(19)
(11) EP 1 600 516 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
14.12.2005 Bulletin 2005/50

(43) Date of publication A2:
30.11.2005 Bulletin 2005/48

(21) Application number: 05017190.9

(22) Date of filing: 16.11.1998
(51) International Patent Classification (IPC)7C22C 9/04, C22F 1/08
(84) Designated Contracting States:
BE DE FI FR GB IT SE

(30) Priority: 12.10.1998 JP 28859098

(62) Application number of the earlier application in accordance with Art. 76 EPC:
98953071.2 / 1045041

(71) Applicant: Sambo Copper Alloy Co., Ltd
Osaka 590-0906 (JP)

(72) Inventor:
  • Oishi, Keiichiro
    Sakai-shi Osaka 590-0906 (JP)

(74) Representative: Brown, Fraser Gregory James et al
fJ Cleveland 40-43 Chancery Lane
London WC2A 1JQ
London WC2A 1JQ (GB)

   


(54) Lead-free, free-cutting copper alloys


(57) The present invention relates to lead free, free cutting copper alloys and methods of their manufacture. In particular, the present invention is directed to a lead-free, free-cutting copper alloy which comprises 70 to 80 percent, by weight, of copper; 1.8 to 3.5 percent, by weight, of silicon; and at least one element selected from among 0.3 to 3.5 percent, by weight, of tin, 1.0 to 3.5 percent, by weight, of aluminium, and 0.02 to 0.25 percent, by weight, of phosphorous; and the remaining percent, by weight, of zinc and wherein the metal structure of the free cutting copper alloy has at least one phase selected from the γ (gamma) phase and the κ (kappa) phase.







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