(19)
(11) EP 1 647 860 A8

(12) CORRECTED EUROPEAN PATENT APPLICATION
published in accordance with Art. 158(3) EPC

(15) Correction information:
Corrected version no 1 (W1 A1)

(48) Corrigendum issued on:
19.07.2006 Bulletin 2006/29

(43) Date of publication:
19.04.2006 Bulletin 2006/16

(21) Application number: 04745596.9

(22) Date of filing: 04.06.2004
(51) International Patent Classification (IPC): 
G03F 7/085(1990.01)
G03F 7/022(1990.01)
(86) International application number:
PCT/JP2004/007820
(87) International publication number:
WO 2004/109404 (16.12.2004 Gazette 2004/51)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR

(30) Priority: 09.06.2003 JP 2003163206

(71) Applicant: AZ Electronic Materials USA Corp.
Somerville, NJ 08876 (US)

(72) Inventors:
  • KOBAYASHI, Satoshi, c/o Clariant(Japan)K.K.
    Ogasa-gun, Shizuoka 437-1496 (JP)
  • Shin, Dong-Myung, c/o Clariant AZ(Korea) Ltd.
    Ansung-city, Kyungki-do 456-840 (KR)
  • TAKEDA, Takashi, c/o Clariant(Japan)K.K.
    Ogasa-gun, Shizuoka 437-1496 (JP)

(74) Representative: Isenbruck, Günter 
Isenbruck, Bösl, Hörschler, Wichmann, Huhn Patentanwälte Theodor-Heuss-Anlage 12
68165 Mannheim
68165 Mannheim (DE)

   


(54) ADHESION IMPROVER FOR PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE RESIN COMPOSITION CONTAINING SAME


(57) An adhesion-improving agent comprising a sulfonyl group substituted nitrogen compound represented by the below described general formulae (1) to (5) or a thiadiazole compound represented by the below described general formulae (6) to (8) and a photosensitive resin composition containing an alkali-soluble resin and a photosensitizer,comprisingsaid adhesion-improving agent.