<?xml version="1.0" encoding="UTF-8"?>
<!DOCTYPE ep-patent-document PUBLIC "-//EPO//EP PATENT DOCUMENT 1.4//EN" "ep-patent-document-v1-4.dtd">
<ep-patent-document id="EP03750808B8W1" file="EP03750808W1B8.xml" lang="fr" country="EP" doc-number="1523771" kind="B8" correction-code="W1" date-publ="20100512" status="c" dtd-version="ep-patent-document-v1-4">
<SDOBI lang="fr"><B000><eptags><B001EP>ATBECHDEDKESFRGBGRITLILUNLSEMCPTIESI....FIRO..CY..TRBGCZEEHU..SK....................................</B001EP><B003EP>*</B003EP><B005EP>J</B005EP><B007EP>DIM360 Ver 2.15 (14 Jul 2008) -  2999001/0</B007EP></eptags></B000><B100><B110>1523771</B110><B120><B121>FASCICULE DE BREVET EUROPEEN CORRIGE</B121></B120><B130>B8</B130><B132EP>B1</B132EP><B140><date>20100512</date></B140><B150><B151>W1</B151><B153>73</B153><B155><B1551>de</B1551><B1552>Bibliographie</B1552><B1551>en</B1551><B1552>Bibliography</B1552><B1551>fr</B1551><B1552>Bibliographie</B1552></B155></B150><B190>EP</B190></B100><B200><B210>03750808.2</B210><B220><date>20030715</date></B220><B240><B241><date>20041206</date></B241><B242><date>20080611</date></B242></B240><B250>fr</B250><B251EP>fr</B251EP><B260>fr</B260></B200><B300><B310>0209118</B310><B320><date>20020718</date></B320><B330><ctry>FR</ctry></B330></B300><B400><B405><date>20100512</date><bnum>201019</bnum></B405><B430><date>20050420</date><bnum>200516</bnum></B430><B450><date>20100310</date><bnum>201010</bnum></B450><B452EP><date>20091007</date></B452EP><B480><date>20100512</date><bnum>201019</bnum></B480></B400><B500><B510EP><classification-ipcr sequence="1"><text>H01L  21/762       20060101AFI20040206BHEP        </text></classification-ipcr></B510EP><B540><B541>de</B541><B542>VERFAHREN ZUR ÜBERTRAGUNG EINER DÜNNEN, ELEKTRISCH AKTIVEN SCHICHT</B542><B541>en</B541><B542>METHOD FOR TRANSFERRING AN ELECTRICALLY ACTIVE THIN LAYER</B542><B541>fr</B541><B542>PROCEDE DE TRANSFERT D'UNE COUCHE MINCE ELECTRIQUEMENT ACTIVE.</B542></B540><B560><B561><text>WO-A-02/37556</text></B561><B561><text>US-A- 6 150 239</text></B561><B562><text>HUGONNARD-BRUYERE E ET AL: "Electrical and physical behavior of SiC layers on insulator (SiCOI)" INTERNATIONAL CONFERENCE ON SILICON CARBIDE AND RELATED MATERIALS, ICSRM'99, RESEARCH TRIANGLE PARK, NC, USA, 10-15 OCT. 1999, vol. 338-342, pt.1, pages 715-718, XP008017315 Materials Science Forum, 2000, Trans Tech Publications, Switzerland ISSN: 0255-5476</text></B562><B562><text>HUGONNARD-BRUYERE E ET AL: "Defect Studies in Epitaxial SiC-6H Layers on Insulator (SiCOI)" MICROELECTRONIC ENGINEERING, ELSEVIER PUBLISHERS BV., AMSTERDAM, NL, vol. 48, no. 1-4, septembre 1999 (1999-09), pages 277-280, XP004193305 ISSN: 0167-9317</text></B562><B562><text>HUGONNARD-BRUYERE E ET AL: "Deep level defects in Himplanted 6H-SiC epilayers and in silicon carbide on insulator structures" MATERIALS SCIENCE AND ENGINEERING B, ELSEVIER SEQUOIA, LAUSANNE, CH, vol. 61-62, 30 juillet 1999 (1999-07-30), pages 382-388, XP004363371 ISSN: 0921-5107</text></B562><B562><text>GREGORY R B ET AL: "The effects of damage on hydrogen-implant-induced thin-film separation from bulk silicon carbide" WIDE-BANDGAP SEMICONDUCTORS FOR HIGH-POWER, HIGH-FREQUENCY AND HIGH-TEMPERATURE APPLICATIONS - 1999. SYMPOSIUM, WIDE-BANDGAP SEMICONDUCTORS FOR HIGH-POWER, HIGH-FREQUENCY AND HIGH-TEMPERATURE APPLICATIONS - 1999. SYMPOSIUM, SAN FRANCISCO, CA, USA, 5-, pages 33-38, XP001040858 1999, Warrendale, PA, USA, Mater. Res. Soc, USA</text></B562><B562><text>BINARI S C ET AL: "H, He, and N implant isolation of n-type GaN" JOURNAL OF APPLIED PHYSICS, AMERICAN INSTITUTE OF PHYSICS. NEW YORK, US, vol. 78, no. 5, 1 septembre 1995 (1995-09-01), pages 3008-3011, XP002185242 ISSN: 0021-8979</text></B562></B560></B500><B700><B720><B721><snm>DI CIOCCIO, Léa</snm><adr><str>418 chemin de Labis</str><city>F-38330 SAINT ISMIER</city><ctry>FR</ctry></adr></B721><B721><snm>LETERTRE, Fabrice</snm><adr><str>33 quai Jongkind</str><city>F-38000 GRENOBLE</city><ctry>FR</ctry></adr></B721><B721><snm>HUGONNARD-BRUYERE, Elsa</snm><adr><str>Chemin du Vallon</str><city>F-13710 FUVEAU</city><ctry>FR</ctry></adr></B721></B720><B730><B731><snm>COMMISSARIAT A L'ENERGIE ATOMIQUE</snm><iid>10391490</iid><irf>B14034.3 JL</irf><adr><str>25, rue Leblanc 
Bâtiment le "Ponant D"</str><city>75015 Paris</city><ctry>FR</ctry></adr></B731><B731><snm>S.O.I.Tec Silicon on Insulator Technologies</snm><iid>10197950</iid><irf>B14034.3 JL</irf><adr><str>Parc Technologique des Fontaines 
Chemin des Franques</str><city>38190 Bernin</city><ctry>FR</ctry></adr></B731></B730><B740><B741><snm>Poulin, Gérard</snm><sfx>et al</sfx><iid>09200071</iid><adr><str>Brevalex 
3, rue du Docteur Lancereaux</str><city>75008 Paris</city><ctry>FR</ctry></adr></B741></B740></B700><B800><B840><ctry>AT</ctry><ctry>BE</ctry><ctry>BG</ctry><ctry>CH</ctry><ctry>CY</ctry><ctry>CZ</ctry><ctry>DE</ctry><ctry>DK</ctry><ctry>EE</ctry><ctry>ES</ctry><ctry>FI</ctry><ctry>FR</ctry><ctry>GB</ctry><ctry>GR</ctry><ctry>HU</ctry><ctry>IE</ctry><ctry>IT</ctry><ctry>LI</ctry><ctry>LU</ctry><ctry>MC</ctry><ctry>NL</ctry><ctry>PT</ctry><ctry>RO</ctry><ctry>SE</ctry><ctry>SI</ctry><ctry>SK</ctry><ctry>TR</ctry></B840><B860><B861><dnum><anum>FR2003002225</anum></dnum><date>20030715</date></B861><B862>fr</B862></B860><B870><B871><dnum><pnum>WO2004010494</pnum></dnum><date>20040129</date><bnum>200405</bnum></B871></B870></B800></SDOBI>
</ep-patent-document>
