(19)
(11) EP 1 615 261 B8

(12) CORRECTED EUROPEAN PATENT SPECIFICATION
Note: Bibliography reflects the latest situation

(15) Correction information:
Corrected version no 1 (W1 B1)

(48) Corrigendum issued on:
18.09.2019 Bulletin 2019/38

(45) Mention of the grant of the patent:
08.05.2019 Bulletin 2019/19

(21) Application number: 04720720.4

(22) Date of filing: 15.03.2004
(51) International Patent Classification (IPC): 
H01L 21/67(2006.01)
H01L 21/687(2006.01)
 H01L 21/673(2006.01)
(86) International application number:
PCT/JP2004/003442
(87) International publication number:
WO 2004/090967 (21.10.2004 Gazette 2004/43)

(54)

SEMICONDUCTOR WAFER HEAT TREATMENT JIG

HALBLEITERWAFERWÄRMEBEHANDLUNGS-EINSPANNVORRICHTUNG

BÂTI DE TRAITEMENT THERMIQUE DE PLAQUETTE À SEMICONDUCTEUR

(84) Designated Contracting States:
DE FR

(30) Priority: 02.04.2003 JP 2003099709

(43) Date of publication of application:
11.01.2006 Bulletin 2006/02

(73) Proprietor: SUMCO Corporation
Tokyo 105-8634 (JP)

(72) Inventor:
  • ADACHI, Naoshi, SUMCO Corporation
    Tokyo 105-8634 (JP)

(74) Representative: Fédit-Loriot 
38, avenue Hoche
75008 France
75008 France (FR)


(56) References cited: : 
EP-A1- 0 614 212
JP-A- 10 270 369
JP-A- 2001 284 275
US-B1- 6 264 467
 WO-A1-02/065510
JP-A- 10 321 543
US-A- 5 514 439
   
       
    Note: Within nine months from the publication of the mention of the grant of the European patent, any person may give notice to the European Patent Office of opposition to the European patent granted. Notice of opposition shall be filed in a written reasoned statement. It shall not be deemed to have been filed until the opposition fee has been paid. (Art. 99(1) European Patent Convention).