POST-CMP CLEANING OF SEMICONDUCTOR WAFER SURFACES USING A COMBINATION OF AQUEOUS AND CRYOGENIC CLEANING TECHNIQUES - Patent 1554081

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EP 1 554 081 A1

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(43)	Date of publication:
	20.07.2005 Bulletin 2005/29

(21)	Application number: 03708894.5

(22)	Date of filing: 28.01.2003

(51)	International Patent Classification (IPC)⁷: B24B 1/00

(86)	International application number:
	PCT/US2003/002643

(87)	International publication number:
	WO 2004/014604 (19.02.2004 Gazette 2004/08)

(84)	Designated Contracting States:
	AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT SE SI SK TR
	Designated Extension States:
	AL LT LV MK RO

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Priority:

09.08.2002 US 215859

(71)	Applicant: BOC, INC.
	Murray HillNew Jersey 07974 (US)

(72)	Inventors:
	BANERJEE, Souvik Fremont, CA 94636 (US) CHUNG, Harlan, Forrest Castro Valley, CA 94552 (US)

(74)	Representative: Wickham, Michael
	The BOC Group plc,Chertsey Road Windlesham,Surrey GU20 6HJ Windlesham,Surrey GU20 6HJ (GB)

(54)	POST-CMP CLEANING OF SEMICONDUCTOR WAFER SURFACES USING A COMBINATION OF AQUEOUS AND CRYOGENIC CLEANING TECHNIQUES