(19)
(11) EP 1 547 141 A2

(12)

(88) Date of publication A3:
21.05.2004

(43) Date of publication:
29.06.2005 Bulletin 2005/26

(21) Application number: 03754585.2

(22) Date of filing: 15.09.2003
(51) International Patent Classification (IPC)7H01L 21/48
(86) International application number:
PCT/US2003/028919
(87) International publication number:
WO 2004/027823 (01.04.2004 Gazette 2004/14)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
Designated Extension States:
AL LT LV MK

(30) Priority: 17.09.2002 US 411590 P
02.08.2003 US 632549
02.08.2003 US 632568
02.08.2003 US 632552
02.08.2003 US 632553
02.08.2003 US 632550
02.08.2003 US 632551

(71) Applicant: Chippac, Inc.
Fremont,California 94538 (US)

(72) Inventor:
  • KARNEZOS, Marcos
    Palo Alto, CA 94301 (US)

(74) Representative: Haines, Miles John 
D Young & Co120 Holborn
London EC1N 2DY
London EC1N 2DY (GB)

   


(54) SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING WIRE BOND INTERCONNECTION BETWEEN STACKED PACKAGES