(19)
(11) EP 1 529 310 A2

(12)

(88) Date of publication A3:
24.02.2005

(43) Date of publication:
11.05.2005 Bulletin 2005/19

(21) Application number: 02797318.9

(22) Date of filing: 13.12.2002
(51) International Patent Classification (IPC)7H01L 23/48, H01L 21/4763
(86) International application number:
PCT/US2002/040020
(87) International publication number:
WO 2003/054928 (03.07.2003 Gazette 2003/27)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SI SK TR

(30) Priority: 13.12.2001 US 339734 P
08.11.2002 US 290616
08.11.2002 US 290682

(71) Applicant: International Business Machines Corporation
Armonk, NY 10504 (US)

(72) Inventors:
  • FORNOF, Ann, R.,c/o IBM United Kingdom Limited
    Winchester, Hampshire SO21 2JN (GB)
  • HEDRICK, Jeffrey, C.
    Montvalle, NJ 07645 (US)
  • LEE, Kang-Wook
    Yorktown Heights, NY 10598 (US)
  • MALONE, Kelly
    Poughkeepsie, NY 12601 (US)
  • TYBERG, Christy, S.
    Mahopac, NY 10541 (US)

(74) Representative: Litherland, David Peter 
IBM United Kingdom LimitedIntellectual Property DepartmentHursley Park
Winchester,Hampshire SO21 2JN
Winchester,Hampshire SO21 2JN (GB)

   


(54) POROUS LOW-K DIELECTRIC INTERCONNECT STRUCTURES