(19)
(11) EP 1 631 863 A2

(12)

(88) Date of publication A3:
10.02.2005

(43) Date of publication:
08.03.2006 Bulletin 2006/10

(21) Application number: 04731579.1

(22) Date of filing: 07.05.2004
(51) International Patent Classification (IPC): 
G03F 7/039(1990.01)
G03F 7/004(1990.01)
(86) International application number:
PCT/EP2004/004867
(87) International publication number:
WO 2004/102272 (25.11.2004 Gazette 2004/48)
(84) Designated Contracting States:
DE FR

(30) Priority: 16.05.2003 US 440542

(71) Applicant: AZ Electronic Materials USA Corp.
Somerville, NJ 08876 (US)

(72) Inventors:
  • LEE, Sangho
    Bridgewater, NJ 08807 (US)
  • RAHMAN, Dalil, M.
    Flemington, NJ 08822 (US)
  • MCKENZIE, Douglas
    Easten, PA 18045 (US)
  • KIM, Woo-Kyu
    Bedminster, NJ 07921 (US)
  • PADMANABAN, Munirathna
    Bridgewater, NJ 08807 (US)
  • OBERLANDER, Joseph, E.
    Phillipsburg, NJ 08865 (US)
  • TOUKHY, Medhat, A.
    Flemington, NJ 08822 (US)

(74) Representative: Isenbruck, Günter 
Isenbruck Bösl Hörschler Wichmann Huhn Patentanwälte Theodor-Heuss-Anlage 12
D-68165 Mannheim
D-68165 Mannheim (DE)

   


(54) PHOTORESIST COMPOSITION FOR DEEP UV AND IMAGING PROCESS THEREOF