(19)
(11) EP 1 610 076 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
14.02.2007 Bulletin 2007/07

(43) Date of publication A2:
28.12.2005 Bulletin 2005/52

(21) Application number: 05013389.1

(22) Date of filing: 21.06.2005
(51) International Patent Classification (IPC): 
F25B 13/00(2006.01)
 F25B 47/00(2006.01)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR
Designated Extension States:
AL BA HR LV MK YU

(30) Priority: 24.06.2004 JP 2004186230
02.06.2005 JP 2005163347

(71) Applicant: SAMSUNG ELECTRONICS CO., LTD.
Suwon-si, Gyeonggi-do (KR)

(72) Inventor:
  • Nakajima, Hidemichi
    Minoo-Shi Osaka (JP)

(74) Representative: Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät 
Maximilianstrasse 58
80538 München
80538 München (DE)

   


(54) Cooling cycle apparatus and method of operating the same


(57) A cooling cycle apparatus and a method of operating the same that is capable of preventing frost or ice formation at the lower part of an outdoor heat exchanger (8) without damage to hot line function and improving heating capacity. A refrigerant pipe (13) is connected between an indoor expansion valve (6) and an outdoor expansion valve (7). The refrigerant pipe (13) is branched into a hot line pipe (a first pipe) (13A), which extends through a part of the outdoor heat exchanger (8), and a bypass pipe (a second pipe) (13B), which does not extend through the outdoor heat exchanger (8). The refrigerant pipe is designed such that a predetermined circulating amount of the refrigerant can be divided through the hot line pipe (13A) and the bypass pipe (13B) at a predetermined ratio.







Search report