(19)
(11) EP 1 522 086 A2

(12)

(88) Date of publication A3:
17.02.2005

(43) Date of publication:
13.04.2005 Bulletin 2005/15

(21) Application number: 03721708.0

(22) Date of filing: 15.04.2003
(51) International Patent Classification (IPC)7: H01J 37/32
(86) International application number:
PCT/US2003/011781
(87) International publication number:
WO 2003/090247 (30.10.2003 Gazette 2003/44)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

(30) Priority: 16.04.2002 US 124191

(71) Applicant: Applied Materials, Inc.
Santa Clara,California 95054 (US)

(72) Inventors:
  • SHANNON, Steven C.
    San Mateo, CA 94401 (US)
  • HOFFMAN, Daniel, J.
    Saratoga, CA 95070 (US)
  • BARNES, Michael
    San Ramon, CA 94583 (US)
  • LABLANC, Lee
    Sunnyvale CA 94085 (US)

(74) Representative: Zimmermann, Gerd Heinrich et al
Zimmermann & Partner,P.O. Box 33 09 20
80069 München
80069 München (DE)

   


(54) METHOD AND APPARATUS FOR ROUTING HARMONICS IN A PLASMA TO GROUND WITHIN A PLASMA ENCHANCED SEMICONDUCTOR WAFER PROCESSING CHAMBER