| (19) |
 |
|
(11) |
EP 1 555 335 A3 |
| (12) |
EUROPEAN PATENT APPLICATION |
| (88) |
Date of publication A3: |
|
20.06.2007 Bulletin 2007/25 |
| (43) |
Date of publication A2: |
|
20.07.2005 Bulletin 2005/29 |
| (22) |
Date of filing: 14.01.2005 |
|
| (51) |
International Patent Classification (IPC):
|
|
| (84) |
Designated Contracting States: |
|
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI
SK TR |
|
Designated Extension States: |
|
AL BA HR LV MK YU |
| (30) |
Priority: |
16.01.2004 JP 2004009284
|
| (71) |
Applicant: Adeka Corporation |
|
Arawaka-ku
Tokyo (JP) |
|
| (72) |
Inventors: |
|
- Kobayashi, Hiromitsu,
Asahi Denka Co., Ltd.
Arakawa-ku
Tokyo (JP)
- Nito, Hirohisa,
Asahi Denka Co., Ltd.
Arakawa-ku
Tokyo (JP)
- Kawamata, Hiromasa,
Asahi Denka Co., Ltd.
Arakawa-ku
Tokyo (JP)
|
| (74) |
Representative: Hamer, Christopher K. et al |
|
Mathys & Squire
120 Holborn
London EC1N 2SQ
London EC1N 2SQ (GB) |
|
| |
|
| (54) |
Additive for plating bath |
(57) A plating bath additive and a plating bath using the said additive are provided,
which plating bath contains a hydroxyalkanesulfonic acid and which even when applied
to an electronic part such as a semiconductor device does not give rise to a problem
such as circuit-to-circuit insulation becoming defective. The plating bath additive
contains a hydroxyalkanesulfonic acid as a main component and has an alkali metal
content of less than 0.05 mass% relative to the hydroxyalkanesulfonic acid. The plating
bath incorporates the said additive therein.