(19)
(11) EP 1 529 126 A2

(12)

(88) Date of publication A3:
29.04.2004

(43) Date of publication:
11.05.2005 Bulletin 2005/19

(21) Application number: 03788347.7

(22) Date of filing: 08.08.2003
(51) International Patent Classification (IPC)7C25D 1/00
(86) International application number:
PCT/US2003/024747
(87) International publication number:
WO 2004/016829 (26.02.2004 Gazette 2004/09)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
Designated Extension States:
AL LT LV MK

(30) Priority: 16.08.2002 US 403954 P
15.07.2003 US 620042

(71) Applicant: Atofina Chemicals, Inc.
Philadelphia, PA 19103-3222 (US)

(72) Inventor:
  • MARTYAK, Nicholas, Michael
    Doylestown, PA 18901 (US)

(74) Representative: Granet, Pierre et al
ARKEMADépartement Propriété Industrielle4-8, cours Michelet,La Défense 10
92091 Paris La Défense Cedex
92091 Paris La Défense Cedex (FR)

   


(54) ELECTROLYTIC COPPER PLATING SOLUTIONS