| (19) |
 |
|
(11) |
EP 1 643 006 A3 |
| (12) |
EUROPEAN PATENT APPLICATION |
| (88) |
Date of publication A3: |
|
06.09.2006 Bulletin 2006/36 |
| (43) |
Date of publication A2: |
|
05.04.2006 Bulletin 2006/14 |
| (22) |
Date of filing: 21.09.2005 |
|
| (51) |
International Patent Classification (IPC):
|
|
| (84) |
Designated Contracting States: |
|
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE
SI SK TR |
|
Designated Extension States: |
|
AL BA HR MK YU |
| (30) |
Priority: |
29.09.2004 FI 20041256
|
| (71) |
Applicant: Outokumpu Copper Products Oy |
|
02200 Espoo (FI) |
|
| (72) |
Inventor: |
|
- Korpinen, Tapio
28100 Pori (FI)
|
| (74) |
Representative: Zipse + Habersack |
|
Wotanstrasse 64
80639 München
80639 München (DE) |
|
| |
|
| (54) |
Method for the fabrication of a multi-layered patina and said multi-layaered patina |
(57) The invention relates to a method for forming a patina surface on a substrate, which
is preferably made of copper or copper alloy. According to the method, the patina
surface is formed on top of the surface of the substrate material in at least two
different layers of corrosive patination material, of which the colour and/or composition
differ from each other. The invention also relates to the patina, which is formed
as at least two layers.