<?xml version="1.0" encoding="UTF-8"?><!DOCTYPE ep-patent-document PUBLIC "-//EPO//EP PATENT DOCUMENT 1.0//EN" "ep-patent-document-v1-0.dtd"><ep-patent-document id="EP04731014A1" file="04731014.9" lang="de" country="EP" doc-number="1622977" kind="A1" date-publ="20060208" status="n" dtd-version="ep-patent-document-v1-01"><SDOBI lang="de"><B000><eptags><B001EP>ATBECHDEDKESFRGBGRITLILUNLSEMCPTIESI....FIRO..CY..TRBGCZEEHUPLSK................</B001EP><B003EP>*</B003EP><B005EP>X</B005EP><B007EP>DIM360 (Ver 1.5  21 Nov 2005) -  1100000/0 1710000/0</B007EP></eptags></B000><B100><B110>1622977</B110><B130>A1</B130><B140><date>20060208</date></B140><B190>EP</B190></B100><B200><B210>04731014.9</B210><B220><date>20040504</date></B220><B240><B241><date>20051205</date></B241></B240><B250>de</B250><B251EP>de</B251EP><B260>de</B260></B200><B300><B310>03010131</B310><B320><date>20030505</date></B320><B330><ctry>EP</ctry></B330></B300><B400><B405><date>20060208</date><bnum>200606</bnum></B405><B430><date>20060208</date><bnum>200606</bnum></B430></B400><B500><B510EP><classification-ipcr sequence="1"><text>C08L  63/00        19850101AFI20041119BHEP        </text></classification-ipcr><classification-ipcr sequence="2"><text>C08G  59/50        19740701ALI20041119BHEP        </text></classification-ipcr><classification-ipcr sequence="3"><text>C08G  59/62        19740701ALI20041119BHEP        </text></classification-ipcr></B510EP><B540><B541>de</B541><B542>MANNICHBASEN-ENTHALTENDE EPOXIDHARZZUSAMMENSETZUNGEN GEEIGNET ZUR ANWENDUNG BEI HOHEN TEMPERATUREN</B542><B541>en</B541><B542>EPOXY RESIN COMPOSITIONS CONTAINING MANNICH BASES, SUITABLE FOR HIGH-TEMPERATURE APPLICATIONS</B542><B541>fr</B541><B542>COMPOSITIONS DE RESINE EPOXY CONTENANT DES BASES DE MANNICH, APPROPRIEES POUR DES APPLICATIONS A HAUTE TEMPERATURE</B542></B540></B500><B700><B710><B711><snm>Sika Technology AG</snm><iid>04274630</iid><irf>2003-003EP</irf><adr><str>Zugerstrasse 50</str><city>6340 Baar</city><ctry>CH</ctry></adr></B711></B710><B720><B721><snm>WIGGER, Thomas</snm><adr><str>Lielistrasse 3</str><city>CH-8904 Aesch bei Birmensdorf</city><ctry>CH</ctry></adr></B721></B720><B740><B741><snm>Isler, Jörg</snm><iid>09212341</iid><adr><str>C/o Sika Technology AG, 
Tüffenwies 16 
Postfach</str><city>8048 Zürich</city><ctry>CH</ctry></adr></B741></B740></B700><B800><B840><ctry>AT</ctry><ctry>BE</ctry><ctry>BG</ctry><ctry>CH</ctry><ctry>CY</ctry><ctry>CZ</ctry><ctry>DE</ctry><ctry>DK</ctry><ctry>EE</ctry><ctry>ES</ctry><ctry>FI</ctry><ctry>FR</ctry><ctry>GB</ctry><ctry>GR</ctry><ctry>HU</ctry><ctry>IE</ctry><ctry>IT</ctry><ctry>LI</ctry><ctry>LU</ctry><ctry>MC</ctry><ctry>NL</ctry><ctry>PL</ctry><ctry>PT</ctry><ctry>RO</ctry><ctry>SE</ctry><ctry>SI</ctry><ctry>SK</ctry><ctry>TR</ctry></B840><B860><B861><dnum><anum>EP2004050698</anum></dnum><date>20040504</date></B861><B862>de</B862></B860><B870><B871><dnum><pnum>WO2004099312</pnum></dnum><date>20041118</date><bnum>200447</bnum></B871></B870></B800></SDOBI></ep-patent-document>