(19)
(11)
EP 1 652 233 A1
(12)
(43)
Date of publication:
03.05.2006
Bulletin 2006/18
(21)
Application number:
03818224.2
(22)
Date of filing:
08.08.2003
(51)
International Patent Classification (IPC):
H01L
23/48
(1974.07)
H01L
29/40
(1974.07)
H01L
21/48
(1974.07)
H01L
23/52
(1974.07)
H01L
21/44
(1974.07)
H01L
21/50
(1974.07)
(86)
International application number:
PCT/US2003/024706
(87)
International publication number:
WO 2005/018000
(
24.02.2005
Gazette 2005/08)
(84)
Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
(71)
Applicant:
IRVINE SENSORS CORPORATION
Costa Mesa, CA 92626-4573 (US)
(72)
Inventor:
EIDE, Floyd, K.
Huntington Beach, CA 92649 (US)
(74)
Representative:
Hill, Justin John et al
McDermott Will & Emery UK LLP 7 Bishopsgate
London EC2N 3AR
London EC2N 3AR (GB)
(54)
STACKABLE LAYERS CONTAINING BALL GRID ARRAY PACKAGES