsep="1"><b>Actuator directly pushes ink</b></entry>
<entry morerows="10" rowsep="1">This is the simplest mode of operation: the actuator directly supplies sufficient kinetic energy to expel the drop. The drop must have a sufficient velocity to overcome the surface tension.</entry>
<entry>◆ Simple operation</entry>
<entry>◆Drop repetition rate is usually limited to less than 10 KHz. However, this is not fundamental to the method, but is related to the refill method normally used</entry>
<entry>◆Thermal inkjet</entry></row>
<row rowsep="0">
<entry>◆ No external fields required</entry>
<entry>◆ All of the drop kinetic energy must be provided by the actuator</entry>
<entry>◆ Piezoelectric inkjet</entry></row>
<row rowsep="0">
<entry>◆Satellite drops can be avoided if drop velocity is less than 4 m/s</entry>
<entry morerows="8" rowsep="1">◆ Satellite drops usually form if drop velocity is greater than 4.5 m/s</entry>
<entry>◆ IJ01, IJ02, IJ03, IJ04</entry></row>
<row rowsep="0">
<entry morerows="7" rowsep="1">◆ Can be efficient, depending upon the actuator used</entry>
<entry>◆ IJ05, IJ06, IJ07, IJ09</entry></row>
<row rowsep="0">
<entry>◆ IJ11, IJ12, IJ14, IJ16</entry></row>
<row rowsep="0">
<entry>◆ IJ20, IJ22, IJ23, IJ24</entry></row>
<row rowsep="0">
<entry>◆ IJ25, IJ26, IJ27, IJ28</entry></row>
<row rowsep="0">
<entry>◆ IJ29, IJ30, IJ31, IJ32</entry></row>
<row rowsep="0">
<entry>◆ IJ33, IJ34, IJ35, IJ36</entry></row>
<row rowsep="0">
<entry>◆ IJ37, IJ38, IJ39, IJ40</entry></row>
<row>
<entry>◆ IJ41, IJ42, IJ43, IJ44</entry></row><!-- EPO <DP n="25"> -->
<row rowsep="0">
<entry morerows="2" rowsep="1"><b>Proximity</b></entry>
<entry morerows="2" rowsep="1">The drops to be printed are selected by some manner (e.g. thermally induced surface tension reduction of pressurized ink). Selected drops are separated from the ink in the nozzle by contact with the print medium or a transfer roller.</entry>
<entry>◆ Very simple print head fabrication can be used</entry>
<entry>◆ Requires close proximity between the print head and the print media or transfer roller</entry>
<entry morerows="2" rowsep="1">◆ Silverbrook, EP 0771 658 A2 and related patent applications</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1">◆ The drop selection means does not need to provide the energy required to separate the drop from the nozzle</entry>
<entry>◆ May require two print heads printing alternate rows of the image</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Monolithic color print heads are difficult</entry></row>
<row rowsep="0">
<entry morerows="2" rowsep="1"><b>Electrostatic pull on ink</b></entry>
<entry morerows="2" rowsep="1">The drops to be printed are selected by some manner (e.g. thermally induced surface tension reduction of pressurized ink). Selected drops are separated from the ink in the nozzle by a strong electric field.</entry>
<entry>◆ Very simple print head fabrication can be used</entry>
<entry>◆ Requires very high electrostatic field</entry>
<entry>◆ Silverbrook, EP 0771 658 A2 and related patent applications</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1">◆ The drop selection means does not need to provide the energy required to separate the drop from the nozzle</entry>
<entry>◆ Electrostatic field for small nozzle sizes is above air breakdown</entry>
<entry morerows="1" rowsep="1">◆ Tone-Jet</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Electrostatic field may attract dust</entry></row>
<row rowsep="0">
<entry morerows="2" rowsep="1"><b>Magnetic pull on Ink</b></entry>
<entry morerows="2" rowsep="1">The drops to be printed are selected by some manner (e.g. thermally induced surface tension reduction of pressurized ink). Selected drops are separated from the ink in the nozzle by a strong magnetic field acting on the magnetic ink.</entry>
<entry>◆ Very simple print head fabrication can be used</entry>
<entry>◆ Requires magnetic ink</entry>
<entry morerows="2" rowsep="1">◆ Silverbrook, EP 0771 658 A2 and related patent applications</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1">◆ The drop selection means does not need to provide the energy required to separate the drop from the nozzle</entry>
<entry>◆ Ink colors other than black are difficult</entry></row>
<row>
<entry>◆ Requires very high magnetic fields</entry></row><!-- EPO <DP n="26"> -->
<row rowsep="0">
<entry morerows="3" rowsep="1"><b>Shutter</b></entry>
<entry morerows="3" rowsep="1">The actuator moves a shutter to block ink flow to the nozzle. The ink pressure is pulsed at a multiple of the drop ejection frequency.</entry>
<entry>◆ High speed (&gt;50 KHz) operation can be achieved due to reduced refill time</entry>
<entry>◆ Moving parts are required</entry>
<entry morerows="3" rowsep="1">◆ IJ13, IJ17, IJ21</entry></row>
<row rowsep="0">
<entry>◆ Drop timing can be very accurate</entry>
<entry>◆ Requires ink pressure modulator</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1">◆ The actuator energy can be very low</entry>
<entry>◆ Friction and wear must be considered</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Stiction is possible</entry></row>
<row rowsep="0">
<entry morerows="3" rowsep="1"><b>Shuttered grill</b></entry>
<entry morerows="3" rowsep="1">The actuator moves a shutter to block ink flow through a grill to the nozzle. The shutter movement need only be equal to the width of the grill holes.</entry>
<entry>◆ Actuators with small travel can be used</entry>
<entry>◆ Moving parts are required</entry>
<entry morerows="3" rowsep="1">◆ IJ08, IJ15, IJ18, IJ19</entry></row>
<row rowsep="0">
<entry>◆ Actuators with small force can be used</entry>
<entry>◆ Requires ink pressure modulator</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1">◆ High speed (&gt;50 KHz) operation can be achieved</entry>
<entry>◆ Friction and wear must be considered</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Stiction is possible</entry></row>
<row rowsep="0">
<entry morerows="2" rowsep="1"><b>Pulsed magnetic pull on ink pusher</b></entry>
<entry morerows="2" rowsep="1">A pulsed magnetic field attracts an 'ink pusher' at the drop ejection frequency. An actuator controls a catch, which prevents the ink pusher from moving when a drop is not to be ejected.</entry>
<entry>◆ Extremely low energy operation is possible</entry>
<entry>◆ Requires an external pulsed magnetic field</entry>
<entry morerows="2" rowsep="1">◆ IJ10</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1">◆ No heat dissipation problems</entry>
<entry>◆ Requires special materials for both the actuator and the ink pusher</entry></row>
<row rowsep="0">
<entry>◆ Complex construction</entry></row></tbody></tgroup>
</table>
</tables><!-- EPO <DP n="27"> -->
<tables id="tabl0004" num="0004">
<table frame="all">
<title><b><u style="single">Auxiliary mechanism (applied to all nozzles)</u></b></title>
<tgroup cols="5">
<colspec colnum="1" colname="col1" colwidth="33mm"/>
<colspec colnum="2" colname="col2" colwidth="32mm"/>
<colspec colnum="3" colname="col3" colwidth="33mm"/>
<colspec colnum="4" colname="col4" colwidth="35mm"/>
<colspec colnum="5" colname="col5" colwidth="34mm"/>
<thead>
<row>
<entry valign="top"><b>Auxillary Mechanism</b></entry>
<entry valign="top"><b>Description</b></entry>
<entry valign="top"><b>Advantages</b></entry>
<entry valign="top"><b>Disadvantages</b></entry>
<entry valign="top"><b>Examples</b></entry></row></thead>
<tbody>
<row rowsep="0">
<entry morerows="3" rowsep="1"><b>None</b></entry>
<entry morerows="3" rowsep="1">The actuator directly ares the ink drop, and there is no external field or other mechanism required.</entry>
<entry>◆ Simplicity of construction</entry>
<entry morerows="3" rowsep="1">◆ Drop ejection energy must be supplied by individual nozzle actuator</entry>
<entry>◆ Most inkjets, including piezoelectric and thermal bubble.</entry></row>
<row rowsep="0">
<entry>◆ Simplicity of operation</entry>
<entry>◆ IJ01 - IJ07, IJ09, IJ11</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1">◆ Small physical size</entry>
<entry>◆ IJ12, IJ14, IJ20, IJ22</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ IJ23-IJ45</entry></row>
<row rowsep="0">
<entry morerows="2" rowsep="1"><b>Oscillating ink pressure (including acoustic stimulation)</b></entry>
<entry morerows="2" rowsep="1">The ink pressure oscillates, providing much of the drop ejection energy. The actuator selects which drops are to be fired by selectively blocking or enabling nozzles. The ink pressure oscillation may be achieved by vibrating the print head, or preferably by an actuator in the ink supply.</entry>
<entry>◆ Oscillating ink pressure can provide a refill pulse, allowing higher operating speed</entry>
<entry>◆ Requires external ink pressure oscillator</entry>
<entry>◆ Silverbrook, EP 0771 658 A2 and related patent applications</entry></row>
<row rowsep="0">
<entry>◆ The actuators may operate with much lower energy</entry>
<entry>◆ Ink pressure phase and amplitude must be carefully controlled</entry>
<entry>◆ IJ08, IJ13, IJ15, IJ17</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Acoustic lenses can be used to focus the sound on the nozzles</entry>
<entry rowsep="1">◆ Acoustic reflections in the ink chamber must be designed for</entry>
<entry rowsep="1">◆ IJ18, IJ19, IJ21</entry></row>
<row rowsep="0">
<entry morerows="2" rowsep="1"><b>Media proximity</b></entry>
<entry morerows="2" rowsep="1">The print head is placed in close proximity to the print medium. Selected drops protrude from the print head further than unselected drops, and contact the print medium. The drop soaks into the medium fast enough to cause drop separation.</entry>
<entry>◆ Low power</entry>
<entry>◆ Precision assembly required</entry>
<entry morerows="2" rowsep="1">◆ Silverbrook, EP 0771 658 A2 and related patent applications</entry></row>
<row rowsep="0">
<entry>◆ High accuracy</entry>
<entry>◆ Paper fibers may cause problem</entry></row>
<row>
<entry>◆ Simple print head construction</entry>
<entry>◆ Cannot print on rough substrates</entry></row><!-- EPO <DP n="28"> -->
<row rowsep="0">
<entry morerows="2" rowsep="1"><b>Transfer roller</b></entry>
<entry morerows="2" rowsep="1">Drops are printed to a transfer roller instead of straight to the print medium. A transfer roller can also be used for proximity drop separation.</entry>
<entry>◆ High accuracy</entry>
<entry>◆ Bulky</entry>
<entry>◆ Silverbrook, EP 0771 658 A2 and related patent applications</entry></row>
<row rowsep="0">
<entry>◆ Wide range of print substrates can be used</entry>
<entry>◆ Expensive</entry>
<entry>◆ Tektronix hot melt piezoelectric inkjet</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Ink can be dried on the transfer roller</entry>
<entry rowsep="1">◆ Complex construction</entry>
<entry rowsep="1">◆ Any of the IJ series</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1"><b>Electrostatic</b></entry>
<entry morerows="1" rowsep="1">An electric field is used to accelerate selected drops towards the print medium.</entry>
<entry>◆ Low power</entry>
<entry morerows="1" rowsep="1">◆ Field strength required for separation of small drops is near or above air breakdown</entry>
<entry>◆ Silverbrook, EP 0771 658 A2 and related patent applications</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Simple print head construction</entry>
<entry rowsep="1">◆ Tone-Jet</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1"><b>Direct magnetic field</b></entry>
<entry morerows="1" rowsep="1">A magnetic field is used to accelerate selected drops of magnetic ink towards the print medium.</entry>
<entry>◆ Low power</entry>
<entry>◆ Requires magnetic ink</entry>
<entry morerows="1" rowsep="1">◆ Silverbrook, EP 0771 658 A2 and related patent applications</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Simple print head construction</entry>
<entry rowsep="1">◆ Requires strong magnetic field</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1"><b>Cross magnetic field</b></entry>
<entry morerows="1" rowsep="1">The print head is placed in a constant magnetic field. The Lorenz force in a current carrying wire is used to move the actuator.</entry>
<entry morerows="1" rowsep="1">◆ Does not require magnetic materials to be integrated in the print head manufacturing process</entry>
<entry>◆ Requires external magnet</entry>
<entry morerows="1" rowsep="1">◆ IJ06, IJ16</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Current densities may be high, resulting in electromigration problems</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1"><b>Pulsed magnetic field</b></entry>
<entry morerows="1" rowsep="1">A pulsed magnetic field is used to cyclically attract a paddle, which pushes on the ink. A small actuator moves a catch, which selectively prevents the paddle from moving.</entry>
<entry>◆ Very low power operation is possible</entry>
<entry>◆ Complex print head construction</entry>
<entry morerows="1" rowsep="1">◆ IJ10</entry></row>
<row rowsep="0">
<entry>◆ Small print head size</entry>
<entry>◆ Magnetic materials required in print head</entry></row></tbody></tgroup>
</table>
</tables><!-- EPO <DP n="29"> -->
<tables id="tabl0005" num="0005">
<table frame="all">
<title><b><u style="single">Actuator amplification or modification method</u></b></title>
<tgroup cols="5">
<colspec colnum="1" colname="col1" colwidth="33mm"/>
<colspec colnum="2" colname="col2" colwidth="33mm"/>
<colspec colnum="3" colname="col3" colwidth="34mm"/>
<colspec colnum="4" colname="col4" colwidth="34mm"/>
<colspec colnum="5" colname="col5" colwidth="34mm"/>
<thead>
<row>
<entry valign="top"><b>Actuator amplification</b></entry>
<entry valign="top"><b>Description</b></entry>
<entry valign="top"><b>Advantages</b></entry>
<entry valign="top"><b>Disadvantages</b></entry>
<entry valign="top"><b>Examples</b></entry></row></thead>
<tbody>
<row rowsep="0">
<entry morerows="2" rowsep="1"><b>None</b></entry>
<entry morerows="2" rowsep="1">No actuator mechanical amplification is used. The actuator directly drives the drop ejection process.</entry>
<entry morerows="2" rowsep="1">◆ Operational simplicity</entry>
<entry morerows="2" rowsep="1">◆ Many actuator mechanisms have insufficient travel, or insufficient force, to efficiently drive the drop ejection process</entry>
<entry>◆ Thermal Bubble Inkjet</entry></row>
<row rowsep="0">
<entry>◆ IJ01, IJ02, IJ06, IJ07</entry></row>
<row>
<entry>◆ IJ16, IJ25, IJ26</entry></row>
<row rowsep="0">
<entry morerows="3" rowsep="1"><b>Differential expansion bend actuator</b></entry>
<entry morerows="3" rowsep="1">An actuator material expands more on one side than on the other. The expansion may be thermal, piezoelectric, magnetostrictive, or other mechanism.</entry>
<entry>◆ Provides greater travel in a reduced print head area</entry>
<entry>◆ High stresses are involved</entry>
<entry>◆ Piezoelectric</entry></row>
<row rowsep="0">
<entry morerows="2" rowsep="1">◆ The bend actuator converts a high force low travel actuator mechanism to high travel, lower force mechanism.</entry>
<entry>◆ Care must be taken that the materials do not delaminate</entry>
<entry>◆ IJ03, IJ09, IJ17-IJ24</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1">◆ Residual bend resulting from high temperature or high stress during formation</entry>
<entry>◆ IJ27, IJ29-IJ39, IJ42,</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ IJ43, IJ44</entry></row>
<row rowsep="0">
<entry morerows="2" rowsep="1"><b>Transient bend actuator</b></entry>
<entry morerows="2" rowsep="1">A trilayer bend actuator where the two outside layers are identical. This cancels bend due to ambient temperature and residual stress. The actuator only responds to transient heating of one side or the other.</entry>
<entry>◆ Very good temperature stability</entry>
<entry>◆ High stresses are involved</entry>
<entry morerows="2" rowsep="1">◆ IJ40, IJ41</entry></row>
<row rowsep="0">
<entry>◆ High speed, as a new drop can be fired before heat dissipates</entry>
<entry morerows="1" rowsep="1">◆ Care must be taken that the materials do not delaminate</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Cancels residual stress of formation</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1"><b>Actuator stack</b></entry>
<entry morerows="1" rowsep="1">A series of thin actuators are stacked. This can be appropriate where actuators require high electric field strength, such as electrostatic and piezoelectric actuators.</entry>
<entry>◆ Increased travel</entry>
<entry>◆ Increased fabrication complexity</entry>
<entry>◆ Some piezoelectric ink jets</entry></row>
<row>
<entry>◆ Reduced drive voltage</entry>
<entry>◆ Increased possibility of short circuits due to pinholes</entry>
<entry>◆ IJ04</entry></row><!-- EPO <DP n="30"> -->
<row rowsep="0">
<entry morerows="1" rowsep="1"><b>Multiple actuators</b></entry>
<entry morerows="1" rowsep="1">Multiple smaller actuators are used simultaneously to move the ink. Each actuator need provide only a portion of the force required.</entry>
<entry>◆ Increases the force available from an actuator</entry>
<entry morerows="1" rowsep="1">◆ Actuator forces may not add linearly, reducing efficiency</entry>
<entry>◆ IJ12, IJ13, IJ18, IJ20</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Multiple actuators can be positioned to control ink flow accurately</entry>
<entry rowsep="1">◆ IJ22, IJ28, IJ42, IJ43</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1"><b>Linear Spring</b></entry>
<entry morerows="1" rowsep="1">A linear spring is used to transform a motion with small travel and high force into a longer travel, lower force motion.</entry>
<entry>◆ Matches low travel actuator with higher travel requirements</entry>
<entry morerows="1" rowsep="1">◆ Requires print head area for the spring</entry>
<entry morerows="1" rowsep="1">◆ IJ15</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Non-contact method of motion transformation</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1"><b>Reverse spring</b></entry>
<entry>The actuator loads a spring. When the actuator is turned off, the spring releases.</entry>
<entry morerows="1" rowsep="1">◆ Better coupling to the ink</entry>
<entry morerows="1" rowsep="1">◆ Fabrication complexity High stress in the spring</entry>
<entry morerows="1" rowsep="1">◆ IJ05, IJ11</entry></row>
<row rowsep="0">
<entry rowsep="1">This can reverse the force/distance curve of the actuator to make it compatible with the force/time requirements of the drop ejection.</entry></row>
<row rowsep="0">
<entry morerows="2" rowsep="1"><b>Coiled actuator</b></entry>
<entry morerows="2" rowsep="1">A bend actuator is coiled to provide greater travel in a reduced chip area.</entry>
<entry>◆ Increases travel</entry>
<entry morerows="2" rowsep="1">◆ Generally restricted to planar implementations due to extreme fabrication difficulty in other orientations.</entry>
<entry morerows="2" rowsep="1">◆ IJ17, IJ21, IJ34, IJ35</entry></row>
<row rowsep="0">
<entry>◆ Reduces chip area</entry></row>
<row>
<entry>◆ Planar implementations are relatively easy to fabricate.</entry></row><!-- EPO <DP n="31"> -->
<row rowsep="0">
<entry morerows="2" rowsep="1"><b>Flexure bend actuator</b></entry>
<entry>A bend actuator has a small region near the fixture point, which flexes much more readily than the remainder of the actuator.</entry>
<entry morerows="2" rowsep="1">◆ Simple means of increasing travel of a bend actuator</entry>
<entry>◆ Care must be taken not to exceed the elastic limit in the flexure area</entry>
<entry morerows="2" rowsep="1">◆ IJ10, IJ19, IJ33</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1">The actuator flexing is effectively converted from an even coiling to an angular bend, resulting in greater travel of the actuator tip.</entry>
<entry>◆ Stress distribution is very uneven</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Difficult to accurately model with finite element analysis</entry></row>
<row rowsep="0">
<entry morerows="4" rowsep="1"><b>Gears</b></entry>
<entry morerows="4" rowsep="1">Gears can be used to increase travel at the expense of duration. Circular gears, rack and pinion, ratchets, and other gearing methods can be used.</entry>
<entry>◆ Low force, low travel actuators can be used</entry>
<entry>◆ Moving parts are required</entry>
<entry morerows="4" rowsep="1">◆ IJ13</entry></row>
<row rowsep="0">
<entry morerows="3" rowsep="1">◆ Can be fabricated using standard surface MEMS processes</entry>
<entry>◆ Several actuator cycles are required</entry></row>
<row rowsep="0">
<entry>◆ More complex drive electronics</entry></row>
<row rowsep="0">
<entry>◆ Complex construction</entry></row>
<row>
<entry>◆ Friction, friction, and wear are possible</entry></row>
<row rowsep="0">
<entry morerows="2" rowsep="1"><b>Catch</b></entry>
<entry morerows="2" rowsep="1">The actuator controls a small catch. The catch either enables or disables movement of an ink pusher that is controlled in a bulk manner.</entry>
<entry>◆ Very low actuator energy</entry>
<entry>◆ Complex construction</entry>
<entry morerows="2" rowsep="1">◆ IJ10</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1">◆ Very small actuator size</entry>
<entry>◆ Requires external force</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Unsuitable for pigmented inks</entry></row>
<row rowsep="0">
<entry morerows="2" rowsep="1"><b>Buckle plate</b></entry>
<entry morerows="2" rowsep="1">A buckle plate can be used to change a slow actuator into a fast motion. It can also convert a high force, low travel actuator into a high travel, medium force motion.</entry>
<entry morerows="2" rowsep="1">◆ Very fast movement achievable</entry>
<entry>◆ Must stay within elastic limits of the materials for long device life</entry>
<entry>◆ S. Hirata et al, "An Ink-jet Head ...", Proc. IEEE MEMS, Feb. 1996, pp 418-423.</entry></row>
<row rowsep="0">
<entry>◆ High stresses involved</entry>
<entry morerows="1" rowsep="1">◆ IJ18, IJ27</entry></row>
<row>
<entry>◆ Generally high power requirement</entry></row><!-- EPO <DP n="32"> -->
<row rowsep="0">
<entry rowsep="1"><b>Tapered magnetic pole</b></entry>
<entry rowsep="1">A tapered magnetic pole can increase travel at the expense of force.</entry>
<entry rowsep="1">◆ Linearizes the magnetic force/distance curve</entry>
<entry rowsep="1">◆ Complex construction</entry>
<entry rowsep="1">◆ IJ14</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1"><b>Lever</b></entry>
<entry morerows="1" rowsep="1">A lever and fulcrum is used to transform a motion with small travel and high force into a motion with longer travel and lower force. The lever can also reverse the direction of travel.</entry>
<entry>◆ Matches low travel actuator with higher travel requirements</entry>
<entry morerows="1" rowsep="1">◆ High stress around the fulcrum</entry>
<entry morerows="1" rowsep="1">◆ IJ32, IJ36, IJ37</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Fulcrum area has no linear movement, and can be used for a fluid seal</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1"><b>Rotary impeller</b></entry>
<entry morerows="1" rowsep="1">The actuator is connected to a rotary impeller. A small angular deflection of the actuator results in a rotation of the impeller vanes, which push the ink against stationary vanes and out of the nozzle.</entry>
<entry>◆ High mechanical advantage</entry>
<entry>◆ Complex construction</entry>
<entry morerows="1" rowsep="1">◆ IJ28</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ The ratio of force to travel of the actuator can be matched to the nozzle requirements by varying the number of impeller vanes</entry>
<entry rowsep="1">◆ Unsuitable for pigmented inks</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1"><b>Acoustic lens</b></entry>
<entry morerows="1" rowsep="1">A refractive or diffractive (e.g. zone plate) acoustic lens is used to concentrate sound waves.</entry>
<entry morerows="1" rowsep="1">◆ No moving parts</entry>
<entry>◆ Large area required</entry>
<entry>◆ 1993 Hadimioglu et al, EUP 550,192</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Only relevant for acoustic ink jets</entry>
<entry rowsep="1">◆ 1993 Elrod et al, EUP 572,220</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1"><b>Sharp conductive point</b></entry>
<entry morerows="1" rowsep="1">A sharp point is used to concentrate an electrostatic field.</entry>
<entry morerows="1" rowsep="1">◆ Simple construction</entry>
<entry>◆ Difficult to fabricate using standard VLSI processes for a surface ejecting ink-jet</entry>
<entry morerows="1" rowsep="1">◆ Tone-jet</entry></row>
<row rowsep="0">
<entry>◆ Only relevant for electrostatic ink jets</entry></row></tbody></tgroup>
</table>
</tables><!-- EPO <DP n="33"> -->
<tables id="tabl0006" num="0006">
<table frame="all">
<title><b><u style="single">Actuator motion</u></b></title>
<tgroup cols="5">
<colspec colnum="1" colname="col1" colwidth="33mm"/>
<colspec colnum="2" colname="col2" colwidth="32mm"/>
<colspec colnum="3" colname="col3" colwidth="35mm"/>
<colspec colnum="4" colname="col4" colwidth="34mm"/>
<colspec colnum="5" colname="col5" colwidth="35mm"/>
<thead>
<row>
<entry valign="top"><b>Actuator motion</b></entry>
<entry valign="top"><b>Description</b></entry>
<entry valign="top"><b>Advantages</b></entry>
<entry valign="top"><b>Disadvantages</b></entry>
<entry valign="top"><b>Examples</b></entry></row></thead>
<tbody>
<row rowsep="0">
<entry morerows="1" rowsep="1"><b>Volume expansion</b></entry>
<entry morerows="1" rowsep="1">The volume of the actuator changes, pushing the ink in all directions.</entry>
<entry morerows="1" rowsep="1">◆ Simple construction in the case of thermal inkjet</entry>
<entry morerows="1" rowsep="1">◆ High energy is typically required to achieve volume expansion. Thisleads to thermal stress, cavitation, and kogation in thermal ink jet implementations</entry>
<entry>◆ Hewlett-Packard Thermal Inkjet</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Canon Bubblejet</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1"><b>Linear, normal to chip surface</b></entry>
<entry morerows="1" rowsep="1">The actuator moves in a direction normal to the print head surface. The nozzle is typically in the line of movement.</entry>
<entry morerows="1" rowsep="1">◆ Efficient coupling to ink drops ejected normal to the surface</entry>
<entry morerows="1" rowsep="1">◆ High fabrication complexity may be required to achieve perpendicular motion</entry>
<entry>◆ IJ01, IJ02, IJ04, IJ07</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ IJ11, IJ14</entry></row>
<row rowsep="0">
<entry morerows="2" rowsep="1"><b>Linear, parallel to chip surface</b></entry>
<entry morerows="2" rowsep="1">The actuator moves parallel to the print head surface. Drop ejection may still be normal to the surface.</entry>
<entry>◆ Suitable for planar fabrication</entry>
<entry>◆ Fabrication complexity</entry>
<entry>◆ IJ12, IJ13, IJ15, IJ33,</entry></row>
<row rowsep="0">
<entry/>
<entry>◆ Friction</entry>
<entry morerows="1" rowsep="1">◆ IJ34, IJ35, IJ36</entry></row>
<row>
<entry/>
<entry>◆ Stiction</entry></row>
<row rowsep="0">
<entry morerows="2" rowsep="1"><b>Membrane push</b></entry>
<entry morerows="2" rowsep="1">An actuator with a high force but small area is used to push a stiff membrane that is in contact with the ink.</entry>
<entry morerows="2" rowsep="1">◆ The effective area of the actuator becomes the membrane area</entry>
<entry>◆ Fabrication complexity</entry>
<entry morerows="2" rowsep="1">◆ 1982 Howkins USP 4,459,601</entry></row>
<row rowsep="0">
<entry>◆ Actuator size</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Difficulty of integration in a VLSI process</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1"><b>Rotary</b></entry>
<entry morerows="1" rowsep="1">The actuator causes the rotation of some element, such a grill or impeller</entry>
<entry>◆ Rotary levers may be used to increase travel</entry>
<entry>◆ Device complexity</entry>
<entry morerows="1" rowsep="1">◆ IJ05, IJ08, IJ13, IJ28</entry></row>
<row>
<entry>◆ Small chip area requirements</entry>
<entry>◆ May have friction at a pivot point</entry></row><!-- EPO <DP n="34"> -->
<row rowsep="0">
<entry morerows="5" rowsep="1"><b>Bend</b></entry>
<entry morerows="5" rowsep="1">The actuator bends when energized. This may be due to differential thermal expansion, piezoelectric expansion, magnetostriction, or other form of relative dimensional change.</entry>
<entry morerows="5" rowsep="1">◆ A very small change in dimensions can be converted to a large motion.</entry>
<entry morerows="5" rowsep="1">◆ Requires the actuator to be made from at least two distinct layers, or to have a thermal difference across the actuator</entry>
<entry>◆ 1970 Kyser et al USP 3,946,398</entry></row>
<row rowsep="0">
<entry>◆ 1973 Stemme USP 3,747,120</entry></row>
<row rowsep="0">
<entry>◆ IJ03, IJ09, IJ10, IJ19</entry></row>
<row rowsep="0">
<entry>◆ IJ23, IJ24, IJ25, IJ29</entry></row>
<row rowsep="0">
<entry>◆ IJ30, IJ31, IJ33, IJ34</entry></row>
<row>
<entry>◆ IJ35</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1"><b>Swivel</b></entry>
<entry morerows="1" rowsep="1">The actuator swivels around a central pivot. This motion is suitable where there are opposite forces applied to opposite sides of the paddle, e.g. Lorenz force.</entry>
<entry>◆ Allows operation where the net linear force on the paddle is zero</entry>
<entry morerows="1" rowsep="1">◆ Inefficient coupling to the ink motion</entry>
<entry morerows="1" rowsep="1">◆ IJ06</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Small chip area requirements</entry></row>
<row rowsep="0">
<entry rowsep="1"><b>Straighten</b></entry>
<entry rowsep="1">The actuator is normally bent, and straightens when energized.</entry>
<entry rowsep="1">◆ Can be used with shape memory alloys where the austenic phase is planar</entry>
<entry rowsep="1">◆ Requires careful balance of stresses to ensure that the quiescent bend is accurate</entry>
<entry rowsep="1">◆ IJ26, IJ32</entry></row>
<row rowsep="0">
<entry morerows="2" rowsep="1"><b>Double bend</b></entry>
<entry morerows="2" rowsep="1">The actuator bends in one direction when one element is energized, and bends the other way when another element is energized.</entry>
<entry>◆ One actuator can be used to power two nozzles.</entry>
<entry>◆ Difficult to make the drops ejected by both bend directions identical.</entry>
<entry morerows="2" rowsep="1">◆ IJ36, IJ37, IJ38</entry></row>
<row rowsep="0">
<entry>◆ Reduced chip size.</entry>
<entry morerows="1" rowsep="1">◆ A small efficiency loss compared to equivalent single bend actuators.</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Not sensitive to ambient temperature</entry></row>
<row>
<entry><b>Shear</b></entry>
<entry>Energizing the actuator causes a shear motion in the actuator material.</entry>
<entry>◆ Can increase the effective travel of piezoelectric actuators</entry>
<entry>◆ Not readily applicable to other actuator mechanisms</entry>
<entry>◆ 1985 Fishbeck USP 4,584,590</entry></row><!-- EPO <DP n="35"> -->
<row rowsep="0">
<entry morerows="2" rowsep="1"><b>Radial constriction</b></entry>
<entry morerows="2" rowsep="1">The actuator squeezes an ink reservoir, forcing ink from a constricted nozzle.</entry>
<entry morerows="2" rowsep="1">◆ Relatively easy to fabricate single nozzles from glass tubing as macroscopic structures</entry>
<entry>◆ High force required</entry>
<entry morerows="2" rowsep="1">◆ 1970 Zoltan USP 3,683,212</entry></row>
<row rowsep="0">
<entry>◆ Inefficient</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Difficult to integrate with VLSI processes</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1"><b>Coil / uncoil</b></entry>
<entry morerows="1" rowsep="1">A coiled actuator uncoils or coils more tightly. The motion of the free end of the actuator ejects the ink.</entry>
<entry>◆ Easy to fabricate as a planar VLSI process</entry>
<entry>◆ Difficult to fabricate for non-planar devices</entry>
<entry morerows="1" rowsep="1">◆ IJ17, IJ21, IJ34, IJ35</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Small area required, therefore low cost</entry>
<entry rowsep="1">◆ Poor out-of-plane stiffness</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1"><b>Bow</b></entry>
<entry morerows="1" rowsep="1">The actuator bows (or buckles) in the middle when energized,</entry>
<entry>◆ Can increase the speed of travel</entry>
<entry>◆ Maximum travel is constrained</entry>
<entry morerows="1" rowsep="1">◆ IJ16, IJ18, IJ27</entry></row>
<row>
<entry>◆ Mechanically rigid</entry>
<entry>◆ High force required</entry></row>
<row rowsep="0">
<entry rowsep="1"><b>Push-Pull</b></entry>
<entry rowsep="1">Two actuators control a shutter. One actuator pulls the shutter, and the other pushes it.</entry>
<entry rowsep="1">◆ The structure is pinned at both ends, so has a high out-of-plane rigidity</entry>
<entry rowsep="1">◆ Not readily suitable for inkjets which directly push the ink</entry>
<entry rowsep="1">◆ IJ18</entry></row>
<row rowsep="0">
<entry rowsep="1"><b>Curl inwards</b></entry>
<entry rowsep="1">A set of actuators curl inwards to reduce the volume of ink that they enclose.</entry>
<entry rowsep="1">◆ Good fluid flow to the region behind the actuator increases efficiency</entry>
<entry rowsep="1">◆ Design complexity</entry>
<entry rowsep="1">◆ IJ20, IJ42</entry></row>
<row rowsep="0">
<entry rowsep="1"><b>Curl outwards</b></entry>
<entry rowsep="1">A set of actuators curl outwards, pressurizing ink in a chamber surrounding the actuators, and expelling ink from a nozzle in the chamber.</entry>
<entry rowsep="1">◆ Relatively simple construction</entry>
<entry rowsep="1">◆ Relatively large chip area</entry>
<entry rowsep="1">◆ IJ43</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1"><b>Iris</b></entry>
<entry>Multiple vanes enclose a volume of ink.</entry>
<entry>◆ High efficiency</entry>
<entry>◆ High fabrication complexity</entry>
<entry morerows="1" rowsep="1">◆ IJ22</entry></row>
<row>
<entry>These simultaneously rotate, reducing the volume between the vanes.</entry>
<entry>◆ Small chip area</entry>
<entry>◆ Not suitable for pigmented inks</entry></row><!-- EPO <DP n="36"> -->
<row rowsep="0">
<entry morerows="3" rowsep="1"><b>Acoustic vibration</b></entry>
<entry morerows="3" rowsep="1">The actuator vibrates at a high frequency.</entry>
<entry morerows="3" rowsep="1">◆ The actuator can be physically distant from the ink</entry>
<entry>◆ Large area required for efficient operation at useful frequencies</entry>
<entry>◆ 1993 Hadimioglu et al, EUP 550,192</entry></row>
<row rowsep="0">
<entry>◆ Acoustic coupling and crosstalk</entry>
<entry morerows="2" rowsep="1">◆ 1993 Elrod et al, EUP 572,220</entry></row>
<row rowsep="0">
<entry>◆ Complex drive circuitry</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Poor control of drop volume and position</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1"><b>None</b></entry>
<entry morerows="1" rowsep="1">In various ink jet designs the actuator does not move.</entry>
<entry morerows="1" rowsep="1">◆ No moving parts</entry>
<entry morerows="1" rowsep="1">◆ Various other tradeoffs are required to eliminate moving parts</entry>
<entry>◆ Silverbrook, EP 0771 658 A2 and related patent applications</entry></row>
<row rowsep="0">
<entry>◆ Tone-jet</entry></row></tbody></tgroup>
</table>
</tables>
<tables id="tabl0007" num="0007">
<table frame="all">
<title><b><u style="single">Nozzle refill method</u></b></title>
<tgroup cols="5">
<colspec colnum="1" colname="col1" colwidth="32mm"/>
<colspec colnum="2" colname="col2" colwidth="32mm"/>
<colspec colnum="3" colname="col3" colwidth="34mm"/>
<colspec colnum="4" colname="col4" colwidth="35mm"/>
<colspec colnum="5" colname="col5" colwidth="34mm"/>
<thead>
<row>
<entry valign="top"><b>Nozzle refill method</b></entry>
<entry valign="top"><b>Description</b></entry>
<entry valign="top"><b>Advantages</b></entry>
<entry valign="top"><b>Disadvantages</b></entry>
<entry valign="top"><b>Examples</b></entry></row></thead>
<tbody>
<row rowsep="0">
<entry morerows="3" rowsep="1"><b>Surface tension</b></entry>
<entry>After the actuator is energized, it typically returns rapidly to its normal position. This rapid return sucks in air through the nozzle opening.</entry>
<entry>◆ Fabrication simplicity</entry>
<entry>◆ Low speed</entry>
<entry>◆ Thermal inkjet</entry></row>
<row rowsep="0">
<entry morerows="2" rowsep="1">The ink surface tension at the nozzle then exerts a small force restoring the meniscus to a minimum area.</entry>
<entry morerows="2" rowsep="1">◆ Operational simplicity</entry>
<entry>◆ Surface tension force relatively small compared to actuator force</entry>
<entry>◆ Piezoelectric inkjet</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1">◆ Long refill time usually dominates the total repetition rate</entry>
<entry>◆ IJ01-IJ07, IJ10-IJ14</entry></row>
<row>
<entry>◆ IJ16, IJ20, IJ22-IJ45</entry></row><!-- EPO <DP n="37"> -->
<row rowsep="0">
<entry><b>Shuttered</b></entry>
<entry>Ink to the nozzle chamber is provided at a</entry>
<entry>◆ High speed</entry>
<entry>◆ Requires common ink pressure</entry>
<entry>◆ IJ08, IJ13, IJ15, IJ17</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1"><b>oscillating ink pressure</b></entry>
<entry morerows="1" rowsep="1">pressure that oscillates at twice the drop ejection frequency. When a drop is to be ejected, the shutter is opened for 3 half cycles: drop ejection, actuator return, and refill.</entry>
<entry morerows="1" rowsep="1">◆ Low actuator energy, as the actuator need only open or close the shutter, instead of ejecting the ink drop</entry>
<entry>oscillator</entry>
<entry>◆ IJ18, IJ19, IJ21</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ May not be suitable for pigmented inks</entry>
<entry rowsep="1"/></row>
<row rowsep="0">
<entry rowsep="1"><b>Refill actuator</b></entry>
<entry rowsep="1">After the main actuator has ejected a drop a second (refill) actuator is energized. The refill actuator pushes ink into the nozzle chamber. The refill actuator returns slowly, to prevent its return from emptying the chamber again.</entry>
<entry rowsep="1">◆ High speed, as the nozzle is actively refilled</entry>
<entry rowsep="1">◆ Requires two independent actuators per nozzle</entry>
<entry rowsep="1">◆ IJ09</entry></row>
<row rowsep="0">
<entry morerows="3" rowsep="1"><b>Positive ink pressure</b></entry>
<entry morerows="3" rowsep="1">The ink is held a slight positive pressure. After the ink drop is ejected. the nozzle chamber fills quickly as surface tension and ink pressure both operate to refill the nozzle.</entry>
<entry morerows="3" rowsep="1">◆ High refill rate, therefore a high drop repetition rate is possible</entry>
<entry>◆ Surface spill must be prevented</entry>
<entry>◆ Silverbrook, EP 0771 658 A2 and related patent applications</entry></row>
<row rowsep="0">
<entry morerows="2" rowsep="1">◆ Highly hydrophobic print head surfaces are required</entry>
<entry>◆ Alternative for:</entry></row>
<row rowsep="0">
<entry>◆ IJ01-IJ07, IJ10-IJ14</entry></row>
<row rowsep="0">
<entry>◆ IJ16, IJ20, IJ22-IJ45</entry></row></tbody></tgroup>
</table>
</tables><!-- EPO <DP n="38"> -->
<tables id="tabl0008" num="0008">
<table frame="all">
<title><b><u style="single">Method of restricting back-flow through inlet</u></b></title>
<tgroup cols="5">
<colspec colnum="1" colname="col1" colwidth="33mm"/>
<colspec colnum="2" colname="col2" colwidth="32mm"/>
<colspec colnum="3" colname="col3" colwidth="32mm"/>
<colspec colnum="4" colname="col4" colwidth="34mm"/>
<colspec colnum="5" colname="col5" colwidth="36mm"/>
<thead>
<row>
<entry valign="top"><b>Inlet back-flow restriction method</b></entry>
<entry valign="top"><b>Description</b></entry>
<entry valign="top"><b>Advantages</b></entry>
<entry valign="top"><b>Disadvantages</b></entry>
<entry valign="top"><b>Examples</b></entry></row></thead>
<tbody>
<row>
<entry morerows="2"><b>Long Inlet channel</b></entry>
<entry morerows="2">The ink inlet channel to the nozzle chamber is made long and relatively narrow, relying on viscous drag to reduce inlet back-flow.</entry>
<entry rowsep="0">◆ Design simplicity</entry>
<entry rowsep="0">◆ Restricts refill rate</entry>
<entry rowsep="0">◆ Thermal inkjet</entry></row>
<row>
<entry rowsep="0">◆ Operational simplicity</entry>
<entry rowsep="0">◆ May result in a relatively large chip area</entry>
<entry rowsep="0">◆ Piezoelectric inkjet</entry></row>
<row>
<entry>◆ Reduces crosstalk</entry>
<entry>◆ Only partially effective</entry>
<entry>◆ IJ42, IJ43</entry></row>
<row>
<entry morerows="5"><b>Positive ink pressure</b></entry>
<entry rowsep="0">The ink is under a positive pressure, so that in the quiescent state some of the ink drop already protrudes from the nozzle.</entry>
<entry rowsep="0">◆ Drop selection and separation forces can be reduced</entry>
<entry morerows="5">◆ Requires a method (such as a nozzle rim or effective hydrophobizing, or both) to prevent flooding of the ejection surface of the print head.</entry>
<entry rowsep="0">◆ Silverbrook, EP 0771 658 A2 and related patent applications</entry></row>
<row>
<entry morerows="4">This reduces the pressure in the nozzle chamber which is required to eject a certain volume of ink. The reduction in chamber pressure results In a reduction in ink pushed out through the inlet.</entry>
<entry morerows="4">◆ Fast refill time</entry>
<entry rowsep="0">◆ Possible operation of the following:</entry></row>
<row>
<entry rowsep="0">◆ IJ01-IJ07, IJ09- IJ12</entry></row>
<row>
<entry rowsep="0">◆ IJ14, IJ16, IJ20, IJ22,</entry></row>
<row>
<entry rowsep="0">◆ IJ23-IJ34, IJ36- IJ41</entry></row>
<row>
<entry>◆ IJ44</entry></row>
<row>
<entry morerows="1"><b>Baffle</b></entry>
<entry rowsep="0">One or more baffles are placed in the inlet ink flow. When the actuator is energized, the rapid ink movement creates eddies which restrict the flow through the inlet.</entry>
<entry rowsep="0">◆ The refill rate is not as restricted as the long inlet method.</entry>
<entry rowsep="0">◆ Design complexity</entry>
<entry rowsep="0">◆ HP Thermal Ink Jet</entry></row>
<row>
<entry>The slower refill process is unrestricted, and does not result in eddies.</entry>
<entry>◆ Reduces crosstalk</entry>
<entry>◆ May increase fabrication complexity (e.g. Tektronix hot melt Piezoelectric print heads).</entry>
<entry>◆ Tektronix piezoelectric ink jet</entry></row>
<row>
<entry morerows="3"><b>Flexible flap restricts inlet</b></entry>
<entry morerows="3">In this method recently disclosed by Canon, the expanding actuator (bubble) pushes on a flexible flap that restricts the inlet.</entry>
<entry morerows="3">◆ Significantly reduces back-flow for edge-shooter thermal ink jet devices</entry>
<entry rowsep="0">◆ Not applicable to most inkjet configurations</entry>
<entry morerows="3">◆ Canon</entry></row>
<row>
<entry rowsep="0">◆ Increased fabrication complexity</entry></row>
<row>
<entry rowsep="0">◆ Inelastic deformation of polymer flap</entry></row>
<row>
<entry>results in creep over extended use</entry></row><!-- EPO <DP n="39"> -->
<row>
<entry morerows="1"><b>Inlet filter</b></entry>
<entry morerows="1">A filter is located between the ink inlet and the nozzle chamber. The filter has a multitude of small holes or slots, restricting ink flow. The filter also removes particles which may block the nozzle.</entry>
<entry rowsep="0">◆ Additional advantage of ink filtration</entry>
<entry rowsep="0">◆ Restricts refill rate</entry>
<entry rowsep="0">◆ IJ04, IJ12, IJ24, IJ27</entry></row>
<row>
<entry>◆ Ink filter may be fabricated with no additional process steps</entry>
<entry>◆ May result in complex construction</entry>
<entry>◆ IJ29, IJ30</entry></row>
<row>
<entry morerows="2"><b>Small inlet compared to nozzle</b></entry>
<entry morerows="2">The ink inlet channel to the nozzle chamber has a substantially smaller cross section than that of the nozzle , resulting in easier ink egress out of the nozzle than out of the inlet.</entry>
<entry morerows="2">◆ Design simplicity</entry>
<entry rowsep="0">◆ Restricts refill rate</entry>
<entry morerows="2">◆ IJ02, IJ37, IJ44</entry></row>
<row>
<entry rowsep="0">◆ May result in a relatively large chip area</entry></row>
<row>
<entry>◆ Only partially effective</entry></row>
<row>
<entry><b>Inlet shutter</b></entry>
<entry>A secondary actuator controls the position of a shutter, closing off the ink inlet when the main actuator is energized.</entry>
<entry>◆ Increases speed of the ink-jet print head operation</entry>
<entry>◆ Requires separate refill actuator and drive circuit</entry>
<entry>◆ IJ09</entry></row>
<row>
<entry morerows="5"><b>The inlet is located behind the ink-pushing surface</b></entry>
<entry morerows="5">The method avoids the problem of inlet back-flow by arranging the ink-pushing surface of the actuator between the inlet and the nozzle.</entry>
<entry morerows="5">◆ Back-flow problem is eliminated</entry>
<entry morerows="5">◆ Requires careful design to minimize the negative pressure behind the paddle</entry>
<entry rowsep="0">◆ IJ01, IJ03, IJ05, IJ06</entry></row>
<row>
<entry rowsep="0">◆ IJ07, IJ10, IJ11, IJ14</entry></row>
<row>
<entry rowsep="0">◆ IJ16, IJ22, IJ23, IJ25</entry></row>
<row>
<entry rowsep="0">◆ IJ28, IJ31, IJ32, IJ33</entry></row>
<row>
<entry rowsep="0">◆ IJ34, IJ35, IJ36, IJ39</entry></row>
<row>
<entry>◆ IJ40, IJ41</entry></row>
<row>
<entry morerows="1"><b>Part of the actuator moves to shut off the inlet</b></entry>
<entry morerows="1">The actuator and a wall of the ink chamber are arranged so that the motion of the actuator closes off the inlet.</entry>
<entry rowsep="0">◆ Significant reductions in back-flow can be achieved</entry>
<entry morerows="1">◆ Small increase in fabrication complexity</entry>
<entry morerows="1">◆ IJ07, IJ20, IJ26, IJ38</entry></row>
<row>
<entry>◆ Compact designs possible</entry></row><!-- EPO <DP n="40"> -->
<row>
<entry morerows="4"><b>Nozzle actuator does not result in ink back-flow</b></entry>
<entry morerows="4">In some configurations of ink jet, there is no expansion or movement of an actuator which may cause ink back-flow through the inlet.</entry>
<entry morerows="4">◆ Ink back-flow problem is eliminated</entry>
<entry morerows="4">◆ None related to ink back-flow on actuation</entry>
<entry rowsep="0">◆ Silverbrook, EP 0771 658 A2 and related patent applications</entry></row>
<row>
<entry rowsep="0">◆ Valve-jet</entry></row>
<row>
<entry rowsep="0">◆ Tone-jet</entry></row>
<row>
<entry rowsep="0">◆ IJ08, IJ13, IJ15, IJ17</entry></row>
<row>
<entry>◆ IJ18, IJ19, IJ21</entry></row></tbody></tgroup>
</table>
</tables>
<tables id="tabl0009" num="0009">
<table frame="all">
<title><b><u style="single">Nozzle Clearing Method</u></b></title>
<tgroup cols="5">
<colspec colnum="1" colname="col1" colwidth="33mm"/>
<colspec colnum="2" colname="col2" colwidth="33mm"/>
<colspec colnum="3" colname="col3" colwidth="34mm"/>
<colspec colnum="4" colname="col4" colwidth="33mm"/>
<colspec colnum="5" colname="col5" colwidth="34mm"/>
<thead>
<row>
<entry valign="top"><b>Nozzle Clearing method</b></entry>
<entry valign="top"><b>Description</b></entry>
<entry valign="top"><b>Advantage</b></entry>
<entry valign="top"><b>Disadvantages</b></entry>
<entry valign="top"><b>Examples</b></entry></row></thead>
<tbody>
<row>
<entry morerows="3"><b>Normal nozzle firing</b></entry>
<entry rowsep="0">All of the nozzles are fired periodically, before the ink has a chance to dry. When not in use the nozzles are sealed (capped) against air.</entry>
<entry morerows="3">◆ No added complexity on the print head</entry>
<entry morerows="3">◆ May not be sufficient to displace dried Ink</entry>
<entry rowsep="0">◆ Most ink jet systems</entry></row>
<row>
<entry morerows="2">The nozzle firing is usually performed during a special clearing cycle, after first moving the print head to a cleaning station.</entry>
<entry rowsep="0">◆ IJ01-IJ07, IJ09-IJ12</entry></row>
<row>
<entry rowsep="0">◆ IJ14, IJ16, IJ20, IJ22</entry></row>
<row>
<entry>◆ IJ23-IJ34, IJ36-IJ45</entry></row>
<row>
<entry morerows="1"><b>Extra power to ink beater</b></entry>
<entry morerows="1">In systems which heat the ink, but do not boil it under normal situations, nozzle clearing can be achieved by over-powering the heater and boiling ink at the nozzle.</entry>
<entry morerows="1">◆ Can be highly effective if the heater is adjacent to the nozzle</entry>
<entry rowsep="0">◆ Requires higher drive voltage for clearing</entry>
<entry morerows="1">◆ Silverbrook, EP 0771 658 A2 and related patent applications</entry></row>
<row>
<entry>◆ May require larger drive transistors</entry></row><!-- EPO <DP n="41"> -->
<row rowsep="0">
<entry morerows="4" rowsep="1"><b>Rapid succession of actuator pulses</b></entry>
<entry>The actuator is fired in rapid succession.</entry>
<entry>◆ Does not require extra drive circuits on the print head</entry>
<entry morerows="4" rowsep="1">◆ Effectiveness depends substantially upon the configuration of the inkjet nozzle</entry>
<entry>◆ May be used with:</entry></row>
<row rowsep="0">
<entry morerows="3" rowsep="1">In some configurations, this may cause heat build-up at the nozzle which boils the ink, clearing the nozzle. In other situations, it may cause sufficient vibrations to dislodge clogged nozzles.</entry>
<entry morerows="3" rowsep="1">◆ Can be readily controlled and initiated by digital logic</entry>
<entry>◆ IJ01-IJ07, IJ09- IJ11</entry></row>
<row rowsep="0">
<entry>◆ IJ14, IJ16, IJ20, IJ22</entry></row>
<row rowsep="0">
<entry>◆ IJ23-IJ25, IJ27-IJ34</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ IJ36-IJ45</entry></row>
<row rowsep="0">
<entry morerows="5" rowsep="1"><b>Extra power to ink pushing actuator</b></entry>
<entry morerows="5" rowsep="1">Where an actuator is not normally driven to the limit of its motion, nozzle clearing may be assisted by providing an enhanced drive signal to the actuator.</entry>
<entry morerows="5" rowsep="1">◆ A simple solution where applicable</entry>
<entry morerows="5" rowsep="1">◆ Not suitable where there is a hard limit to actuator movement</entry>
<entry>◆ May be used with:</entry></row>
<row rowsep="0">
<entry>◆ IJ03, IJ09, IJ16, IJ20</entry></row>
<row rowsep="0">
<entry>◆ IJ23, IJ24, IJ25, IJ27</entry></row>
<row rowsep="0">
<entry>◆ IJ29, IJ30, IJ31, IJ32</entry></row>
<row rowsep="0">
<entry>◆ IJ39, IJ40, IJ41, IJ42</entry></row>
<row>
<entry>◆ IJ43, IJ44, IJ45</entry></row><!-- EPO <DP n="42"> -->
<row rowsep="0">
<entry morerows="1" rowsep="1"><b>Acoustic resonance</b></entry>
<entry morerows="1" rowsep="1">An ultrasonic wave is applied to the ink chamber. This wave is of an appropriate amplitude and frequency to cause sufficient force at the nozzle to clear blockages. This is easiest to achieve if the ultrasonic wave is at a resonant frequency of the ink cavity.</entry>
<entry>◆ A high nozzle clearing capability can be achieved</entry>
<entry morerows="1" rowsep="1">◆ High implementation cost if system does not already include an acoustic actuator</entry>
<entry>◆ IJ08, IJ13, IJ15, IJ17</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ May be implemented at very low cost in systems which already include acoustic actuators</entry>
<entry rowsep="1">◆ IJ18, IJ19, IJ21</entry></row>
<row rowsep="0">
<entry morerows="4" rowsep="1"><b>Nozzle clearing</b></entry>
<entry morerows="4" rowsep="1">A microfabricated plate is pushed against plate the nozzles. The plate has a post for every nozzle. The array of posts</entry>
<entry morerows="4" rowsep="1">◆ Can clear severely clogged nozzles</entry>
<entry>◆ Accurate mechanical alignment is required</entry>
<entry morerows="4" rowsep="1">◆ Silverbrook, EP 0771 658 A2 and related patent applications</entry></row>
<row rowsep="0">
<entry>◆ Moving parts are required</entry></row>
<row rowsep="0">
<entry>◆ There is risk of damage to the</entry></row>
<row rowsep="0">
<entry>nozzles</entry></row>
<row>
<entry>◆ Accurate fabrication is required</entry></row>
<row rowsep="0">
<entry morerows="2" rowsep="1"><b>Ink pressure pulse</b></entry>
<entry morerows="2" rowsep="1">The pressure of the ink is temporarily increased so that ink streams from all of the nozzles. This may be used in conjunction with actuator energizing.</entry>
<entry morerows="2" rowsep="1">◆ May be effective where other methods cannot be used</entry>
<entry>◆ Requires pressure pump or other pressure actuator</entry>
<entry morerows="2" rowsep="1">◆ May be used with all IJ series ink jets</entry></row>
<row rowsep="0">
<entry>◆ Expensive</entry></row>
<row>
<entry>◆ Wasteful of ink</entry></row>
<row rowsep="0">
<entry morerows="2" rowsep="1"><b>Print head wiper</b></entry>
<entry morerows="2" rowsep="1">A flexible 'blade' is wiped across the print head surface. The blade is usually fabricated from a flexible polymer, e.g. rubber or synthetic elastomer.</entry>
<entry>◆ Effective for planar print head surfaces</entry>
<entry>◆ Difficult to use if print head surface is non-planar or very fragile</entry>
<entry morerows="2" rowsep="1">◆ Many ink jet systems</entry></row>
<row rowsep="0">
<entry>◆ Low cost</entry>
<entry>◆ Requires mechanical parts</entry></row>
<row>
<entry/>
<entry>◆ Blade can wear out in high volume print systems</entry></row><!-- EPO <DP n="43"> -->
<row rowsep="0">
<entry morerows="1" rowsep="1"><b>Separate ink boiling heater</b></entry>
<entry morerows="1" rowsep="1">A separate heater is provided at the nozzle although the normal drop e-ection mechanism does not require it. The heaters do not require individual drive circuits, as many nozzles can be cleared simultaneously, and no imaging is required.</entry>
<entry>◆ Can be effective where other nozzle clearing methods cannot be used</entry>
<entry morerows="1" rowsep="1">◆ Fabrication complexity</entry>
<entry morerows="1" rowsep="1">◆ Can be used with many IJ series ink jets</entry></row>
<row rowsep="0">
<entry>◆ Can be implemented at no additional cost in some inkjet configurations</entry></row></tbody></tgroup>
</table>
</tables>
<tables id="tabl0010" num="0010">
<table frame="all">
<title><b><u style="single">Nozzle plate construction</u></b></title>
<tgroup cols="5">
<colspec colnum="1" colname="col1" colwidth="32mm"/>
<colspec colnum="2" colname="col2" colwidth="32mm"/>
<colspec colnum="3" colname="col3" colwidth="34mm"/>
<colspec colnum="4" colname="col4" colwidth="35mm"/>
<colspec colnum="5" colname="col5" colwidth="34mm"/>
<thead>
<row>
<entry valign="top"><b>Nozzle plate construction</b></entry>
<entry valign="top"><b>Description</b></entry>
<entry valign="top"><b>Advantages</b></entry>
<entry valign="top"><b>Disadvantages</b></entry>
<entry valign="top"><b>Examples</b></entry></row></thead>
<tbody>
<row rowsep="0">
<entry morerows="2" rowsep="1"><b>Electroformed nickel</b></entry>
<entry morerows="2" rowsep="1">A nozzle plate is separately fabricated from electroformed nickel, and bonded to the print head chip.</entry>
<entry morerows="2" rowsep="1">◆ Fabrication simplicity</entry>
<entry>◆ High temperatures and pressures are required to bond nozzle plate</entry>
<entry morerows="2" rowsep="1">◆ Hewlett Packard Thermal Inkjet</entry></row>
<row rowsep="0">
<entry>◆ Minimum thickness constraints</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Differential thermal expansion</entry></row>
<row rowsep="0">
<entry morerows="3" rowsep="1"><b>Laser ablated or drilled polymer</b></entry>
<entry morerows="3" rowsep="1">Individual nozzle holes are ablated by an intense UV laser in a nozzle plate, which is typically a polymer such as polyimide or polysulphone</entry>
<entry>◆ No masks required</entry>
<entry>◆ Each hole must be individually formed</entry>
<entry>◆ Canon Bubblejet</entry></row>
<row rowsep="0">
<entry>◆ Can be quite fast</entry>
<entry>◆ Special equipment required</entry>
<entry>◆ 1988 Sercel et al., SPIE, Vol. 998 Excimer Beam Applications, pp. 76-83</entry></row>
<row rowsep="0">
<entry>◆ Some control over nozzle profile is possible</entry>
<entry>◆ Slow where there are many thousands of nozzles per print head</entry>
<entry morerows="1" rowsep="1">◆ 1993 Watanabe et al., USP 5,208,604</entry></row>
<row>
<entry>◆ Equipment required is relatively low cost</entry>
<entry>◆ May produce thin burrs at exit holes</entry></row><!-- EPO <DP n="44"> -->
<row rowsep="0">
<entry morerows="3" rowsep="1"><b>Silicon micro-machined</b></entry>
<entry morerows="3" rowsep="1">A separate nozzle plate is micromachined from single crystal silicon, and bonded to the print head wafer.</entry>
<entry morerows="3" rowsep="1">◆ High accuracy is attainable</entry>
<entry>◆ Two part construction</entry>
<entry>◆ K. Bean, IEEE Transactions on Electron Devices, Vol. ED-25, No. 10, 1978, pp 1185-1195</entry></row>
<row rowsep="0">
<entry>◆ High cost</entry>
<entry morerows="2" rowsep="1">◆ Xerox 1990 Hawkins et al., USP 4,899,181</entry></row>
<row rowsep="0">
<entry>◆ Requires precision alignment</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Nozzles may be clogged by adhesive</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1"><b>Glass capillaries</b></entry>
<entry morerows="1" rowsep="1">Fine glass capillaries are drawn from glass tubing. This method has been used for making individual nozzles, but is difficult to use for bulk manufacturing of print heads with thousands of nozzles.</entry>
<entry>◆ No expensive equipment required</entry>
<entry>◆ Very small nozzle sizes are difficult to form</entry>
<entry morerows="1" rowsep="1">◆ 1970 Zoltan USP 3,683,212</entry></row>
<row>
<entry>◆ Simple to make single nozzles</entry>
<entry>◆ Not suited for mass production</entry></row><!-- EPO <DP n="45"> -->
<row rowsep="0">
<entry morerows="7" rowsep="1"><b>Monolithic, surface micro-machined using VLSI lithographic processes</b></entry>
<entry morerows="7" rowsep="1">The nozzle plate is deposited as a layer using standard VLSI deposition techniques. Nozzles are etched in the nozzle plate using VLSI lithography and etching.</entry>
<entry>◆ High accuracy (&lt;1 µm)</entry>
<entry>◆ Requires sacrificial layer under the nozzle plate to form the nozzle chamber</entry>
<entry>◆ Silverbrook, EP 0771 658 A2 and related patent applications</entry></row>
<row rowsep="0">
<entry>◆ Monolithic</entry>
<entry morerows="6" rowsep="1">◆ Surface may be fragile to the touch</entry>
<entry>◆ IJ01, IJ02, IJ04, IJ11</entry></row>
<row rowsep="0">
<entry>◆ Low cost</entry>
<entry>◆ IJ12, IJ17, IJ18, IJ20</entry></row>
<row rowsep="0">
<entry morerows="4" rowsep="1">◆ Existing processes can be used</entry>
<entry>◆ IJ22, IJ24, IJ27, IJ28</entry></row>
<row rowsep="0">
<entry>◆ IJ29, IJ30, IJ31, IJ32</entry></row>
<row rowsep="0">
<entry>◆ IJ33, IJ34, IJ36, IJ37</entry></row>
<row rowsep="0">
<entry>◆ IJ38, IJ39, IJ40, IJ41</entry></row>
<row>
<entry>◆ IJ42, IJ43, IJ44</entry></row>
<row rowsep="0">
<entry morerows="3" rowsep="1"><b>Monolithic, etched through substrate</b></entry>
<entry morerows="3" rowsep="1">The nozzle plate is a buried etch stop in the wafer. Nozzle chambers are etched in the front of the wafer, and the wafer is thinned from the back side. Nozzles are then etched in the etch stop layer.</entry>
<entry>◆ High accuracy (&lt;1 µm)</entry>
<entry>◆ Requires long etch times</entry>
<entry>◆ IJ03, IJ05, IJ06, IJ07</entry></row>
<row rowsep="0">
<entry>◆ Monolithic</entry>
<entry morerows="2" rowsep="1">◆ Requires a support wafer</entry>
<entry>◆ IJ08, IJ09, IJ10, IJ13</entry></row>
<row rowsep="0">
<entry>◆ Low cost</entry>
<entry>◆ IJ14, IJ15, IJ16, IJ19</entry></row>
<row>
<entry>◆ No differential expansion</entry>
<entry>◆ IJ21, IJ23, IJ25, IJ26</entry></row><!-- EPO <DP n="46"> -->
<row rowsep="0">
<entry morerows="2" rowsep="1"><b>No nozzle plate</b></entry>
<entry morerows="2" rowsep="1">Various methods have been tried to eliminate the nozzles entirely, to prevent nozzle clogging. These include thermal bubble mechanisms and acoustic lens mechanisms</entry>
<entry morerows="2" rowsep="1">◆ No nozzles to become clogged</entry>
<entry>◆ Difficult to control drop position accurately</entry>
<entry>◆ Ricoh 1995 Sekiya et al USP 5,412,413</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1">◆ Crosstalk problems</entry>
<entry>◆ 1993 Hadimioglu et al EUP 550,192</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ 1993 Elrod et al EUP 572,220</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1"><b>Trough</b></entry>
<entry morerows="1" rowsep="1">Each drop ejector has a trough through which a paddle moves. There is no nozzle plate.</entry>
<entry>◆ Reduced manufacturing complexity</entry>
<entry morerows="1" rowsep="1">◆ Drop firing direction is sensitive to wicking.</entry>
<entry morerows="1" rowsep="1">◆ IJ35</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Monolithic</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1"><b>Nozzle slit instead of individual nozzles</b></entry>
<entry morerows="1" rowsep="1">The elimination of nozzle holes and replacement by a slit encompassing many actuator positions reduces nozzle clogging, but increases crosstalk due to ink surface waves</entry>
<entry morerows="1" rowsep="1">◆ No nozzles to become clogged</entry>
<entry>◆ Difficult to control drop position accurately</entry>
<entry morerows="1" rowsep="1">◆ 1989 Saito et al USP 4,799,068</entry></row>
<row rowsep="0">
<entry>◆ Crosstalk problems</entry></row></tbody></tgroup>
</table>
</tables><!-- EPO <DP n="47"> -->
<tables id="tabl0011" num="0011">
<table frame="all">
<title><b><u style="single">Drop ejection direction</u></b></title>
<tgroup cols="5">
<colspec colnum="1" colname="col1" colwidth="33mm"/>
<colspec colnum="2" colname="col2" colwidth="32mm"/>
<colspec colnum="3" colname="col3" colwidth="34mm"/>
<colspec colnum="4" colname="col4" colwidth="35mm"/>
<colspec colnum="5" colname="col5" colwidth="34mm"/>
<thead>
<row>
<entry valign="top"><b>Ejection direction</b></entry>
<entry valign="top"><b>Description</b></entry>
<entry valign="top"><b>Advantages</b></entry>
<entry valign="top"><b>Disadvantages</b></entry>
<entry valign="top"><b>Examples</b></entry></row></thead>
<tbody>
<row rowsep="0">
<entry morerows="5" rowsep="1">Edge. ('edge shooter')</entry>
<entry morerows="5" rowsep="1">Ink flow is along the surface of the chip, and ink drops are ejected from the chip edge.</entry>
<entry>◆ Simple construction</entry>
<entry>◆ Nozzles limited to edge</entry>
<entry>◆ Canon Bubblejet 1979 Endo et al GB patent 2,007,162</entry></row>
<row rowsep="0">
<entry>◆ No silicon etching required</entry>
<entry>◆ High resolution is difficult</entry>
<entry>◆ Xerox heater-in-pit 1990 Hawkins et al USP 4,899,181</entry></row>
<row rowsep="0">
<entry>◆ Good heat sinking via substrate</entry>
<entry morerows="3" rowsep="1">◆ Fast color printing requires one print head per color</entry>
<entry morerows="3" rowsep="1">◆ Tone-jet</entry></row>
<row rowsep="0">
<entry>◆ Mechanically strong</entry></row>
<row rowsep="0">
<entry>◆ Ease of chip handing</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Ease of chip handing</entry></row>
<row rowsep="0">
<entry morerows="2" rowsep="1"><b>Surface ('roof shooter')</b></entry>
<entry morerows="2" rowsep="1">Ink flow is along the surface of the chip, and ink drops are ejected from the chip surface, normal to the plane of the chip.</entry>
<entry>◆ No bulk silicon etching required</entry>
<entry morerows="2" rowsep="1">◆ Maximum ink flow is severely restricted</entry>
<entry>◆ Hewlett-Packard TIJ 1982 Vaught et al USP 4,490,728</entry></row>
<row rowsep="0">
<entry>◆ Silicon can make an effective heat sink</entry>
<entry>◆ IJ02, IJ11, IJ12, IJ20</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Mechanical strength</entry>
<entry rowsep="1">◆ IJ22</entry></row>
<row rowsep="0">
<entry morerows="2" rowsep="1"><b>Through chip, forward ('up shooter')</b></entry>
<entry morerows="2" rowsep="1">Ink flow is through the chip, and ink drops are ejected from the front surface of the chip.</entry>
<entry>◆ High ink flow</entry>
<entry morerows="2" rowsep="1">◆ Requires bulk silicon etching</entry>
<entry>◆ Silverbrook, EP 0771 658 A2 and related patent applications</entry></row>
<row rowsep="0">
<entry>◆ Suitable for pagewidth print</entry>
<entry>◆ IJ04, IJ17, IJ18, IJ24</entry></row>
<row>
<entry>◆ High nozzle packing density therefore low manufacturing cost</entry>
<entry>◆ IJ27-IJ45</entry></row><!-- EPO <DP n="48"> -->
<row rowsep="0">
<entry morerows="4" rowsep="1"><b>Through chip, reverse ('down shooter')</b></entry>
<entry morerows="4" rowsep="1">Ink flow is through the chip, and ink drops are ejected from the rear surface of the chip.</entry>
<entry>◆ High ink flow</entry>
<entry>◆ Requires wafer thinning</entry>
<entry>◆ IJ01, IJ03, IJ05, IJ06</entry></row>
<row rowsep="0">
<entry>◆ Suitable for pagewidth print</entry>
<entry morerows="3" rowsep="1">◆ Requires special handling during manufacture</entry>
<entry>◆ IJ07, IJ08, IJ09, IJ10</entry></row>
<row rowsep="0">
<entry morerows="2" rowsep="1">◆ High nozzle packing density therefore low manufacturing cost</entry>
<entry>◆ IJ13, IJ14, IJ15, IJ16</entry></row>
<row rowsep="0">
<entry>◆ IJ19, IJ21, IJ23, IJ25</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ IJ26</entry></row>
<row rowsep="0">
<entry morerows="2" rowsep="1"><b>Through actuator</b></entry>
<entry morerows="2" rowsep="1">Ink flow is through the actuator, which is not fabricated as part of the same substrate as the drive transistors.</entry>
<entry morerows="2" rowsep="1">◆ Suitable for piezoelectric print heads</entry>
<entry>◆ Pagewidth print heads require several thousand connections to drive circuits</entry>
<entry>◆ Epson Stylus</entry></row>
<row rowsep="0">
<entry>◆ Cannot be manufactured in standard CMOS fabs</entry>
<entry morerows="1" rowsep="1">◆ Tektronix hot melt piezoelectric ink jets</entry></row>
<row rowsep="0">
<entry>◆ Complex assembly required</entry></row></tbody></tgroup>
</table>
</tables><!-- EPO <DP n="49"> -->
<tables id="tabl0012" num="0012">
<table frame="all">
<title><b><u style="single">Ink type</u></b></title>
<tgroup cols="5">
<colspec colnum="1" colname="col1" colwidth="34mm"/>
<colspec colnum="2" colname="col2" colwidth="33mm"/>
<colspec colnum="3" colname="col3" colwidth="33mm"/>
<colspec colnum="4" colname="col4" colwidth="33mm"/>
<colspec colnum="5" colname="col5" colwidth="34mm"/>
<thead>
<row>
<entry valign="top"><b>Ink type</b></entry>
<entry valign="top"><b>Description</b></entry>
<entry valign="top"><b>Advantages</b></entry>
<entry valign="top"><b>Disadvantages</b></entry>
<entry valign="top"><b>Examples</b></entry></row></thead>
<tbody>
<row rowsep="0">
<entry morerows="4" rowsep="1"><b>Aqueous, dye</b></entry>
<entry>Water based ink which typically contains: water, dye, surfactant, humectant, and biocide.</entry>
<entry>◆ Environmentally friendly</entry>
<entry>◆ Slow drying</entry>
<entry>◆ Most existing inkjets</entry></row>
<row rowsep="0">
<entry morerows="3" rowsep="1">Modem ink dyes have high water-fastness, light fastness</entry>
<entry morerows="3" rowsep="1">◆ No odor</entry>
<entry>◆ Corrosive</entry>
<entry>◆ All IJ series ink jets</entry></row>
<row rowsep="0">
<entry>◆ Bleeds on paper</entry>
<entry morerows="2" rowsep="1">◆ Silverbrook, EP 0771658 A2 and related patent applications</entry></row>
<row rowsep="0">
<entry>◆ May strikethrough</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Cockles paper</entry></row>
<row rowsep="0">
<entry morerows="4" rowsep="1"><b>Aqueous, pigment</b></entry>
<entry>Water based ink which typically contains: water, pigment, surfactant, humectant, and biocide.</entry>
<entry>◆ Environmentally friendly</entry>
<entry>◆ Slow drying</entry>
<entry>◆ IJ02, IJ04, IJ21, IJ26</entry></row>
<row rowsep="0">
<entry morerows="3" rowsep="1">Pigments have an advantage in reduced bleed, wicking and strikethrough.</entry>
<entry>◆ No odor</entry>
<entry>◆ Corrosive</entry>
<entry>◆ IJ27, IJ30</entry></row>
<row rowsep="0">
<entry>Reduced bleed</entry>
<entry>◆ Pigment may clog nozzles</entry>
<entry>◆ Silverbrook, EP 0771658 A2 and related patent applications</entry></row>
<row rowsep="0">
<entry>◆ Reduced wicking</entry>
<entry>◆ Pigment may clog actuator mechanisms</entry>
<entry>◆ Piezoelectric ink-jets</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ Reduced strikethrough</entry>
<entry rowsep="1">◆ Cockles paper</entry>
<entry rowsep="1">◆ Thermal ink jets (with significant restrictions)</entry></row>
<row rowsep="0">
<entry morerows="1" rowsep="1"><b>Methyl Ethyl Ketone (MEK)</b></entry>
<entry morerows="1" rowsep="1">MEK is a highly volatile solvent used for industrial printing on difficult surfaces such as aluminum cans.</entry>
<entry>◆ Very fast drying</entry>
<entry>◆ Odorous</entry>
<entry morerows="1" rowsep="1">◆ All IJ series ink jets</entry></row>
<row>
<entry>◆ Prints on various substrates such as metals and plastics</entry>
<entry>◆ Flammable</entry></row><!-- EPO <DP n="50"> -->
<row rowsep="0">
<entry morerows="4" rowsep="1"><b>Alcohol (ethanol, 2-butanol, and others)</b></entry>
<entry morerows="4" rowsep="1">Alcohol based inks can be used where the printer must operate at temperatures below the freezing point of water. An example of this is in-camera consumer photographic printing.</entry>
<entry>◆ Fast drying</entry>
<entry>◆ Slight odor</entry>
<entry morerows="4" rowsep="1">◆ All IJ series ink jets</entry></row>
<row rowsep="0">
<entry>◆ Operates at sub-freezing</entry>
<entry morerows="3" rowsep="1">◆ Flammable</entry></row>
<row rowsep="0">
<entry>temperatures</entry></row>
<row rowsep="0">
<entry>◆ Reduced paper cockle</entry></row>
<row>
<entry>◆ Low cost</entry></row>
<row rowsep="0">
<entry morerows="5" rowsep="1"><b>Phase change (hot melt)</b></entry>
<entry morerows="5" rowsep="1">The ink is solid at room temperature, and is melted in the print head before jetting. Hot melt inks are usually wax based, with a melting point around 80 °C. After jetting the ink freezes almost instantly upon contacting the print medium or a transfer roller.</entry>
<entry>◆ No drying time- ink instantly freezes on the print medium</entry>
<entry>◆ High viscosity</entry>
<entry>◆ Tektronix hot melt piezoelectric ink jets</entry></row>
<row rowsep="0">
<entry>◆ Almost any print medium can be used</entry>
<entry>◆ Printed ink typically has a 'waxy' feel</entry>
<entry>◆ 1989 Nowak USP 4,820,346</entry></row>
<row rowsep="0">
<entry>◆ No paper cockle occurs</entry>
<entry>◆ Printed pages may 'block'</entry>
<entry morerows="3" rowsep="1">◆ All IJ series ink jets</entry></row>
<row rowsep="0">
<entry>◆ No wicking occurs</entry>
<entry>◆ Ink temperature may be above the curie point of permanent magnets</entry></row>
<row rowsep="0">
<entry>◆ No bleed occurs</entry>
<entry>◆ Ink heaters consume power</entry></row>
<row rowsep="0">
<entry rowsep="1">◆ No strikethrough occurs</entry>
<entry rowsep="1">◆ Long warm-up time</entry></row>
<row rowsep="0">
<entry morerows="2" rowsep="1"><b>Oil</b></entry>
<entry morerows="2" rowsep="1">Oil based inks are extensively used in offset printing. They have advantages in improved characteristics on paper (especially no wicking or cockle). Oil soluble dies and pigments are required.</entry>
<entry>◆ High solubility medium for some dyes</entry>
<entry>◆ High viscosity: this is a significant limitation for use in inkjets, which usually require a low viscosity. Some short chain and multi-branched oils have a sufficiently low viscosity.</entry>
<entry morerows="2" rowsep="1">◆ All IJ series ink jets</entry></row>
<row rowsep="0">
<entry>◆ Does not cockle paper</entry>
<entry morerows="1" rowsep="1">◆ Slow drying</entry></row>
<row rowsep="0">
<entry>◆ Does not wick through paper</entry></row></tbody></tgroup>
</table>
</tables><!-- EPO <DP n="51"> --></p>
<heading id="h0011"><b><u style="single">Ink Jet Printing</u></b></heading>
<p id="p0049" num="0049">A large number of new forms of ink jet printers have been developed to facilitate alternative ink jet technologies for the image processing and data distribution system. Various combinations of ink jet devices can be included in printer devices incorporated as part of the present invention.<!-- EPO <DP n="52"> --></p>
<heading id="h0012"><b><u style="single">Ink Jet Manufacturing</u></b></heading>
<p id="p0050" num="0050">Further, the present application may utilize advanced semiconductor fabrication techniques in the construction of large arrays of ink jet printers.<!-- EPO <DP n="53"> --></p>
<heading id="h0013"><b><u style="single">Fluid Supply</u></b></heading>
<p id="p0051" num="0051">Further, the present application may utilize an ink delivery system to the ink jet head.</p>
<heading id="h0014"><b><u style="single">MEMS Technology</u></b></heading>
<p id="p0052" num="0052">Further, the present application may utilize advanced semiconductor microelectromechanical techniques in the construction of large arrays of ink jet printers.<!-- EPO <DP n="54"> --></p>
<heading id="h0015"><b><u style="single">IR Technologies</u></b></heading>
<p id="p0053" num="0053">Further, the present application may include the utilization of a disposable camera system.</p>
<heading id="h0016"><b><u style="single">DotCard Technologies</u></b></heading>
<p id="p0054" num="0054">Further, the present application may include the utilization of a data distribution system.<!-- EPO <DP n="55"> --></p>
<heading id="h0017"><b><u style="single">Artcam Technologies</u></b></heading>
<p id="p0055" num="0055">Further, the present application may include the utilization of camera and data processing techniques such as an Artcam type device.<!-- EPO <DP n="56"> --></p>
<p id="p0056" num="0056">It would be appreciated by a person skilled in the art that numerous variations and/or modifications may be made to the present invention as shown in the specific embodiment without departing from the scope of the invention as broadly described. The present embodiment is, therefore, to be considered in all respects to be illustrative and not restrictive.</p>
</description><!-- EPO <DP n="57"> -->
<claims id="claims01" lang="en">
<claim id="c-en-01-0001" num="0001">
<claim-text>An inkjet nozzle arrangement (910) comprising:
<claim-text>a nozzle chamber (912) having an ink ejection port (911) for the ejection of ink from the nozzle chamber,</claim-text>
<claim-text>an ink supply reservoir (913) for supplying ink to said nozzle chamber (912); and</claim-text>
<claim-text>a magnetic actuator (925) located between said nozzle chamber (912) and said ink supply reservoir (913) for ejecting ink in response to externally supplied magnetic pulse cycles;</claim-text>
<b>characterized by</b><br/>
a blocking means (920) for blocking movement of said magnetic actuator (925) when it is desired not to eject ink from said nozzle chamber (912) in a magnetic pulse cycle.</claim-text></claim>
<claim id="c-en-01-0002" num="0002">
<claim-text>An ink jet nozzle arrangement (910) as claimed in claim 1 wherein said blocking means comprises a thermal actuator (922,924) having a moveable end protuberance which is moveable to a position blocking the path of movement of said magnetic actuator.</claim-text></claim>
<claim id="c-en-01-0003" num="0003">
<claim-text>An ink jet nozzle arrangement (910) as claimed in any of claims 1 or 2 wherein said magnetic actuator (925) includes an end protuberance (927) designed to engage said blocking means (920) upon movement of said actuator.</claim-text></claim>
<claim id="c-en-01-0004" num="0004">
<claim-text>An ink jet nozzle arrangement (910) as claimed in any of claims 1 to 3 wherein said magnetic actuator (925) is affixed to an adjacent wall of said nozzle chamber by means of two bendable strip portions (940) which allow bending movement of said magnetic actuator upon activation by said externally supplied magnetic pulse cycles.</claim-text></claim>
<claim id="c-en-01-0005" num="0005">
<claim-text>An ink jet nozzle arrangement (910) as claimed in claim 2 wherein said thermal actuator comprises substantially two arms affixed to a substrate, a first arm (922) having a thin serpentine structure encased in a material having a high coefficient of thermal expansion and a second arm (924) comprising a thicker arm having a tapered thin portion near the end connecting to said substrate so as to concentrate any bending of said actuator (925) at a point close to said substrate.</claim-text></claim>
<claim id="c-en-01-0006" num="0006">
<claim-text>An ink jet nozzle arrangement (910) as claimed in any of claims 1 to 5 wherein said blocking means (920) is located in a cavity having a low degree of fluid flow through the cavity.</claim-text></claim>
<claim id="c-en-01-0007" num="0007">
<claim-text>An ink jet nozzle arrangement (910) as claimed in claim 6 wherein said blocking means is located in a cavity (928) having a low degree of fluid flow through the cavity and the serpentine arm is located alongside an inner wall of said cavity.</claim-text></claim>
<claim id="c-en-01-0008" num="0008">
<claim-text>An ink jet nozzle arrangement (910) as claimed in any of claims 1 to 7 wherein the nozzle is constructed via fabrication of a silicon wafer utilizing semiconductor fabrication techniques.</claim-text></claim>
<claim id="c-en-01-0009" num="0009">
<claim-text>An ink jet nozzle arrangement (910) as claimed in any of claims 1 to 8 wherein portions of said actuators include a silicon nitride covering as required so as to insulate and passivate them from adjacent portions.<!-- EPO <DP n="58"> --></claim-text></claim>
<claim id="c-en-01-0010" num="0010">
<claim-text>An ink jet nozzle arrangement (910) as claimed in any of claims 1 to 9 wherein said nozzle chamber (912) is formed from high density low pressure plasma etching of a silicon substrate.</claim-text></claim>
<claim id="c-en-01-0011" num="0011">
<claim-text>An array of nozzles comprising a plurality of ink jet nozzle arrangements as defined in any one of the preceding claims.</claim-text></claim>
</claims><!-- EPO <DP n="59"> -->
<claims id="claims02" lang="de">
<claim id="c-de-01-0001" num="0001">
<claim-text>Tintenstrahl-Düsenanordnung (910), umfassend:
<claim-text>eine Düsenkammer (912) mit einer Tintenausstoßöffnung (911) zum Ausstoßen von Tinte aus der Düsenkammer;</claim-text>
<claim-text>einen Tintenvorratsbehälter (913) zum Zuführen von Tinte zu der Düsenkammer (912); und</claim-text>
<claim-text>ein magnetisches Stellorgan (925), das zwischen der Düsenkammer (912) und dem Tintenvorratsbehälter (913) sitzt, um Tinte im Ansprechen auf von außen zugeführte Magnetimpulszyklen auszustoßen;</claim-text>
<b>gekennzeichnet durch</b><br/>
eine Blockiereinrichtung (920) zum Blockieren einer Bewegung des magnetischen Stellorgans (925), wenn es gewünscht ist, während eines Magnetimpulszyklus keine Tinte aus der Düsenkammer (912) auszustoßen.</claim-text></claim>
<claim id="c-de-01-0002" num="0002">
<claim-text>Tintenstrahl-Düsenanordnung (910) nach Anspruch 1, wobei die Blockiereinrichtung ein thermisches Stellorgan (922, 924) mit einem beweglichen endseitigen Vorsprung umfasst, der in eine Position bewegt werden kann, in der er die Bewegungsbahn des magnetischen Stellorgans versperrt.</claim-text></claim>
<claim id="c-de-01-0003" num="0003">
<claim-text>Tintenstrahl-Düsenanordnung (910) nach einem der Ansprüche 1 oder 2, wobei das magnetische Stellorgan (925) einen endseitigen Vorsprung (927) umfasst, der so ausgelegt ist, dass er bei Bewegung des Stellorgans an der Blockiereinrichtung (920) angreift.</claim-text></claim>
<claim id="c-de-01-0004" num="0004">
<claim-text>Tintenstrahl-Düsenanordnung (910) nach einem der Ansprüche 1 bis 3, wobei das magnetische Stellorgan (925) an einer angrenzenden Wand der Düsenkammer mittels zweier biegbarer Streifenabschnitte (940) befestigt ist, die eine Biegebewegung des magnetischen Stellorgans bei Aktivierung durch die von außen zugeführten Magnetimpulszyklen ermöglichen.<!-- EPO <DP n="60"> --></claim-text></claim>
<claim id="c-de-01-0005" num="0005">
<claim-text>Tintenstrahl-Düsenanordnung (910) nach Anspruch 2, wobei das thermische Stellorgan im Wesentlichen zwei an einem Substrat befestigte Arme umfasst, wobei ein erster Arm (922) eine dünne, gewundene Struktur hat, die in ein Material mit einem hohen Wärmeausdehnungskoeffizienten eingebettet ist, und ein zweiter Arm (924) einen dickeren Arm mit einem sich verjüngenden dünnen Abschnitt nahe dem an das Substrat angeschlossenen Ende umfasst, um jegliche Biegung des Stellorgans (925) an einem dem Substrat nahe liegenden Punkt zu konzentrieren.</claim-text></claim>
<claim id="c-de-01-0006" num="0006">
<claim-text>Tintenstrahl-Düsenanordnung (910) nach einem der Ansprüche 1 bis 5, wobei die Blockiereinrichtung (920) in einer Aussparung sitzt, die einen geringen Grad an Fluidströmung durch sie hindurch aufweist.</claim-text></claim>
<claim id="c-de-01-0007" num="0007">
<claim-text>Tintenstrahl-Düsenanordnung (910) nach Anspruch 6, wobei die Blockiereinrichtung in einer Aussparung (928) sitzt, die einen geringen Grad an Fluidströmung durch sie hindurch aufweist, und der gewundene Arm entlang einer Innenwand der Aussparung angeordnet ist.</claim-text></claim>
<claim id="c-de-01-0008" num="0008">
<claim-text>Tintenstrahl-Düsenanordnung (910) nach einem der Ansprüche 1 bis 7, wobei die Düse über Herstellung eines Siliziumwafers unter Anwendung von Halbleiter-Herstellungstechniken aufgebaut wird.</claim-text></claim>
<claim id="c-de-01-0009" num="0009">
<claim-text>Tintenstrahl-Düsenanordnung (910) nach einem der Ansprüche 1 bis 8, wobei Abschnitte der Stellorgane nach Bedarf eine Beschichtung aus Siliziumnitrid umfassen, um sie von angrenzenden Abschnitten zu isolieren und zu passivieren.</claim-text></claim>
<claim id="c-de-01-0010" num="0010">
<claim-text>Tintenstrahl-Düsenanordnung (910) nach einem der Ansprüche 1 bis 9, wobei die Düsenkammer (912) durch ein bei hoher Dichte und niedrigem Druck stattfindenden Plasmaätzen eines Siliziumsubstrats gebildet wird.</claim-text></claim>
<claim id="c-de-01-0011" num="0011">
<claim-text>Düsenfeld mit mehreren Tintenstrahl-Düsenanordnungen nach einem der vorhergehenden Ansprüche.</claim-text></claim>
</claims><!-- EPO <DP n="61"> -->
<claims id="claims03" lang="fr">
<claim id="c-fr-01-0001" num="0001">
<claim-text>Agencement de buse de jet d'encre (910) comprenant:
<claim-text>une chambre de buse (912) ayant un port d'éjection d'encre (911) pour l'éjection d'encre depuis la chambre de buse ;</claim-text>
<claim-text>un réservoir de fourniture d'encre (913) pour fournir de l'encre à ladite chambre de buse (912) ; et</claim-text>
<claim-text>un actionneur magnétique (925) situé entre ladite chambre de buse (912) et ledit réservoir de fourniture d'encre (913) pour éjecter de l'encre en réponse à des cycles d'impulsion magnétique fournis de manière externe ;</claim-text>
<b>caractérisé par</b><br/>
des moyens de blocage (920) pour bloquer le mouvement dudit actionneur magnétique (925) lorsqu'il est souhaité de ne pas éjecter de l'encre depuis ladite chambre de buse (912) dans un cycle d'impulsion magnétique.</claim-text></claim>
<claim id="c-fr-01-0002" num="0002">
<claim-text>Agencement de buse de jet d'encre (910) comme revendiqué dans la revendication 1 dans lequel lesdits moyens de blocage comportent un actionneur thermique (922, 924) ayant une protubérance d'extrémité mobile qui est mobile vers une position bloquant le trajet de mouvement dudit actionneur magnétique.</claim-text></claim>
<claim id="c-fr-01-0003" num="0003">
<claim-text>Agencement de buse de jet d'encre (910) comme revendiqué dans l'une quelconque des revendications 1 ou 2, dans lequel ledit actionneur magnétique (925) inclut une protubérance d'extrémité (927) conçue pour venir en prise avec lesdits moyens de blocage (920) sur mouvement dudit actionneur.</claim-text></claim>
<claim id="c-fr-01-0004" num="0004">
<claim-text>Agencement de buse de jet d'encre (910) comme revendiqué dans l'une quelconque des revendications 1 à 3 dans lequel actionneur magnétique (925) est collé à une paroi adjacente de ladite chambre de buse au moyen de deux parties de bandes cintrables (940) qui autorisent un mouvement de cintrage dudit actionneur magnétique sur<!-- EPO <DP n="62"> --> activation par lesdits cycles d'impulsion magnétique fournis de manière externe.</claim-text></claim>
<claim id="c-fr-01-0005" num="0005">
<claim-text>Agencement de buse de jet d'encre (910) comme revendiqué dans la revendication 2 dans lequel ledit actionneur thermique comporte sensiblement deux bras collés à un substrat, un premier bras (922) ayant une structure serpentine fine encastrée dans un matériau ayant un coefficient d'extension thermique élevée, et un deuxième bras (924) comprenant un arbre plus épais ayant une portion fine amincie près de l'extrémité reliant audit substrat de manière à concentrer un quelconque cintrage dudit actionneur (925) à un point proche dudit substrat.</claim-text></claim>
<claim id="c-fr-01-0006" num="0006">
<claim-text>Agencement de buse de jet d'encre (910) comme revendiqué dans l'une quelconque des revendications 1 à 5 dans lequel les moyens de blocage (920) sont situés dans une cavité ayant un degré de circulation de fluide bas à travers la cavité.</claim-text></claim>
<claim id="c-fr-01-0007" num="0007">
<claim-text>Agencement de buse de jet d'encre (910) comme revendiqué dans la revendication 6 dans lequel ledit moyen de blocage sont situés dans une cavité (928) ayant un degré de circulation de fluide bas à travers la cavité et le bras à serpentine est situé le long d'une paroi interne de ladite cavité.</claim-text></claim>
<claim id="c-fr-01-0008" num="0008">
<claim-text>Agencement de buse de jet d'encre (910) comme revendiqué dans l'une quelconque des revendications 1 à 7 dans lequel ladite buse est construite par fabrication d'une galette de silicium utilisant des techniques de fabrication de semi-conducteurs.</claim-text></claim>
<claim id="c-fr-01-0009" num="0009">
<claim-text>Agencement de buse de jet d'encre (910) comme revendiqué dans l'une quelconque des revendications 1 à 8 dans lequel des parties desdits actionneurs incluent un revêtement au nitrure de silicium comme nécessaire pour les isoler et les passiver des parties adjacentes.<!-- EPO <DP n="63"> --></claim-text></claim>
<claim id="c-fr-01-0010" num="0010">
<claim-text>Agencement de buse de jet d'encre (910) comme revendiqué dans l'une quelconque des revendications 1 à 9 dans lequel ladite chambre de buse (912) est formée à partir d'une attaque au plasma à haute densité et basse pression d'un substrat de silicium.</claim-text></claim>
<claim id="c-fr-01-0011" num="0011">
<claim-text>Matrice de buse comprenant une pluralité d'agencements de buse de jet d'encre comme défini dans l'une quelconque des revendications précédentes.</claim-text></claim>
</claims><!-- EPO <DP n="64"> -->
<drawings id="draw" lang="en">
<figure id="f0001" num=""><img id="if0001" file="imgf0001.tif" wi="165" he="211" img-content="drawing" img-format="tif"/></figure><!-- EPO <DP n="65"> -->
<figure id="f0002" num=""><img id="if0002" file="imgf0002.tif" wi="165" he="227" img-content="drawing" img-format="tif"/></figure><!-- EPO <DP n="66"> -->
<figure id="f0003" num=""><img id="if0003" file="imgf0003.tif" wi="164" he="221" img-content="drawing" img-format="tif"/></figure><!-- EPO <DP n="67"> -->
<figure id="f0004" num=""><img id="if0004" file="imgf0004.tif" wi="165" he="221" img-content="drawing" img-format="tif"/></figure><!-- EPO <DP n="68"> -->
<figure id="f0005" num=""><img id="if0005" file="imgf0005.tif" wi="165" he="215" img-content="drawing" img-format="tif"/></figure><!-- EPO <DP n="69"> -->
<figure id="f0006" num=""><img id="if0006" file="imgf0006.tif" wi="165" he="220" img-content="drawing" img-format="tif"/></figure><!-- EPO <DP n="70"> -->
<figure id="f0007" num=""><img id="if0007" file="imgf0007.tif" wi="165" he="216" img-content="drawing" img-format="tif"/></figure><!-- EPO <DP n="71"> -->
<figure id="f0008" num=""><img id="if0008" file="imgf0008.tif" wi="165" he="176" img-content="drawing" img-format="tif"/></figure><!-- EPO <DP n="72"> -->
<figure id="f0009" num=""><img id="if0009" file="imgf0009.tif" wi="165" he="158" img-content="drawing" img-format="tif"/></figure>
</drawings>
</ep-patent-document>
