METHODS FOR FORMING COPPER INTERCONNECT STRUCTURES BY CO-PLATING OF NOBLE METALS AND STRUCTURES FORMED THEREBY - Patent 1567695

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EP 1 567 695 A1

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(43)	Date of publication:
	31.08.2005 Bulletin 2005/35

(21)	Application number: 03781909.1

(22)	Date of filing: 06.11.2003

(51)	International Patent Classification (IPC)⁷: C25D 3/58, C25D 7/12, C23C 18/48

(86)	International application number:
	PCT/US2003/036064

(87)	International publication number:
	WO 2004/053202 (24.06.2004 Gazette 2004/26)

(84)	Designated Contracting States:
	AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
	Designated Extension States:
	AL LT LV MK

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Priority:

05.12.2002 US 313760

(71)	Applicant: INTEL CORPORATION
	Santa Clara, CA 95052 (US)

(72)	Inventor:
	DUBIN, Valery Portland, OR 97229 (US)

(74)	Representative: Goddar, Heinz J. et al
	FORRESTER & BOEHMERT Pettenkoferstrasse 20-22 80336 München 80336 München (DE)

(54)	METHODS FOR FORMING COPPER INTERCONNECT STRUCTURES BY CO-PLATING OF NOBLE METALS AND STRUCTURES FORMED THEREBY