(19)
(11) EP 1 649 502 A1

(12)

(43) Date of publication:
26.04.2006 Bulletin 2006/17

(21) Application number: 04777705.7

(22) Date of filing: 08.07.2004
(51) International Patent Classification (IPC): 
H01L 21/288(1974.07)
C25D 3/38(1974.07)
H01L 21/768(1995.01)
(86) International application number:
PCT/US2004/021771
(87) International publication number:
WO 2005/008759 (27.01.2005 Gazette 2005/04)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR

(30) Priority: 08.07.2003 US 616097

(71) Applicant: APPLIED MATERIALS, INC.
Santa Clara, California 95054 (US)

(72) Inventors:
  • SUN, Zhi-Wen
    San Jose, CA 95136 (US)
  • HE, Renren
    Sunnyvale, CA 94087 (US)
  • WANG, You
    Cupertino, CA 95014 (US)
  • WANG, Michael X.
    Palo Alto, CA 94306 (US)

(74) Representative: Bayliss, Geoffrey Cyril 
BOULT WADE TENNANT, Verulam Gardens 70 Gray's Inn Road
London WC1X 8BT
London WC1X 8BT (GB)

   


(54) MULTIPLE-STEP ELECTRODEPOSITION PROCESS FOR DIRECT COPPER PLATING ON BARRIER METALS