......DE....FRGB....................................................................................JBDM Ver 0.1.63 (23 May 2017) - 2999001/01555692CORRECTED EUROPEAN PATENT SPECIFICATIONB8B120190403W173deBibliographieenBibliographyfrBibliographieEP04258189.2200412292011031520110414enenen200343161920031225JP2019040320191420050720200529201901232019042018080120190403201914H01L 23/40 20060101AFI20050405BHEP H01L 25/11 20060101ALI20050405BHEP deBefestigungsvorrichtung für elektronische BauelementeenFixing device for electronic componentsfrDispositif de fixation pour composants électroniquesEP-A2- 1 047 293DE-A1- 3 331 207DE-A1- 3 440 334DE-A1- 4 141 650FR-A3- 2 654 156JP-A- 9 153 691JP-A- H11 298 177US-B1- 6 587 344Sugiyama, Masanoric/o Aisin Seiki K.K., I.P.D. 1, Asahi-machi 2-chomeKariya-shi, Aichi-ken 448-8650JPOkumura, Masaoc/o Matsuo Ind. Inc. 27-1 Ida, Kitazaki-choObu-shi, Aichi-KenJPAISIN SEIKI KABUSHIKI KAISHA100073470A101.029.001, Asahi-machi 2-chomeKariya-shi, Aichi-ken 448-8650JPSerjeants LLP100060021Dock 75 Exploration DriveLeicester, LE4 5NUGBDEFRGB20110202201105