(19)
(11) EP 1 663 655 A2

(12)

(88) Date of publication A3:
12.05.2005

(43) Date of publication:
07.06.2006 Bulletin 2006/23

(21) Application number: 04786480.6

(22) Date of filing: 09.08.2004
(51) International Patent Classification (IPC): 
B41J 2/16(1990.01)
(86) International application number:
PCT/US2004/025745
(87) International publication number:
WO 2005/016649 (24.02.2005 Gazette 2005/08)
(84) Designated Contracting States:
DE FR GB

(30) Priority: 13.08.2003 US 640067

(71) Applicant: Hewlett-Packard Development Company, L.P.
Houston, Texas 77070 (US)

(72) Inventors:
  • HORN, Barbara
    Eugene, OR 97402 (US)
  • KIRBY, Keith
    Albany, OR 97321 (US)
  • HOLMES, Sam
    Corvallis, OR 97330 (US)
  • KHAVARI, Mehgran
    Corvallis, OR 97330 (US)
  • RIVAS, Rio
    Corvallis, OR 97330 (US)
  • TRUNK, Gerald, G.
    Monmouth, Oregon 97361 (US)
  • BERGSTROM, Deanna, J.
    Corvallis, OR 97330 (US)
  • PHAM, Chon
    Corvallis, OR 97330 (US)

(74) Representative: Durville, Guillaume 
Hewlett Packard Espanola, S.L. Legal Dept. Avda. Graells 501
Sant Cugat del Valles 08174 Barcelona
Sant Cugat del Valles 08174 Barcelona (ES)

   


(54) METHODS AND SYSTEMS FOR CONDITIONING SLOTTED SUBSTRATES